JPS61248496A - Flexible substrate device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a flexible substrate device in which a support substrate is bonded to a flexible substrate.

[Conventional technology]

FIG. 4 is a schematic diagram showing a conventional flexible board device, FIG. 5 is a sectional view taken along line AA in FIG. 4, and FIG. 6 shows a part of the flexible board device shown in FIGS. 4 and 5. In Figure 0, which is a detailed cross-sectional view, 1 is a flexible substrate, 2 is a resin plate that is a supporting substrate bonded to the flexible substrate 1,
3 is a base material of the flexible substrate 1, 4 is a wiring layer formed on the base material 3, 5 is a coating material that covers the surface of the flexible substrate 1 on which the wiring layer 4 is formed, and 6 is a coating material provided on the flexible substrate l. The lead wire hole 7 is a lead wire hole provided in the resin plate 2, and the center lines of the lead wire holes 6 and 7 are aligned.

In such a flexible board device, the lead wire of the electronic component is passed through the lead wire hole 7.6 and the lead wire is soldered to the wiring layer 4 to stably attach the electronic component to the flexible board 1. Is possible.

[Problem that the invention seeks to solve]

However, as electronic devices become smaller, the mounting density of electronic components mounted on flexible circuit board devices is increasing, and the amount of heat emitted from the mounted electronic components is increasing. Since the heat dissipation of the resin plate 2 is insufficient, the temperature of the resin plate 2 and its vicinity increases, causing a decline in the functionality of the mounted electronic components, which is a major problem. Therefore, heat dissipation fins and the like are provided on electronic components, but in this case, the electronic components become expensive, and the electronic components become large, which requires a large amount of space. Furthermore, as the number of mounted electronic components increases, the bending rigidity of the resin board 2 is small, so the resin board 2 warps, making it impossible to insert the flexible board device into the electronic device, and even if it can be inserted, the adjacent printed circuit board may cause serious damage to the circuit. Furthermore, since the resin plate 2 has poor shielding effect, it is not possible to prevent noise and the like.

This invention was made in order to solve the above-mentioned problems, and the supporting substrate has good heat dissipation performance, high bending rigidity,
Another object of the present invention is to provide a flexible substrate device with good shielding effect.

[Means for solving problems]

In order to achieve this object, in the present invention, a support substrate having at least a metal plate is adhered to a flexible substrate, a through hole is provided in the metal plate, a resin is filled in the through hole, and a central portion of the resin is Provide a hole for the lead wire.

[Effect]

In this flexible substrate device, heat is released through the metal plate, the metal plate increases bending rigidity, and the metal plate can shield electric and magnetic fields.

〔Example〕

FIG. 1 is a schematic sectional view showing a flexible substrate device according to the present invention, and FIG. 2 is a detailed sectional view showing a part of the flexible substrate device shown in FIG.

In the figure, 8 is a metal plate that is a supporting substrate bonded to a part of the flexible substrate 1, 9 is a through hole provided in the metal plate 8, 10 is a resin filled in the through hole 9, and 11 is a resin. A lead wire hole is provided in the center of the lead wire hole 10, and the center line of the lead wire hole 11 coincides with the center line of the lead wire hole 6.

In this flexible board device, the electronic component can be attached to the flexible board 1 by passing the lead wire of the electronic component through the lead wire hole 11.6 and soldering the lead wire to the wiring layer 4.

In this case, although the resin 10 is provided on the metal plate 8,
It is possible to prevent conduction between the lead wire and the metal plate 8. Since the support substrate is made of the metal plate 8, it has good heat dissipation, high bending rigidity, and very good shielding effect.

FIG. 3 is a sectional view showing a part of another flexible substrate device according to the present invention. In the figure, 12 is a resin plate, 1
3 is a wiring layer formed on the surface of the resin plate 12; 14 is a through hole provided in the resin plate 12; the resin plate 12 is bonded to the metal plate 8 via a bonding sheet 15;
Further, a resin plate 12 is bonded to the flexible substrate 1, and includes a lead wire hole 6, a through hole 14, and a lead wire hole 11.
The center lines of the metal plate 8 and the resin plate 12 constitute a support substrate.

In this flexible board device, the lead wire 17 of the electronic component 16 is inserted into the lead wire hole 11, the through hole 14, and the lead wire hole 6, and the lead wire 17 is soldered to the wiring layer 4 and the through hole 14 with solder 18. For example, the electronic component 16 can be attached to the flexible substrate 1. Since the support substrate includes the metal plate 8, it has good heat dissipation, high bending rigidity, and very good shielding effect.

In the above embodiments, a flexible substrate device having a flexible substrate 1 having a wiring layer 4 formed on only one side has been described. Naturally, the present invention can be applied to a flexible substrate device having a flexible substrate. In addition, glue, resin adhesive, bonding sheet, etc. can be used to bond the flexible substrate 1 and the support substrate, and the flexible substrate 1 and the support substrate may be bonded by roller pressure bonding, thermocompression bonding, etc. be able to. Further, as the metal plate, any metal plate such as an aluminum plate, an aluminum alloy plate, a steel plate, or a copper plate can be used. When an aluminum plate or an aluminum alloy plate is used, the weight can be reduced; Sometimes the price is low, and when a copper plate is used, the heat dissipation is very good. Further, in the above-described embodiment, the supporting substrate is bonded only to a part of the flexible substrate 1, but the supporting substrate may be bonded to the entire surface of the flexible substrate 1.

〔Effect of the invention〕

As explained above, the flexible board device according to the present invention has good heat dissipation, so even if the electronic components are mounted at a high density and the amount of heat emitted from the mounted electronic components is large, the functionality of the mounted electronic components will deteriorate. Since there is no need to use expensive and large electronic components having heat dissipation fins and the like, it is possible to miniaturize and increase the density of electronic devices. In addition, due to its high bending rigidity, even if the number of mounted electronic components increases, the flexible circuit board device will not warp, making it easy to insert the flexible circuit board device into an electronic device and making contact with adjacent printed circuit boards. There's nothing to do.

Furthermore, since the shielding effect is good, noise etc. can be effectively prevented. As described above, the effects of this invention are remarkable.

[Brief explanation of drawings]

1 is a schematic sectional view showing a flexible substrate device according to the present invention, FIG. 2 is a detailed sectional view showing a part of the flexible substrate device shown in FIG. 1, and FIG. 3 is a schematic sectional view showing a flexible substrate device according to the present invention. 4 is a schematic diagram showing a conventional flexible substrate device, FIG. 5 is a sectional view taken along line A-A in FIG. 4, and FIG. FIG. 3 is a detailed cross-sectional view of a portion of the illustrated flexible substrate device. 1...Flexible board 8...Metal plate 9...Through hole 10...Resin plate 11...Hole for lead wire

Claims (1)

[Claims] A support substrate having at least a metal plate is adhered to a flexible substrate, a through hole is provided in the metal plate, a resin is filled in the through hole, and a hole for a lead wire is provided in the center of the resin. flexible circuit board equipment.