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JPS6127258U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS6127258U
JPS6127258U JP10850784U JP10850784U JPS6127258U JP S6127258 U JPS6127258 U JP S6127258U JP 10850784 U JP10850784 U JP 10850784U JP 10850784 U JP10850784 U JP 10850784U JP S6127258 U JPS6127258 U JP S6127258U
Authority
JP
Japan
Prior art keywords
package body
semiconductor device
semiconductor equipment
abstract
pins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10850784U
Other languages
Japanese (ja)
Inventor
信義 松田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP10850784U priority Critical patent/JPS6127258U/en
Publication of JPS6127258U publication Critical patent/JPS6127258U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes
    • H01L2225/10—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices having separate containers the devices being integrated devices of class H10
    • H01L2225/1011—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices having separate containers the devices being integrated devices of class H10 the containers being in a stacked arrangement
    • H01L2225/1017—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices having separate containers the devices being integrated devices of class H10 the containers being in a stacked arrangement the lowermost container comprising a device support
    • H01L2225/1029—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices having separate containers the devices being integrated devices of class H10 the containers being in a stacked arrangement the lowermost container comprising a device support the support being a lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes
    • H01L2225/10—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices having separate containers the devices being integrated devices of class H10
    • H01L2225/1011—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices having separate containers the devices being integrated devices of class H10 the containers being in a stacked arrangement
    • H01L2225/1076—Shape of the containers
    • H01L2225/1082—Shape of the containers for improving alignment between containers, e.g. interlocking features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Packaging Frangible Articles (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図ａ， ｂ． ｃはそれそれ本考案の一実施例の断
面図、平面図、正面図である。 第２図ａ，反は従来の半導体装置の側面図、平面図、正
面図である。 １，１１・・・・・・パッケージ本体、２・・・・・・
リードピン、．３ａ，４ａ・・・胃凸起、３ｂ．４ｂ・
・・五凹み。Figure 1 a, b. 3C is a sectional view, a plan view, and a front view of an embodiment of the present invention. FIG. 2A shows a side view, a top view, and a front view of a conventional semiconductor device. 1, 11...Package body, 2...
Lead pin. 3a, 4a... Gastric protrusion, 3b. 4b・
...Five dents.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 内部に半導体チップを内蔵したパッケージ本体と、この
パッケージ本体の両側部から外部へ引き出されかつ下方
へ曲げられた多数のリードピンとを備えた半導体装置に
おいて、前記パッケージ本体の上面および下面にそれぞ
れ、他のパッケージ本体と重ねるときに嵌合する凸起お
よび凹みが設けられていることを特徴とする半導体装置
。In a semiconductor device including a package body with a semiconductor chip built therein, and a large number of lead pins drawn out from both sides of the package body and bent downward, other pins are provided on the top and bottom surfaces of the package body, respectively. What is claimed is: 1. A semiconductor device comprising a protrusion and a recess that fit together when stacked with a package body of the semiconductor device.
JP10850784U 1984-07-18 1984-07-18 semiconductor equipment Pending JPS6127258U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10850784U JPS6127258U (en) 1984-07-18 1984-07-18 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10850784U JPS6127258U (en) 1984-07-18 1984-07-18 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS6127258U true JPS6127258U (en) 1986-02-18

Family

ID=30667692

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10850784U Pending JPS6127258U (en) 1984-07-18 1984-07-18 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS6127258U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0766364A (en) * 1993-08-25 1995-03-10 Nec Corp Mounting structure of semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0766364A (en) * 1993-08-25 1995-03-10 Nec Corp Mounting structure of semiconductor device

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