JPS61283654A - resin composition - Google Patents
resin compositionInfo
- Publication number
- JPS61283654A JPS61283654A JP12671485A JP12671485A JPS61283654A JP S61283654 A JPS61283654 A JP S61283654A JP 12671485 A JP12671485 A JP 12671485A JP 12671485 A JP12671485 A JP 12671485A JP S61283654 A JPS61283654 A JP S61283654A
- Authority
- JP
- Japan
- Prior art keywords
- filler
- formula
- alumina
- copolyamide
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
本発明はへキサメチレンジアミンCIMDAχテレフタ
ル酸(TA)およびl−カプロラクタム(CL)、又は
HMDA%TA%CLおよびアジピン酸(AA)又はイ
ソフタル酸(IA)のいずれかの混合物から作られる結
晶性コーポリアミドの樹脂組成物に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to hexamethylene diamine CIMDAx terephthalic acid (TA) and l-caprolactam (CL), or HMDA%TA%CL and either adipic acid (AA) or isophthalic acid (IA). The present invention relates to a crystalline copolyamide resin composition made from a mixture.
従来、CLからのポリアミド(ナイロン6)、HMDA
とAAからのポリアミド(ナイロン6.6)は成型品と
して高汎な用途があるが融点(Tm)(tそれぞれ21
5℃、259℃でありグラスファイバーを入れても熱変
形温度の限界はそれぞれ融点どまりである。Conventionally, polyamide (nylon 6) from CL, HMDA
Polyamide (nylon 6.6) made from
They are 5°C and 259°C, and even if glass fiber is added, the limits of heat distortion temperature remain at the melting point.
最近、耐熱性の用途が増加するにつれて、全芳香族系の
ポリアミド、ポリアミドイミド、ポリイミド、ポリエー
テル、ポリエステルなどが市場に出はじめているが、細
工性が悪いこと、又原料上ツマ−が高価なこと、重合法
も複雑なことから、ナイロン6、ナイロン66などに比
べて数倍の価格になっている。Recently, as heat-resistant applications have increased, fully aromatic polyamides, polyamideimides, polyimides, polyethers, polyesters, etc. have begun to appear on the market, but they have poor workability and are expensive due to their raw materials. In addition, because the polymerization method is complicated, the price is several times higher than that of nylon 6, nylon 66, etc.
本発明者らは、ナイロン6、ナイロン66より耐熱性が
向上し、安価な原料で且つ溶融成形が可能な樹脂組成物
について、鋭意検討したところ特定組成のHMDA/T
A/CL。The present inventors have conducted intensive studies on resin compositions that have improved heat resistance than nylon 6 and nylon 66, are inexpensive raw materials, and can be melt-molded.
A/CL.
HMDA/TA/CL/IA又はl(MDA/TA/C
L/AA から成る高結晶性コーポリアミドと特定波
の充填剤、すなわちシリカ、アルミナ、シリカアルミナ
、アルミナ、タルク、ケイソウ土、クレー、カオリン、
石英、がラス、マイカ、セラコラ、ベンがう、グラフ1
イト、二酸化チタンニ硫化モリブデン、酸化亜鉛、アル
ミ、銅、ステンレス、ウオラストナイト、チタン酸カリ
ウム繊維、ポリテトラクロロエチレンあるいはこれらの
混合物等を加えた樹脂組成物が約240℃から約810
0の熱変形温度をもち、耐熱性が大巾に向1することを
見い出し、本発明に到達したのである。HMDA/TA/CL/IA or l(MDA/TA/C
Highly crystalline copolyamide consisting of L/AA and specific wave fillers, namely silica, alumina, silica alumina, alumina, talc, diatomaceous earth, clay, kaolin,
Quartz, Glass, Mica, Ceracola, Bengau, Graph 1
A resin composition containing carbon dioxide, titanium dioxide, molybdenum disulfide, zinc oxide, aluminum, copper, stainless steel, wollastonite, potassium titanate fiber, polytetrachloroethylene, or a mixture thereof is heated from about 240°C to about 810°C.
