JPS61288490A - Aligned mounting of semiconductor element - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for aligning and mounting a large number of semiconductor elements on a substrate by positioning them on their corresponding bonding pads.

(Prior Art) Conventionally, arrays in which a large number of semiconductor elements, such as light emitting elements, are arranged on a substrate have been used in printers, facsimile machines, or other devices. A semiconductor element alignment and mounting method has been proposed for positioning and aligning semiconductor elements (hereinafter also referred to as chips) on respective dedicated adhesive pads provided on a substrate (for example, document: Japanese Patent Publication No. 59-375).
No. 77 and Nikkei Electronics (June 7, 1982)
There is a method using a device that applies the principle disclosed in PTES ~ 202). However, with the mounting method using such a device, the size of the chip to be mounted is larger than a certain level. Furthermore, the positioning accuracy was not sufficient.

Therefore, in Japanese Patent Application No. 60-59320 filed by the same applicant, a method for aligning and mounting semiconductor devices was proposed, which allows accurate positioning regardless of the size of the devices to be mounted.

This method will be briefly explained with reference to FIGS. 5 to 8.

In FIG. 5, reference numeral 11 denotes a substrate, on which a large number of mounting adhesive pads 12 for mounting, for example, 36 elements are formed in the direction in which the elements, that is, the chips are aligned. A silver thread conductive adhesive 13 is supplied to the pad 12 by, for example, a printing method. 14 is a wiring pattern.

FIG. 6 is a perspective view schematically showing an example of a previously proposed positioning abutment jig for aligning elements on this substrate 11.

The illustrated jig includes a base portion 15, thin first and second positioning plates 113 and 1 which are sequentially stacked and fixed on the base portion 15.
7 and a thick presser plate 18 fixed on the upper side thereof with a fixing device 19 such as a screw, and a substrate fixing fitting 20 for fixing the substrate 11 when it is set. These base portion 15, positioning plate 18.17
And the presser plate 18 is formed of stainless steel material, for example.

This abutting jig has a base portion 15 on which the board 11 is mounted.
, a side surface 21 for achieving positional accuracy in the linear direction of element alignment, and a side surface 22 for fixing the first element for alignment.

FIG. 7 is a perspective view showing the state in which the substrate 11 is set on the abutment jig, and the substrate 11 is set on the jig using the fixture 20.

FIG. 8 is a perspective view of the main parts of the jig, schematically showing a state in which elements are aligned and mounted on the substrate 11. -Example: 1mm x 3
．． A side surface 21 and a fixed side surface that provide positional accuracy in the linear direction of the jig with the element for the first element 23 in alignment, showing a case where 36 elements with dimensions of 5 mm x 0.25 mm are aligned and mounted on a straight line. 22 to position them.

Next, the second and third elements 24, 25, etc. are sequentially mounted. Prior to this mounting, the first element 23 and the second element 24
For example, 30 JLm to ensure the required distance between
A spacer 2B such as an aluminum wire with a diameter of
1 direction, spacer 2B and positioned element 2
3 in the direction of the side surface 22. In this way, each element of the lower order is provided with spacers 27, 2811, etc. and mounted by this pressing method.

After positioning each element in this way, it is placed in a constant temperature layer stabilized at 150° C. and heated for 30 minutes, thereby curing the silver thread conductive adhesive 13 and bonding the substrate 11 and the elements 23, 24, 25,
... and fix it.

Thereafter, the substrate 11 is cooled, the abutment jig is removed, and the spacers 2B and 27.28.phi. are removed or treated appropriately to remain between the elements.

When the elements are mounted in this manner, the mounting accuracy is ±501 Lm in the linear direction positional accuracy, and the mounting can be performed with an interval of 30 Bm±74 m.

(Problem to be Solved by the Invention) However, in the method of mounting a semiconductor element, that is, a chip, using an element abutment jig having such a configuration, the abutment jig and the spacer are separate. For,
Delicate and difficult operations such as setting fine spacers with a diameter of 30 pm between chips each time and removing spacers sandwiched between chips as necessary are required, which increases the number of steps and manufacturing costs. There was a problem with hanging.

An object of the present invention is to provide a semiconductor device mounting method that allows devices to be easily aligned and mounted on a substrate with high precision without requiring these difficult operations.

(Means for Solving the Problem) In order to achieve this object, according to the present invention, when aligning and mounting a large number of semiconductor elements on a substrate by positioning them on their corresponding adhesive pads, the elements are aligned and mounted. Using an alignment mounting jig in which linear first and second positioning parts for positioning in the direction and a direction perpendicular thereto, and a spacer for separating each element to be mounted are integrally formed, This is a method in which each element is mounted on a substrate and aligned.

In this case, it is preferable to provide a gap between the end of the first positioning part and the spacer.

(Function) According to this method, in advance, the element alignment mounting jig has a side surface as a first positioning part that ensures positioning accuracy in the alignment direction, and a side surface as a first positioning part that ensures positioning accuracy in the alignment direction, and a positioning accuracy of the first element in a direction perpendicular to this direction. A side surface that is a second positioning part for securing the
Since the elements are aligned and mounted using a jig in which spacers are pre-installed to separate each element, there is no need to perform delicate and difficult operations such as setting and removing spacers. Implementation work can be done simply and easily.

(Example) Hereinafter, the present invention will be described in detail with reference to FIGS. 1 to 4. It should be noted that the components shown in these figures are merely schematic illustrations, and it should be understood that the dimensions, shapes, and arrangement relationships of these components are not limited to the illustrated examples.

FIG. 1 is an explanatory diagram for explaining an embodiment of the element alignment and mounting method of the present invention, and FIG. 2 is a plan view schematically showing an element alignment and mounting jig used in this mounting method.

