JPS6130863A - Contact sensor unit - Google Patents
Contact sensor unitInfo
- Publication number
- JPS6130863A JPS6130863A JP15207184A JP15207184A JPS6130863A JP S6130863 A JPS6130863 A JP S6130863A JP 15207184 A JP15207184 A JP 15207184A JP 15207184 A JP15207184 A JP 15207184A JP S6130863 A JPS6130863 A JP S6130863A
- Authority
- JP
- Japan
- Prior art keywords
- sensor unit
- contact sensor
- unit
- case
- slope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000006243 chemical reaction Methods 0.000 claims abstract description 11
- 239000011159 matrix material Substances 0.000 abstract description 4
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 11
- 230000000694 effects Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 150000004770 chalcogenides Chemical class 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Landscapes
- Facsimile Heads (AREA)
Abstract
Description
【発明の詳細な説明】
〔技術分野〕
本発明は高さの低い密着センサユニットに関するO
〔従来技術〕
従来、ファクシミリ装置、複写機等の読取部においては
光電変換手段としてCCDを用いた1次元フォトセンサ
アレイが用いられた。しかるにこの1次元フォトセンサ
アレイではシリコン単結晶の大きさに限度があシ長尺化
したフォトセンサアレイを製作することは困難であった
。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a contact sensor unit with a low height. A photosensor array was used. However, in this one-dimensional photosensor array, there is a limit to the size of the silicon single crystal, and it is difficult to manufacture a long photosensor array.
この為最近カルコゲナイド、CdS * Cd5Se
、非晶質シリコン層等の光導電層上に受光部となる間隙
を形成せしめ、対向した一対の金属電極から成るブレー
ナ型の光導電型フォトセンサよりなる長尺ラインセンサ
が考案された。For this reason, recently chalcogenide, CdS * Cd5Se
A long line sensor has been devised, which is a Brehner-type photoconductive photosensor consisting of a pair of opposing metal electrodes, with a gap serving as a light receiving section formed on a photoconductive layer such as an amorphous silicon layer.
第3図は上述した長尺ラインセンサを用いた密着センサ
ユニット102の断面図を示すもので、図に示す如くユ
ニント筐体104下部に光源たるLEDアレイ108が
設けられ、該LEDアレイ108から照射された光が原
稿(図ボせず〕で反射されその反射光がセルフォックレ
ンズアレイ(商標名二日本板硝子)等の集束性光伝送体
アレイ106によってユニットa体104上に設けられ
ガラス基板に作製された光電変換素子アレイ基&110
上に集光され原稿上の情報が電気信号に変換てれる。FIG. 3 shows a cross-sectional view of the contact sensor unit 102 using the long line sensor described above. As shown in the figure, an LED array 108 as a light source is provided at the bottom of the unit housing 104, and the LED array 108 emits light. The reflected light is reflected by the document (not shown), and the reflected light is provided on the unit a body 104 by a focusing light transmitter array 106 such as a SELFOC lens array (trade name: Nippon Sheet Glass), and then transferred to a glass substrate. Fabricated photoelectric conversion element array group &110
Light is focused on the document and the information on the document is converted into electrical signals.
ユニント筐体104上部にはマトリックス配線基板11
2も装着されておシ、光電変換素子アレイ基板110と
マ) IJソックス線基板112とが電気的に接続され
る。更に光電変挨素子アレイ基板110及びマトリック
ス配線基板112上方に駆動部たるICi 18及び電
気部品124が設けられた基板126が設けられる。尚
H1及びWlは@着センサユニット102の高さ及び巾
を表わす。A matrix wiring board 11 is mounted on the upper part of the unit housing 104.
2 is also attached, and the photoelectric conversion element array substrate 110 and the IJ sock line substrate 112 are electrically connected. Furthermore, a substrate 126 is provided above the photoelectric conversion element array substrate 110 and the matrix wiring substrate 112, on which an ICi 18 serving as a driving section and an electric component 124 are provided. Note that H1 and Wl represent the height and width of the @ arrival sensor unit 102.
しかるにこのよう々密着センサユニットにおいては高さ
方向の長さが長いことが密着センサユニットの小型化の
障害となっていた。However, the long length of the contact sensor unit in the height direction has been an obstacle to miniaturization of the contact sensor unit.
そこで本発明の目的は前記欠点を解消すべく高さ方向の
長さが短く、ユニット組立作業の容易な密着センサユニ
ットを提供することにある。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a contact sensor unit which has a short length in the height direction and which is easy to assemble.
前記目的を達成すべく本発明は光電変換素子アレイとI
Cによる駆動部とがユニット筐体の異なる面に設けられ
ることを特徴とする。In order to achieve the above object, the present invention includes a photoelectric conversion element array and an I
The drive unit according to C is provided on different surfaces of the unit housing.
〔実施例〕
以下図面に基づいて本発明の実施例を具体的かつ詳細に
説明する。[Examples] Examples of the present invention will be described in detail below based on the drawings.
第1図は本発明の第1実施例に係る密着センサユニット
2の縦断面図である。以下で示す実施例において同一機
能を果たす部所には同一の番号を符しである。本実施例
ではアルミ材で加工成形されたユニット筐体4に集光レ
ンズ系たるセルフォックレンズアレイ6を貫設し、該セ
ルフォックレンズアレイ6の両側で前記ユニット筐体4
の下面部に光源たるLEDアレイ8を対向して設ける。FIG. 1 is a longitudinal sectional view of a contact sensor unit 2 according to a first embodiment of the present invention. In the embodiments shown below, parts that perform the same functions are designated by the same numbers. In this embodiment, a SELFOC lens array 6, which is a condensing lens system, is installed through a unit housing 4 formed of aluminum material, and the unit housing 4 is mounted on both sides of the SELFOC lens array 6.