They discovered that it has a heat distortion temperature of 0, and that the heat resistance increases over a wide range of width, leading to the present invention.
本発明を実施するにあたり、f(MDA、 TA。In carrying out the present invention, f(MDA, TA).
CL、IA%AAの仕込み比は次の反復成分(Bl
−NH(CH2)sC−
[it%とするか、又は(A160−99重量%、向+
IC+40−11を量%になるように仕込めばよい。The preparation ratio of CL, IA%AA is the following iterative component (Bl
-NH(CH2)sC- [it% or (A160-99% by weight, direction +
It is sufficient to prepare IC+40-11 so that the amount becomes %.
より好ましい量は(A)65〜95重量%、(B)86
〜5重量%とするか、又は(A)65−95重量%、
(Bl−トfc)85〜5重社%である。More preferable amounts are (A) 65 to 95% by weight, (B) 86
~5% by weight, or (A) 65-95% by weight,
(Bl-fc) 85-5%.
本発明の樹脂組成物において、上記の結晶性コーポリア
ミドの量は99.9〜851!量部である。好ましくは
99.5〜50重社部であ 、る。又、充てん
剤の量は0.1〜65重量部である、好ましくは0.5
〜50重量部である。In the resin composition of the present invention, the amount of the above-mentioned crystalline copolyamide is 99.9 to 851! It is a quantity part. Preferably it is 99.5 to 50 jushabu. Also, the amount of filler is 0.1 to 65 parts by weight, preferably 0.5 parts by weight.
~50 parts by weight.
充てん剤は具体的には1.シリカ、アルミナ、シリカア
ルミナ、タルク、ケイソウ土、クレー、カオリン、石英
、がラス、マイカ、グラフディト、二硫化モリブデン、
セラコラ、ベンゲラ、二酸化チタン、酸化亜鉛、ウオラ
ストナイト、チタン酸カリウム繊維、アルミニウム、銅
、ステンレスなどの粉状、板状無機系化合物、ポリフロ
ロエチレン、ポリエチレンなどの粉状、板状有機系化合
物あるいはそれらの混合物等があげられる。Specifically, the filler is 1. Silica, alumina, silica alumina, talc, diatomaceous earth, clay, kaolin, quartz, glass, mica, graphite, molybdenum disulfide,
Powdered and plate-like inorganic compounds such as Ceracola, Bengela, titanium dioxide, zinc oxide, wollastonite, potassium titanate fiber, aluminum, copper, and stainless steel; powdered and plate-like organic compounds such as polyfluoroethylene and polyethylene. Alternatively, a mixture thereof can be mentioned.
好ましい充てん剤はシリカ、アルミナ、シリカアルミナ
、二酸化チタン、二硫化モリブデン、ポリテトラフロロ
エチレンなどである。Preferred fillers include silica, alumina, silica-alumina, titanium dioxide, molybdenum disulfide, polytetrafluoroethylene, and the like.
特にグラフ1イト、二硫化モリブデン、またはポリテト
ラクロロエチレンを使用すると該組成物から得られる成
形体の動摩擦係数、テーパー摩耗、限界Pv値などの耐
摩耗性が向上する。かかる充てん剤の平均粒径は通常0
.1mμないし200μの範囲、とくに1mμ ないし
100μの範囲であり、耐摩耗性が著しく向上する。In particular, when graphite, molybdenum disulfide, or polytetrachloroethylene is used, the wear resistance of the molded article obtained from the composition, such as the coefficient of dynamic friction, taper wear, and limit Pv value, is improved. The average particle size of such fillers is usually 0.
.. It is in the range of 1 mμ to 200μ, particularly in the range of 1 mμ to 100μ, and the wear resistance is significantly improved.
