JPS61256773A - Led element aligning method - Google Patents
Led element aligning methodInfo
- Publication number
- JPS61256773A JPS61256773A JP60099114A JP9911485A JPS61256773A JP S61256773 A JPS61256773 A JP S61256773A JP 60099114 A JP60099114 A JP 60099114A JP 9911485 A JP9911485 A JP 9911485A JP S61256773 A JPS61256773 A JP S61256773A
- Authority
- JP
- Japan
- Prior art keywords
- led elements
- recessed groove
- led element
- aligning
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 11
- 239000000758 substrate Substances 0.000 abstract description 6
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
- H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Led Device Packages (AREA)
- Dot-Matrix Printers And Others (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はＩＥＤ素子整列方法に関し、特にプリンタ装置
のプリントヘッドにおけるＬＥＤ素子整列方法に関する
。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for aligning IED elements, and more particularly to a method for aligning LED elements in a print head of a printer device.
第２図は従来のＬＥＤ素子整列方法の一例を示す斜視図
で、基板１′に印刷されたバッド３にＬＥＤ素子２ｔ−
載せて整列していた。FIG. 2 is a perspective view showing an example of a conventional LED element alignment method, in which LED elements 2t-
They were loaded and lined up.
上述し几従来のＬＥＤ素子整列方法では、複数のＬＥＤ
素子金それぞれの印刷されたパッドに載せるので、ＬＥ
Ｄ素子間の曲りが避けられず列の直線性の精度が帰られ
なかった。従ってこのＬＥＤ素子の整列状態で印字を行
うと、印字品質が悪くなる欠点がある。In the conventional LED element alignment method described above, multiple LED elements
Since it is placed on the printed pad of each element gold, LE
Curves between the D elements were unavoidable, and the accuracy of the linearity of the rows could not be restored. Therefore, if printing is performed with the LED elements aligned, there is a drawback that the printing quality deteriorates.
本発明のＬＥＤ素子整列方法は、基板上にＬＥＤ素子を
挿入配列する几めの凹溝を設け、該凹溝に複数の前記Ｌ
ＥＤ素子を等間隔を保って挿入している。In the LED element alignment method of the present invention, a diagonal groove is provided on a substrate into which the LED elements are inserted and arranged, and a plurality of the L
ED elements are inserted at equal intervals.
次に、本発明について第１図を参照して説明する。 Next, the present invention will be explained with reference to FIG.
第１図は本発明のＬＥＤ素子整列方法の一冥施例を示す
斜視図である。同図において、基板１上には凹溝４が設
けられ、凹溝４の両側にはボ／ディングバッド６が取り
付けられている。なお、凹１１４の震幅は挿入すべきＬ
ＥＤ素子２の幅と合わせである。複数のＬＥＤ素子２を
間隔５が等しくなるように治具（図示していない）を用
いて凹溝４に順次挿入配列しｔ後、各ＬＥＤ素子２の位
置に対応したボッディ／グパクド６とワイヤ結線すれば
、ＬＥＤ素子２と基板１とは所定の電気的接続が完了す
る。FIG. 1 is a perspective view showing one embodiment of the LED element alignment method of the present invention. In the figure, a groove 4 is provided on a substrate 1, and boarding pads 6 are attached to both sides of the groove 4. In addition, the seismic amplitude of concavity 114 is L to be inserted.
This matches the width of the ED element 2. A plurality of LED elements 2 are sequentially inserted and arranged in the groove 4 using a jig (not shown) so that the intervals 5 are equal, and then a body/gap pad 6 and a wire corresponding to the position of each LED element 2 are inserted and arranged. Once connected, a predetermined electrical connection between the LED element 2 and the substrate 1 is completed.
本実施例によれば、治具を用いて間隔を保ちながらＬＥ
Ｄ素子を凹溝に挿入するので、高精度の列直線性と間隔
が容易に得られる。According to this embodiment, the LE is
Since the D element is inserted into the groove, highly accurate row linearity and spacing can be easily obtained.
以上説明し比ように本発明は、基板上に設けられ次回溝
に複数のＬＥＤ素子を等間隔に挿入することにより、高
い整列精度が得られるので、プリントヘッドの印字品質
が向上する効果があり、まｘＬＥＤ素子の整列工数が大
幅に削減される効果がある。As explained above, the present invention has the effect of improving the printing quality of the print head because high alignment accuracy is obtained by inserting a plurality of LED elements at equal intervals into the grooves provided on the substrate. , the number of man-hours required for aligning LED elements can be significantly reduced.
ｗ、１図は本発明のＬＥＤ素子整列方法の一実施例を示
す斜視図、第２図は従来のＬＥＤ素子整列方法の一例を
示す斜視図である。
１．１’・・・・・・基板、２・・・・・・ＬＥＤ素子
、３・・・・・・パッド、４・・・・・・凹溝、５・・
・・・・間隔、６・・・・・・ポンディ７グバツド。Fig. 1 is a perspective view showing an embodiment of the LED element alignment method of the present invention, and Fig. 2 is a perspective view showing an example of the conventional LED element alignment method. 1.1'...Board, 2...LED element, 3...Pad, 4...Concave groove, 5...
...Interval, 6...Pondy 7gbatsud.
Claims (1)
該凹溝に複数の前記ＬＥＤ素子を等間隔を保って挿入す
ることを特徴とするＬＥＤ素子整列方法。A concave groove is provided on the board for inserting and arranging the LED elements,
A method for aligning LED elements, comprising inserting a plurality of the LED elements into the groove at equal intervals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60099114A JPS61256773A (en) | 1985-05-10 | 1985-05-10 | Led element aligning method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60099114A JPS61256773A (en) | 1985-05-10 | 1985-05-10 | Led element aligning method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61256773A true JPS61256773A (en) | 1986-11-14 |
Family
ID=14238780
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60099114A Pending JPS61256773A (en) | 1985-05-10 | 1985-05-10 | Led element aligning method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61256773A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63296284A (en) * | 1987-05-27 | 1988-12-02 | Nec Corp | Light emitting diode head |
| US6844570B2 (en) * | 2001-04-11 | 2005-01-18 | Nihon Kessho Kogaku Co., Ltd. | Component of a radiation detector comprising a substrate with positioning structure for a photoelectric element array |
| EP3828952A4 (en) * | 2018-07-25 | 2022-05-04 | Shenzhen TCL New Technology Co., Ltd | Led display screen and manufacturing method therefor |
-
1985
- 1985-05-10 JP JP60099114A patent/JPS61256773A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63296284A (en) * | 1987-05-27 | 1988-12-02 | Nec Corp | Light emitting diode head |
| US6844570B2 (en) * | 2001-04-11 | 2005-01-18 | Nihon Kessho Kogaku Co., Ltd. | Component of a radiation detector comprising a substrate with positioning structure for a photoelectric element array |
| EP3828952A4 (en) * | 2018-07-25 | 2022-05-04 | Shenzhen TCL New Technology Co., Ltd | Led display screen and manufacturing method therefor |
| US11769786B2 (en) | 2018-07-25 | 2023-09-26 | Shenzhen Tcl New Technology Co., Ltd. | LED display screen and manufacturing method therefor |
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