An LED array 8 serving as a light source is provided on the lower surface of the LED array 8 to face each other.
ユニノ)筺体4上面でセルフォックレンズアレイ6から
の光が受光できる位置に光電変換手段たる光電変換素子
アレイ基板10が設けられ、又同じくユニット筐体4上
面に前記光電変換素子アレイ基板ioと電気的に接続さ
れたマトリックス配線基板12が設けられる。A photoelectric conversion element array substrate 10 serving as a photoelectric conversion means is provided at a position on the upper surface of the unit housing 4 at a position where light from the SELFOC lens array 6 can be received. A matrix wiring board 12 is provided.
ユニット筺体4の側面には傾斜部14が設けられ、この
傾斜部14に駆動部たるIC部18を有するフレキシブ
ルケーブル基板(以下フレキ基板と称す)16を固着さ
せる。このフレキ基板16はフレキシブルケーブル20
によって光電変換素子アレイ基板10及びマ) IJソ
ックス線基板12に電気的に接続されるものである。A sloped part 14 is provided on the side surface of the unit housing 4, and a flexible cable board (hereinafter referred to as a flexible board) 16 having an IC part 18 serving as a driving part is fixed to this sloped part 14. This flexible board 16 is a flexible cable 20
It is electrically connected to the photoelectric conversion element array substrate 10 and the IJ sock line substrate 12.
本実施例の場合従来の密着センサユニットに比して巾W
2かやや広がる( Wl > Wt ) ものの、高
さH2がかなシ低く (H2< Ht )なるので極め
て薄型の密着センサユニットが実現できる。In this example, the width W is smaller than that of the conventional contact sensor unit.
Although the height H2 is slightly wider (Wl > Wt), the height H2 is much lower (H2 < Ht), so an extremely thin contact sensor unit can be realized.
第2図は本発明第2実飽例に係る密着センサユニットプ
の縦断面図であシ、本第2実施例の特徴とするところは
、第1実施例と比してLEDアレイ8をセルフォックレ
ンズアレイ6の片側のみに設け、LEDアレイ8に対抗
する他方のユニット筐体4の第2傾斜部22の傾斜を第
1実施例よシ大きくして密着センサユニット2の巾W3
を小さくしたことにある。FIG. 2 is a longitudinal sectional view of a contact sensor unit according to a second practical example of the present invention. The width W3 of the contact sensor unit 2 is provided only on one side of the Fock lens array 6, and the inclination of the second inclined portion 22 of the other unit housing 4 opposing the LED array 8 is made larger than in the first embodiment.
This is due to the fact that it is made smaller.
本第2実施例によれば従来の密着センサユニット2に比
して巾W3は略同じ(Wl =wt )で高さがかなシ
低く(Hs<Hx)なル極めて薄型のコンパクトな密着
センサユニットが実現できる。According to the second embodiment, compared to the conventional contact sensor unit 2, the width W3 is approximately the same (Wl = wt) and the height is slightly lower (Hs<Hx), making it an extremely thin and compact contact sensor unit. can be realized.
以上詳細かつ具体的に説明した如く本発明によれは以下
に示す効果を奏する。As described above in detail and specifically, the present invention provides the following effects.
(1) 密着センサユニットの高さを低くすることが
できる為密着センサユニットの小型化を図れる。(1) Since the height of the contact sensor unit can be reduced, the contact sensor unit can be made smaller.
(2) フレキ基板の引き廻し方に鋭角な曲げが無く
、密着センサユニット組立作業上容易であシ、かつ信頼
性の高い密着センサユニットが得られる。(2) There is no sharp bend in the way the flexible substrate is routed, making it easy to assemble the contact sensor unit, and providing a highly reliable contact sensor unit.
第1図及び第2図は本発明の第゛】及び第2実施例に係
る密涜センサユニットの断面図、第3図は従来の密着セ
ンサユニットの断面図である。
図において
2・・・礼′着センサユニット、4・ユニット筐体、6
・・・セルフメックレンズアレイ、lO・・・114換
素子アレイ基板、18・・ICである。1 and 2 are cross-sectional views of a contact sensor unit according to the first and second embodiments of the present invention, and FIG. 3 is a cross-sectional view of a conventional contact sensor unit. In the figure, 2. Arrival sensor unit, 4. Unit housing, 6.
...Self-MEC lens array, lO...114 conversion element array substrate, 18...IC.
Claims (1)
を駆動する駆動部がユニット筐体に設けられた密着セン
サユニットにおいて;前記光電変換手段と前記駆動部と
が前記ユニット筐体の異なる面に設けられることを特徴
とする密着センサユニット。(1) In a close-contact sensor unit in which a light source, a condensing lens system, a photoelectric conversion means, and a drive section for driving these are provided in a unit housing; the photoelectric conversion means and the drive section are located in different units of the unit housing. A contact sensor unit characterized by being provided on a surface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15207184A JPS6130863A (en) | 1984-07-24 | 1984-07-24 | Contact sensor unit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15207184A JPS6130863A (en) | 1984-07-24 | 1984-07-24 | Contact sensor unit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6130863A true JPS6130863A (en) | 1986-02-13 |
Family
ID=15532416
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15207184A Pending JPS6130863A (en) | 1984-07-24 | 1984-07-24 | Contact sensor unit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6130863A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5532942A (en) * | 1991-07-08 | 1996-07-02 | Shin-Etsu Chemical Co., Ltd. | Automatic apparatus for inspecting powdery product |
-
1984
- 1984-07-24 JP JP15207184A patent/JPS6130863A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5532942A (en) * | 1991-07-08 | 1996-07-02 | Shin-Etsu Chemical Co., Ltd. | Automatic apparatus for inspecting powdery product |
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