と記樹脂組成物にゲラスフfイバー、炭素繊維、鉱物フ
yイバーなどの無機系、有機系のFIA維を適当量光て
んすることもできる。An appropriate amount of inorganic or organic FIA fibers such as gelatin fiber, carbon fiber, mineral fiber, etc. can also be added to the resin composition.
本発明の樹脂組成物は任意の慣用的方法によってつくっ
てよい。例えば充てん剤を粒状化コーポリアミドと一緒
にして、得られた混合物を慣用の押出機、ニーダ−など
の溶融混練することができる。その際本発明樹脂組成物
に対して、適当量の酸化防止剤射よび熱安定剤、紫外線
吸収剤、滑剤、離型剤、染料、顔料などの着色剤、難燃
剤、難燃助剤、帯電防止剤などの通常の添加剤を1[[
以上添加してもよい。The resin compositions of the present invention may be made by any conventional method. For example, the filler can be combined with the granulated copolyamide and the resulting mixture can be melt-kneaded in a conventional extruder, kneader, or the like. At that time, an appropriate amount of antioxidant, heat stabilizer, ultraviolet absorber, lubricant, mold release agent, colorant such as dye and pigment, flame retardant, flame retardant aid, and electrostatic charge are added to the resin composition of the present invention. Add ordinary additives such as inhibitors to 1[[
You may add more than that.
本発明のコーポリアミドの製造法は特に限定されるもの
ではなく、連続あるいはバッチ重合いずれもよく、原料
を加圧、常圧あるいは減圧下に加熱、重合する方法など
採用できる。たとえばHMDA−TAのナイロン塩を8
0〜60重U%水溶液1こし、CL′とともに重合反応
器に仕込み、反応器を窒素がスで完全にt換した後、加
熱し、水蒸気圧5〜10驚に保ち260〜270℃で反
応し、次いで水蒸気を除いて常圧で80分〜4時間重合
すればよい。な勿重合に際し、重合度調節剤、耐熱安定
剤、耐候性、制電剤、顔料、難燃剤など各種添加剤を加
えてよい。The method for producing the copolyamide of the present invention is not particularly limited, and may be either continuous or batch polymerization, and methods such as heating and polymerizing raw materials under pressure, normal pressure, or reduced pressure can be employed. For example, the nylon salt of HMDA-TA is
Strain 1 of the 0 to 60 wt. Then, water vapor is removed and polymerization is carried out at normal pressure for 80 minutes to 4 hours. Of course, during polymerization, various additives such as polymerization degree regulators, heat stabilizers, weather resistance agents, antistatic agents, pigments, and flame retardants may be added.
他の製造法としてはプレポリマ一部と最終的重縮合部に
分ける方法も好ましい。プレポリマ一部は回分式、回分
一連続式、完全連続式であってよく、1個または1個以
上の攪拌する適当な設計のタンク反応器から成る。この
段階のプレポリマー生成物はコーポリアミドオリゴマー
であって0.1から0.8d(1/fの還元粘度(a硫
酸80℃)をもつ。As another manufacturing method, a method in which the prepolymer is divided into a part and a final polycondensation part is also preferable. The prepolymer portion may be batch, batch-continuous, or fully continuous, consisting of one or more agitated tank reactors of suitable design. The prepolymer product at this stage is a copolyamide oligomer with a reduced viscosity (a sulfuric acid 80° C.) of 0.1 to 0.8 d(1/f).
プレポリマーの回分式製造は高粘度物質を処理できる適
切に設計した攪拌反応器のいずれかの中で実施してよい
。酸、アミンおよび添加剤から成る供給原料物質を80
℃で反応器へ装填する。得られる溶液の水含有量は重量
で15%より多(あるべきでない。温度を次にできるだ
け早く280〜800℃へ上げる。目標温度に到達後、
圧力を5から120で補集する。プレポリマーを次に粉
砕し最終的重縮合物へ供給する。Batch production of the prepolymer may be carried out in any suitably designed stirred reactor capable of handling high viscosity materials. 80% of the feedstock material consisting of acid, amine and additives.
