JPS6125276Y2 - - Google Patents

Description

[Detailed Description of the Invention] This invention relates to an optical semiconductor device, and particularly to a semiconductor light emitting device with improved assembly efficiency.

2. Description of the Related Art Conventionally, a structure as shown in FIG. 1 has been mainstream as a method of semiconductor light emitting devices (hereinafter abbreviated as light emitting devices) for displaying characters, numbers, etc. This is done by disposing the light emitting element 1 on a substrate 2, passing the protruding rods 3a, 3a of the reflector 3 through the through holes 2a, 2a provided in the substrate 2, and then passing the protruding rods 3a, 3a through the through holes 2a, 2a provided in the substrate 2. After passing the protruding rods 4a, 4a of the light diffuser 4 through 2b, 2b, these protruding rods 3a,
The tips of 3a, 4a, 4a are fixed by heating and deforming them. Figures 2a and 2b show perspective views of the reflector 3 and light diffuser 4, respectively.

However, in this method, the reflector 3 and the light diffuser 4 are provided with independent protruding rods 3a, 3a,
4a, 4a are required, it is necessary to provide corresponding through holes 2a, 2a, 2b, 2b in the substrate 2. Therefore, since the substrate 2 requires ample space, it is difficult to downsize the substrate 2, and it takes time and effort to heat and deform the protruding rods 3a, 3a, 4a, 4a.

In addition, there are also products that use adhesives for similar fixing purposes. However, since this method uses adhesive, initial positioning is difficult, and the appearance may be damaged due to protrusion.

This idea was made in view of the above circumstances,
The purpose of this is to make an optical semiconductor device that can integrally fix a reflector and a light diffuser to a substrate, reduce the number of through holes in the substrate, make it more compact, and reduce the need for heat deformation, etc. Our goal is to provide the following.

An embodiment of this invention will be described below with reference to the drawings. In FIG. 3, reference numeral 11 denotes a light emitting element, and this light emitting element 11 is arranged on a substrate 12. This substrate 12 has through holes 12a, 12a formed therein. Reference numeral 13 denotes a reflector whose perspective view is shown in FIG. Through hole 1
Guide grooves 13b, 13b corresponding to 2a, 12a
is formed. 14 is a light diffuser whose perspective view is shown in FIG. 4b, and this light diffuser 14 is similar to the reflector 1
It has a light diffusing part (display surface) 14a for diffusing part of the emitted and reflected light, facing the reflecting surface 13a of No. 3, and protruding rods 14b, 1 on both sides thereof.
4b is provided.

That is, in this light emitting device, the protruding rods 14b, 14b of the light diffuser 14 are connected to the reflector 1, respectively.
After the protruding rods 14a, 14b are inserted into the through holes 12a, 12a of the substrate 12 through the guide grooves 13b, 13b of No. 3, the tips of the protruding rods 14a, 14b are heated and deformed to be fixed.

Therefore, in the past, it was necessary to provide the substrate 12 with through holes corresponding to the protruding rods of both the reflector and the light diffuser, but in this invention, the light diffuser 1
Through holes 12 corresponding to the protruding rods 14b, 14b of No. 4
Only a and 12a are required. Therefore, the substrate 12 can be used effectively, and the device can be made smaller. Also, the time and effort required for heating and deforming is reduced to half that of the conventional method.

In the above embodiment, the guide grooves 13b, 13b are provided in the side surface of the reflector 13, but the present invention is not limited to this, and a through hole may be provided inside the reflector 13.

As described above, according to this invention, the through hole or guide groove corresponding to the protruding rod of the light diffuser is provided in the reflector, so the reflector and the light diffuser can be integrally fixed to the substrate. The number of through holes in the substrate can be reduced, making it possible to downsize the device. Furthermore, since the number of protruding rods is small, the effort required for heating deformation etc. is reduced.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing the configuration of a conventional light emitting device.
FIGS. 2a and 2b are perspective views showing the parts of the above device, where a is a reflector, b is a light diffuser, and FIG. 3 is a sectional view showing the configuration of a light emitting device according to an embodiment of the invention, FIGS. 4a and 4b are perspective views showing the parts of the above-mentioned apparatus, where a is a reflector and b is a light diffuser. 11...Light emitting element, 12...Substrate, 12a...
Through hole, 13... Reflector, 13a... Reflective surface, 1
3b...Guide groove, 14...Light diffuser, 14a...
...Light diffusion part (display surface), 14b...Protrusion rod.

Claims (1)

[Scope of utility model registration request] A semiconductor light emitting element, a substrate in which a through hole is formed and the semiconductor light emitting element is disposed, and a through hole or guide that corresponds to the through hole of the substrate and has a reflective surface that reflects light emitted from the semiconductor light emitting element. A light diffuser comprising a reflector in which a groove is formed, a light diffuser that constitutes a part of an envelope and that faces the reflective surface of the reflector and diffuses part of the emitted and reflected light, and a protruding rod. The protruding rod of the light diffuser is passed through the through hole or guide groove of the reflector and the through hole of the substrate in this order, so that the light diffuser and the reflector are integrally connected to the substrate. An optical semiconductor device characterized by being fixed to.