JPS61291615A - Base material for electrical and electronic equipment laminates impregnated with epoxy resin composition - Google Patents

Abstract

PURPOSE:To provide the titled composition of outstanding heat and moisture resistances, internal plasticity, etc., suitable for insulating materials for electric and electronic parts, comprising, as essential component, specific dicyclopentadiene-phenol-modified epoxy resin. CONSTITUTION:The objective composition comprising, as essential component, a dicyclopentadiene-phenol-modified epoxy resin of formula (R is H or 1.9C alkyl; n is 0-15) (e.g., dicyclopentadiene-p-cresol-modified epoxy resin). This resin can easily be prepared by polymerization between dicyclopentadiene and a phenol followed by subjecting to glycidyl-modified reaction.

Description

Detailed Description of the Invention [Field of Industrial Application] This invention provides an epoxy resin composition suitable for insulating materials for electrical and electronic parts, particularly excellent in heat resistance, moisture resistance, internal plasticity, etc. -Regarding an epoxy resin composition characterized by containing a phenol-modified epoxy resin as an essential component.

[Problems to be solved by conventional techniques and inventions] In recent years, the development of electrical and electronic devices has been remarkable, and they have been incorporated into household appliances, automobiles, etc. other than computers. Epoxy resin compositions such as epoxy resin molding materials and epoxy resin laminates are mainly used for insulating materials, protective materials and exterior materials for electrical and electronic equipment, as well as substrates for mounting electrical and electronic equipment. Recent demands for electrical and electronic equipment include the spread of small computers (microcomputers and personal computers), the miniaturization of VTRs, and the reduction in weight of automobiles, as evidenced by the need for smaller, lighter, and more resistant to environmental changes, as well as lower costs. be.

These demands are also reflected in the thinner and lower cost of insulating materials, protective materials, and exterior materials for electrical and electronic equipment, as well as substrates, etc., and the epoxy resin compositions (molding materials and laminates) used in these applications are becoming more and more popular. ), it has become necessary to contribute to improvements in heat resistance, moisture resistance, and internal plasticity, as well as cost reduction or rationalization of processing.

Normal epoxy resins such as bisphenol A type epoxy resin and phenol novolac type epoxy resin have excellent individual properties such as heat resistance and moisture resistance, but their internal plasticity is insufficient, making it difficult to develop a well-balanced epoxy resin. It was wanted.

[Means to solve problems]

As a result of extensive research to solve the above problems, the inventors of the present invention have discovered that the epoxy resin composition described below is a well-balanced epoxy resin composition that has better heat resistance, moisture resistance, and internal plasticity than conventional ones. It was discovered that the composition is a resin composition.

That is, the present invention provides a dicyclopentadiene/phenol-modified epoxy resin [I] represented by the general formula [I] [wherein R is a hydrogen atom or an alkyl group having 1 to 9 carbon atoms,
n represents an integer of 0 to 15. This is an epoxy resin composition characterized by containing ] as an essential component.

The dicyclopentadiene/phenol-modified epoxy resin, which is an essential component of the present invention, is produced by polymerizing dicyclopentadiene and phenols, and then by a glycidylation reaction. The degree of polymerization of the resin is 0 to 15. The degree of polymerization can be adjusted depending on the epoxy resin composition. Containing a dicyclopentadiene derivative can improve the moisture resistance of the epoxy resin composition and impart internal plasticity. Furthermore, by including phenols, heat resistance and moisture resistance can be further improved. Further, conventionally known epoxy resins, such as phenol novolac type epoxy resins, talesol novolac type epoxy resins, bisphenol type epoxy resins, alicyclic epoxy resins, etc., can be used in combination depending on the purpose.

In this epoxy resin composition, in addition to the above-mentioned essential components, a phenol novolac type resin and other known curing agents such as organic acid anhydrides and amine compounds are used as optional components. Also, curing accelerators such as imidazole compounds and tertiary amine compounds; flame retardants such as natural waxes, petroleum waxes, metal salts of linear fatty acids, antimony trioxide, and brominated epoxy resins; carbon black, etc. Colorant:
Surface treating agents such as silane coupling agents such as γ-aminopropyltrimethoxysilane, fillers such as nisilica powder, talc, calcium carbonate, and inorganic fibers may be added and blended as necessary. It is also possible to impregnate a cloth-like or mat-like base material such as glass fiber, asbestos fiber, carbon fiber, or synthetic fiber, and if necessary, after air drying, heat treatment can be performed.

As for the blending ratio of the above essential components and optional components, the amount of curing agent per 100 parts by weight of dicyclopentadiene/phenol-modified epoxy resin, which is an essential component, is sufficient to cure the resin, usually 10 to 90 parts by weight. This is the intermediate range.

;Example〕 This will be specifically explained below using Examples and Comparative Examples.

Examples 1 to 4, Comparative Example 1 (formulation example) Basic resin dicyclopentadiene/p-cresol modified epoxy resin, D CE-400 ortho-cresol novolac type epoxy resin OCN Bisphenol type epoxy resin BAE curing agent dicyandiazide DICA phenol novolac Resin PN and tertiary amine (curing accelerator) are finely pulverized and mixed at an equivalent ratio of 1/110.1 ■Cure on thermal decomposition initiation temperature monitor IC by differential thermal analysis Leak current at 0150℃ ■Moisture resistance (POT ) was measured. The results are shown in Table-1.

Table 1 Examples 5 to 9, Comparative Example 2 (Application example to molding material) 70 parts of fused silica powder, 30 parts of epoxy resin, 0.
A molding material was prepared by kneading 15 parts of the molding material, 0.5 parts of a surface treatment agent, and 0.5 parts of a mold release agent. The properties of these molding materials were investigated in terms of fluid Percoll hardness, glass transition point, heat distortion temperature, PCT reliability test volume resistivity, and coefficient of linear expansion.

The results are shown in Table-2.

〔Effect of the invention〕

As described above, the present invention provides an epoxy resin composition suitable for an insulating material for electrical and electronic parts, which has excellent heat resistance, moisture resistance, and internal plasticity.

1. Indication of the case 1985 Patent Application No. 133717 2. Name of the invention Epoxy resin composition 3. Person making the amendment Relationship with the case Patent applicant address Tokyo 1-4-5 Marunouchi, Chiyoda-ku, Miyako
Name (234) Sanyo Kokusaku Pulp Co., Ltd. 4, Agent address: 16 Kanda Kita Jorimono-cho, Chiyoda-ku, Tokyo
101 Ei Building 3rd Floor Amendment Contents 1: In the 3rd line of page 6 of the specification tube, "air drying" was corrected to "drying."

2. In the first column from the top and fifth column from the left of Table 2 on page 9 of the specification, the word "Percoll" has been corrected to "Percoll hardness."

Claims (1)

[Claims] (1) As an epoxy resin, dicyclopentadiene/phenol-modified epoxy resin represented by the general formula [I] ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ [ I ] (In the formula, R is a hydrogen atom or has a carbon number of 1 to 9 an alkyl group,
n represents an integer of 0 to 15. ] An epoxy resin composition characterized by having as an essential component.