Load the reactor at °C. The water content of the resulting solution should not be more than 15% by weight. The temperature is then increased as quickly as possible to 280-800°C. After reaching the target temperature,
Collect pressure from 5 to 120. The prepolymer is then ground and fed to the final polycondensate.
プレポリマーは次のような方法でも製造可能である。約
0−80気圧でエアロゾルミストを与える制御手段で容
易に噴霧される塩よたはプレポリマーを縮合し、ここに
おいて重合は約200℃ないし約50θ℃の壁温度詔よ
び約170℃ないし約400℃の溶融温度で高伝熱量を
与えるように設計されたフラッシュ反応器中で行なわれ
、および約0.1秒ないし約80秒間この反応器中で重
合体を保持することからなる方法などがあげられる。Prepolymers can also be produced by the following method. The salt or prepolymer, which is readily sprayed with a control means that provides an aerosol mist, is condensed at about 0-80 atmospheres, wherein the polymerization is carried out at a wall temperature of about 200°C to about 50°C and about 170°C to about 400°C. Examples include methods carried out in a flash reactor designed to provide a high amount of heat transfer at a melting temperature of 0.degree. It will be done.
本組成物の熱変形温度は約240℃から約8□oc7あ
り、。れ、よ普通9.い特徴アあ 7す、従来
法からは完全に予想外である。熱変形温度が高いことの
重要性は自動車用屋根、芝刈機の囲い板、チェーンソー
の保護板および電気コネクター器具のような応用におい
て使用することが可能となる。熱変形温度以外に抗張力
が高く、これはダイカストのアルミニウム又は亜鉛と同
等かあるいはそれより高く、一方、本発明のコーポリア
ミドの比重はアルミニウムまたは亜鉛の比重の約半分で
ある。The heat distortion temperature of the composition is about 240°C to about 8□oc7. It's normal 9. Characteristics 7. This is completely unexpected from conventional methods. The importance of high heat distortion temperatures allows for use in applications such as automotive roofs, lawn mower shrouds, chainsaw protectors, and electrical connector equipment. Besides the heat distortion temperature, the tensile strength is high, which is comparable to or higher than die-cast aluminum or zinc, while the specific gravity of the copolyamide of the present invention is about half that of aluminum or zinc.
本発明を次の実施例につき説明する。The invention will be illustrated with reference to the following examples.
実施例1〜5、比較例1〜8
HMDA/TAt−イロン塩の50%水溶液、CL、H
MDA/IAのナイロン塩の50%水溶液およびHtV
ID A / A Aナイロン塩の50%水溶液をそれ
ぞれ第−表に示す組成比で重合反応器dζ仕込んだ。反
応器を窒素がスで完全に置換したのち加熱し、水蒸気圧
を10.0贅に保ち240℃〜260℃で重合した。さ
らに加工後水蒸気を除いて常圧で2−4時間重合した。Examples 1 to 5, Comparative Examples 1 to 8 50% aqueous solution of HMDA/TAt-ylon salt, CL, H
50% aqueous solution of nylon salt of MDA/IA and HtV
A 50% aqueous solution of ID A/AA nylon salt was charged into a polymerization reactor dζ at the composition ratio shown in Table 1, respectively. After the reactor was completely purged with nitrogen gas, it was heated, and polymerization was carried out at 240°C to 260°C while keeping the water vapor pressure at 10.0°C. Further, after the processing, water vapor was removed and polymerization was carried out at normal pressure for 2 to 4 hours.
