JPS6127696Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a punching die for making a large number of holes in a ceramic green sheet when producing a multilayer ceramic substrate.

Conventionally, through-holes for connecting the upper and lower layers of a ceramic green sheet have been formed by a so-called blanking process using a punching die. When making a punching die with this hole punching die, a punch with a through hole pattern is created by machining, so the limit of the through hole diameter depends on the precision of the machining, making it difficult to make minute holes.
It was difficult to make holes smaller than 0.2 mm. Furthermore, such a punching plate mold requires a high level of technical precision, and also has the disadvantage that it is very expensive since it requires a large number of pins to be attached.

On the other hand, in recent years, drilling machines have been used to drill holes in ceramic green sheets in the same way as through-holes in printed circuit boards, but this method also has limitations in microfabrication, making it difficult, and requiring large-scale equipment. It had some drawbacks.

Laser machining and electron beam machining have also been used, but while these methods allow fine processing, they run the risk of altering the quality of the green sheet material and have the drawbacks of requiring large-scale equipment.

Therefore, we used a plate-shaped punch with protrusions made by the photo-etching method and a die with holes complementary to the protrusions of the punch made by the photo-etching method, and a ceramic green sheet was placed between them. A punching die was devised in which a plate-like rubber-like material was placed on the side opposite to the punch and pressed against the ceramic. A schematic cross-sectional view of this mold is shown in FIG. A ceramic green sheet 1 is placed on the punch 2, the hole 7 of the die 3 is aligned with the protrusion 6 of the punch, a plate-shaped rubber material 4 is placed, and pressure is applied by, for example, a vertically moving ram 5. This is a punching device that adds The characteristics of this device are that the rubber-like material has appropriate elasticity, which allows the force to be applied evenly and evenly, and when pressed, the rubber-like material and the through-hole portion of the ceramic green sheet come into close contact with each other. , sticks to a rubbery substance and leaves.
It was possible to open a desired through-hole pattern. Furthermore, it was sufficiently inexpensive.

However, with this mold, it is troublesome to remove the through-hole portion of the ceramic green sheet that is stuck to the rubbery material, and the rubbery material and the through-hole portion of the ceramic green sheet must be pressed very strongly. It was not possible to adhere sufficiently, and sometimes some parts remained. Furthermore, scraps of the punched ceramic green sheet may remain in the hole of the die, which is a problem from both workability and reliability points of view.

The purpose of this invention is to eliminate the above-mentioned drawbacks, to reliably drill fine through holes with a diameter of 0.2 mm or less in ceramic green sheets, and to improve workability and
An object of the present invention is to provide a new hole punching die for ceramic green sheets that is capable of efficiently punching holes in terms of reliability.

In order to achieve this objective, the present invention makes holes by punching a hole, and at this time, holes are formed on the side opposite to the punch when viewed from the ceramic green sheet in a complementary position to the punch protrusion. It is characterized by having a structure in which a plate-shaped die with holes is further layered with an adhesive sheet on the outside, and holes are made in the ceramic green sheet by pressing.

The present invention will be described below based on drawings showing an example of an embodiment.

FIG. 2 is a schematic sectional view showing an embodiment of the present invention. A ceramic green sheet 1 with a thickness of 0.15 mm is placed on a punch 2 made by the photo-etching method, and a die 3 with holes 7 made by the photo-etching method is placed on top of the punch 2. Adhesive sheet 1 to ensure close contact
A plate-like rubber material 4 is placed on top of the ceramic green sheet 1, and pressure is applied by a ram 5 that moves up and down to make holes in the ceramic green sheet 1.

As the adhesive sheet 11, cellophane adhesive tape or vinyl adhesive tape was used. When pressure is applied to the structure shown in FIG. 2 by a vertically moving ram 5 or the like, the ceramic green sheet 1 is punched into a desired shape by a punch 2 having a protrusion 6 and a die 3 having a hole 7 complementary to the protrusion. A plate-like rubber material 4 is provided for the purpose of equalizing the pressure applied to the through-hole patterns that are punched out, and the adhesive sheet 11 is attached to the punched ceramic green sheet 1. It comes into strong contact with the through-hole section, and in the next step, when the plate-shaped rubber substance 4 is separated together with the ram 5 and the adhesive sheet 11 is peeled off from the die 3, the ceramic green sheet waste from the through-hole section is completely removed. It can be removed. The main role of the adhesive tape in such a structure is to completely and reliably form the desired through hole pattern on the ceramic green sheet 1, but it also plays an additional role in forming the through hole pattern of the die 3. In addition, it eliminates the need to remove sheet scraps that adhere to the plate-shaped rubber material in the mold shown in Figure 1, and eliminates the need to remove sheet scraps that can clog the adhesive sheet. By replacing it, work efficiency can be greatly improved. By using a punching die having the structure shown in the present invention, it is possible to significantly improve reliability and workability.

Furthermore, rollers can be used instead of the ram 5 as a method of applying pressure.

FIG. 3 is a schematic cross-sectional view showing an example of such an implementation. In this case as well, a ceramic green sheet 1 with a thickness of 0.05 mm is placed on a punch 2 made by the photo-etching method, and a die 3 with holes 7 made by the photo-etching method is placed on top of the punch 2.
and place the adhesive sheet 11 on top of it so as to be in close contact with the die. Next, a roller 22 having a rubbery substance 21 on its surface is moved over the adhesive sheet 11 while applying pressure.

As shown in Fig. 3, the punch 2 has a protrusion complementary to the hole in the die, and has a thickness of 0.01 to 0.15 mm.
mm ceramic green sheet 1, die 3 with holes 7, adhesive sheet 11 tightly attached to the die 3
When the roll 22 with the rubber-like material 21 on its surface is moved while applying pressure, the protrusion of the punch is inserted into the hole 7 of the die, and the part of the ceramic green sheet sunk into the hole 7 is further inserted. The adhesive sheet 11 is in close contact with the second
A pull-off effect similar to that which occurred in the embodiment shown in the figures results in the ceramic green sheet 1 being reliably and easily drilled with the desired finer through-hole pattern. Furthermore, there is no sheet waste left behind in the through-hole area, which is extremely effective in terms of workability and reliability.

As described above, according to the present invention, the protrusion of the punch is inserted into the hole of the die, and the part of the ceramic green sheet that is sunk into the hole and the adhesive sheet are completely and strongly adhered to each other and then separated;
Workability and reliability are greatly improved because sheet scraps do not get stuck in the die hole, and furthermore, by replacing the adhesive sheet, sheet scraps do not adhere to the rubber-like substance.

[Brief explanation of the drawing]

FIG. 1 is a sectional view schematically showing an example of a conventional implementation, and FIGS. 2 and 3 are schematic sectional views each showing an example of a typical implementation of the present invention. DESCRIPTION OF SYMBOLS 1...Ceramic green sheet, 2...Punch made by photo etching method, 3...Die made by photo etching method, 4...Plate-shaped rubbery substance, 5...Ram, 6... ...protrusion, 7...
...hole, 11...adhesive sheet, 21...rubber-like substance, 22...roller.

Claims (1)

[Scope of utility model registration request] A punch having a protrusion on a plate, a plate-shaped die that is placed opposite to the punch and has a hole in a complementary position to the protrusion of the punch, and an adhesive sheet provided in an overlapping manner on the outside of the die. A hole punching die for a ceramic green sheet, characterized in that the ceramic green sheet is placed between the punch and the die and is pressed.