In this invention, as an example, it is assumed that a chip is mounted on the board shown in FIG. 5.The jig shown in FIG. It has a structure in which a first side surface 30, a second side surface 31 as a second positioning portion for positioning and fixing the first element, and a spacer 32 are integrally provided.

As a method of forming this integral structure jig, for example, a method of chemically milling the stainless steel plate 33, or a method of forming the spacer 32 on the first side surface 30 to determine the position in the linear direction.
There is also a method of fixing the first element to the stainless steel plate 33 provided with the second side surface 31 for positioning and fixing it by spot welding, soldering, heat-resistant adhesive, etc. Therefore,
As shown in FIG. 3, a hole 34 is formed in the stainless steel plate 33 by the first and second side surfaces 30 and 31 and the spacer 32 for mounting the device in the direction in which the device is aligned and mounted. It is in a state. Further, as shown in FIG. 3, a gap 35 is formed between the first side surface 30 and the spacer 32 in the stainless steel plate 33 so that the element can be inserted smoothly during mounting. In addition, in FIGS. 1 and 2, 36 is a cover plate inserted between the stainless steel plate 33 and the substrate 11. A hole 37 is provided in the center of the cover plate 3B for exposing the element mounting portion of the substrate 11 through the element mounting hole 34.

As shown in FIG. 1, a substrate 11 (see FIG. 5) having adhesive 13 supplied to adhesive pads 12 for mounting 36 elements, for example, is set in this jig. In this case, the first element 23 is set against the first side surface 30 for determining the position in the linear direction and the second side surface 31 for positioning and fixing the element 23.

Next, the second element 24 is mounted by abutting against the side surface of the spacer 32 and the first side surface 30. In this way, lower elements are sequentially mounted.

In this way, the semiconductor elements 23, 24, 25 are placed on the substrate 1.
1, the substrate 11 and the elements 23, 24, and 25 are fixed by heating for 30 minutes in a constant temperature bath stabilized at 150° C. to harden the silver thread conductive adhesive. After cooling,
Remove the set of the element alignment mounting jig and the board to complete the alignment and mounting of the elements.

FIG. 4 is a partially cutaway plan view showing another example of the element alignment jig used to explain the present invention in detail.

In this embodiment, a groove 38 into which the spacer 32 is inserted is formed in a stainless steel plate 33 on which a first side surface 30 for providing positioning accuracy in the alignment direction, that is, a linear direction, and a second side surface 31 for fixing the first element are formed. spacer 3 in the groove 38.
2 and secure using spot welding, adhesive, or other suitable means. A cover plate 38 is provided to cover the portion where the spacer 32 is fixed. A stainless steel plate 33 is sandwiched and fixed between the cover plate 39 and the backing plate 36,
Configure an element alignment jig.

The device mounting method in this case can be carried out in the same manner as in the first embodiment.

The present invention is not limited to the above-described embodiments; for example, the form of the jig used can be varied in various ways, including the arrangement of the positioning portions, depending on the element alignment pattern.

Note that the supply of adhesive to the adhesive pads may be performed before setting the substrate on the jig, or may be supplied for each corresponding adhesive pad after setting the substrate.

(Effects of the Invention) As is clear from the above description, according to the method for aligning and mounting semiconductor elements according to the present invention, there is a first side surface for positioning the elements in a linear direction, and a second side surface in a direction perpendicular to this. An element mounting tool is provided with a second side surface for positioning and fixing the first element, a spacer, a positioning hole for mounting the element using these, and a gap for smoothly mounting the element. Since the elements are aligned and mounted using a tool, fine spacers can be set between the chips,
There is no need to perform delicate and difficult operations such as removing spacers after mounting.

Therefore, with the method of the present invention, regardless of the size of the elements to be mounted, alignment and mounting can be performed simply and easily, manufacturing costs can be reduced, and the mounting can be performed with high precision. can be done.

Therefore, the alignment mounting method of the present invention is particularly suitable for alignment of light emitting diodes and the like.

[Brief explanation of drawings]

FIG. 1 is an explanatory diagram for explaining the semiconductor element alignment and mounting method of the present invention, FIG. 2 is a plan view showing an embodiment of the element alignment and mounting jig used in carrying out the present invention, and FIG. FIG. 2 is a plan view of a stainless steel plate for explaining one embodiment of an element alignment and mounting jig used for carrying out the invention. FIG. 4 is a plan view showing another embodiment of the device alignment jig used in carrying out this invention, and FIG. 5 is a perspective view showing an example of a substrate used in the conventional method for aligning and mounting semiconductor devices. FIG. 6 is a perspective view showing an embodiment of an abutting jig used in a conventional method for aligning and mounting semiconductor elements. 7 and 8 are a perspective view showing a set state of a substrate and a perspective view of a main part of an abutment jig for explaining a conventional method for aligning and mounting semiconductor elements. DESCRIPTION OF SYMBOLS 11... Board, 12... Adhesive pad 13... Adhesive, 14... Wiring pattern 23.24
．． 25... Semiconductor element 30... First side surface, 31... Second side surface 32
...Spacer, 33...Stainless steel plate 34, 37.
... hole, 35 ... gap 3B ... patch plate,
38...Groove 39...Covering plate. Patent applicant: Oki Electric Industry Co., Ltd.)
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Claims (2)

[Claims] (1) When aligning and mounting a large number of semiconductor elements on a substrate by positioning them on their corresponding adhesive pads, linear first and second positioning is used to position them in the element alignment direction and in a direction perpendicular to this direction. An alignment of semiconductor devices characterized by mounting and aligning each device on a substrate using an alignment mounting jig which is formed by integrally forming a spacer and a spacer for separating each device to be mounted. How to implement. (2) The method for aligning and mounting semiconductor elements according to claim 1, further comprising providing a gap between the end of the first positioning portion and the spacer.