得られたポリマーは十分冷却して取り出し、粉砕器を用
いて粉状化し、次いで水分率が0.1%以下になるよう
90℃以下で十分乾燥した。このプレポリマーの還元粘
度ハo、 15 aeit (濃ffl酸甲C=O,l
/100cc80℃で測定)。乾燥したポリマーをベン
トロが1つ以上ある2軸押出機で反応させ、カッティン
グしてペレット化した。押出機の温度は820〜aaO
℃、スクリュー回転数10〜20 r、p、m、ポリマ
ーの平均帯留時間5〜10分、ホッパー口を窒素雰囲気
下で行った。ベントロは減圧、常圧開放どちらでもよく
、また押出機ノズルから出てくるポリマーはすぐに水中
に入れるなどして冷却し、亮温で空気に触れない様にし
た。得られたポリマーはペレットは水分率が0.1%以
下になる様90℃以下で十分乾燥(還元粘度は1.Od
6/f)した後、充てん剤と表1のような組成でブレン
ドし、2軸押出機で造粒した。The obtained polymer was sufficiently cooled and taken out, pulverized using a pulverizer, and then sufficiently dried at 90° C. or lower so that the moisture content was 0.1% or lower. The reduced viscosity of this prepolymer is o, 15 aeit (concentrated ffl acidic acid C=O, l
/100cc measured at 80°C). The dried polymer was reacted in a twin screw extruder with one or more vents and cut into pellets. The temperature of the extruder is 820~aaO
C, screw rotation speed 10-20 r, p, m, average retention time of the polymer 5-10 minutes, and the hopper mouth was under a nitrogen atmosphere. The vent hole can be opened to either reduced pressure or normal pressure, and the polymer coming out of the extruder nozzle was immediately cooled by putting it in water to keep it from coming into contact with air at a light temperature. The obtained polymer pellets were sufficiently dried at 90°C or lower so that the moisture content was 0.1% or less (reduced viscosity was 1.Od).
6/f), the mixture was blended with a filler in the composition shown in Table 1, and granulated using a twin-screw extruder.
造粒温度は約800℃〜340℃である。The granulation temperature is approximately 800°C to 340°C.
次いで約100から200℃に保ツタ金型へ射出圧力t
o o oxで射出、バレル温度は800〜850℃
であった。Then, injection pressure t is applied to the ivy mold kept at about 100 to 200°C.
Injection at o o ox, barrel temperature 800-850℃
Met.
実施例6
HMDA/TAのナイロン塩80部、CL20部から重
合した結晶性コーポリアミド(還元粘度bi 1. O
dll/f ) 100 部、タルク40部、酸化チタ
ン20部を2軸押出し機で840℃で造粒した。Example 6 Crystalline copolyamide polymerized from 80 parts of nylon salt of HMDA/TA and 20 parts of CL (reduced viscosity bi 1.0
dll/f), 40 parts of talc, and 20 parts of titanium oxide were granulated at 840°C using a twin-screw extruder.
射出成型品の熱変形温度は280℃以上であり、小さい
異方性、良好な流動性詔よびすぐれた外観を有する組成
物を得た。The heat distortion temperature of the injection molded product was 280° C. or higher, and a composition with small anisotropy, good fluidity, and excellent appearance was obtained.
実施例7
実施例6において、酸化チタンの代りにチタン酸カリウ
ム繊維20部を使い、実施例6と同様の射出成形を行な
った。熱変形温度は280℃以上であり、すぐれた外観
を有する組成物を得た。Example 7 In Example 6, injection molding was carried out in the same manner as in Example 6, using 20 parts of potassium titanate fiber instead of titanium oxide. A composition with a heat distortion temperature of 280° C. or higher and an excellent appearance was obtained.
Claims (1)
表等があります▼を表わす。) からなり、(A)60−99重量%及び(B)40−1
重量%からなるか又は(A)60−99重量%、(B)
+(C)40−1重量%からなる結晶性コーポリアミド
99.9−35重量部と充填剤0.1〜65重量部から
なる樹脂組成物。[Claims] 1) The following repetitive components (A) ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ (B) ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ (C) ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ (In the formula, R is -(CH_2)_4- or ▲ mathematical formula, chemical formula,
There are tables etc. Represents ▼. ), consisting of (A) 60-99% by weight and (B) 40-1
(A) 60-99% by weight, (B)
+A resin composition comprising 99.9-35 parts by weight of a crystalline copolyamide comprising 40-1% by weight of (C) and 0.1-65 parts by weight of a filler.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12671485A JPS61283654A (en) | 1985-06-11 | 1985-06-11 | resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12671485A JPS61283654A (en) | 1985-06-11 | 1985-06-11 | resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61283654A true JPS61283654A (en) | 1986-12-13 |
Family
ID=14942043
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12671485A Pending JPS61283654A (en) | 1985-06-11 | 1985-06-11 | resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61283654A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01239339A (en) * | 1988-03-17 | 1989-09-25 | Matsushita Electric Ind Co Ltd | Hot air heater |
JPH01249857A (en) * | 1988-02-12 | 1989-10-05 | Basf Ag | Thermoplastic molding material |
WO1997015610A1 (en) | 1995-10-27 | 1997-05-01 | Mitsui Petrochemical Industries, Ltd. | Semiaromatic polyamide, process for producing the same, and composition containing the same |
DE10320464A1 (en) * | 2003-05-08 | 2004-12-02 | Forschungszentrum Karlsruhe Gmbh | Molding composition for producing sintered shaped articles, e.g. micro-electronic components, comprising sinterable powder, catalyst and polyamide binder |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5953536A (en) * | 1982-09-20 | 1984-03-28 | Mitsui Petrochem Ind Ltd | Molding polyamide composition |
JPS59155426A (en) * | 1983-02-16 | 1984-09-04 | アモコ・コ−ポレ−ション | Polyamide composition |
JPS59155427A (en) * | 1983-02-16 | 1984-09-04 | アモコ・コ−ポレ−ション | Crystalline copolyamide from terephthalic acid, hexamethylenediamine and trimethylhexamethylene diamine |
JPS59155428A (en) * | 1983-02-24 | 1984-09-04 | Mitsubishi Electric Corp | Thermosetting resin composition |
-
1985
- 1985-06-11 JP JP12671485A patent/JPS61283654A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5953536A (en) * | 1982-09-20 | 1984-03-28 | Mitsui Petrochem Ind Ltd | Molding polyamide composition |
JPS59155426A (en) * | 1983-02-16 | 1984-09-04 | アモコ・コ−ポレ−ション | Polyamide composition |
JPS59155427A (en) * | 1983-02-16 | 1984-09-04 | アモコ・コ−ポレ−ション | Crystalline copolyamide from terephthalic acid, hexamethylenediamine and trimethylhexamethylene diamine |
JPS59155428A (en) * | 1983-02-24 | 1984-09-04 | Mitsubishi Electric Corp | Thermosetting resin composition |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01249857A (en) * | 1988-02-12 | 1989-10-05 | Basf Ag | Thermoplastic molding material |
JPH01239339A (en) * | 1988-03-17 | 1989-09-25 | Matsushita Electric Ind Co Ltd | Hot air heater |
WO1997015610A1 (en) | 1995-10-27 | 1997-05-01 | Mitsui Petrochemical Industries, Ltd. | Semiaromatic polyamide, process for producing the same, and composition containing the same |
US5849826A (en) * | 1995-10-27 | 1998-12-15 | Mitsui Petrochemical Industries, Ltd. | Semiaromatic polyamides, processes for preparing the same and compositions containing the same |
DE10320464A1 (en) * | 2003-05-08 | 2004-12-02 | Forschungszentrum Karlsruhe Gmbh | Molding composition for producing sintered shaped articles, e.g. micro-electronic components, comprising sinterable powder, catalyst and polyamide binder |
DE10320464B4 (en) * | 2003-05-08 | 2008-04-30 | Forschungszentrum Karlsruhe Gmbh | Use of a molding compound for the production of sintered molded parts |
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