JPS6123391A - Device for mounting chip circuit part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a mounting device for chip-shaped circuit components, which mounts the chip-shaped circuit components at predetermined positions on copper foil lands on a printed wiring board using an adhesive. It is something.

Conventional configurations and their problems In recent years, the demand for compact and high-density packaging has increased, and chip-shaped circuit components are increasingly being used as circuit components such as capacitors, resistors, coils, and semiconductors. It's here. These chip-shaped circuit components are mounted and fixed after applying adhesive to a predetermined copper foil land portion on the conductor layer side of the printed wiring board by screen printing or the like.
It was used by soldering.

That is, in the conventional mounting method, as shown in FIG. 1A, an adhesive 3 having a substantially rectangular planar shape is applied between copper foil lands 2.2 of a printed wiring board 1 by screen printing or the like. And Figure 2 A.

As shown in the figure, a chip-shaped circuit component 4 is attached by adhesive 3.
is temporarily fixed on the printed wiring board 1, and the electrodes 6 on the component body side of the chip-shaped circuit component 4 and the electrodes 6 at both ends of the chip 5 are placed on the copper foil land 2, and soldered in this state. The copper foil land 2 was electrically and mechanically connected and fixed by soldering. However, in such a conventional mounting method, if the adhesive 3 is misaligned, the adhesive 3 is crushed when the chip-shaped circuit component 4 is mounted, and the electrode 6 is crushed as shown in FIG. The adhesive 3 protrudes between the electrode 6 and the copper foil land 2, and the state shown in FIG. At the time, there was a problem in that the solder did not stick and defects occurred.

OBJECTS OF THE INVENTION The present invention provides a chip that can secure solderability of chip-shaped circuit components by reducing the overflow of adhesive onto copper foil lands and fixing them by the solder dip method, and can significantly improve the reliability of the chips. The object of the present invention is to provide a mounting device for shaped circuit components.

Structure of the Invention The device for mounting a chip-shaped circuit component of the present invention is provided between opposing copper foil lands on a printed wiring board on which a chip-shaped circuit component is mounted, so that the chip circuit components are mounted independently so as to be divided on the center line between the lands. A pair of adhesives is applied in a planar shape such that the opposing inner sides become narrower, and a chip-shaped circuit component is mounted on this adhesive, so that the adhesive contacts the electrodes of the chip-shaped circuit component. The feature is that it does not protrude between the copper foil lands.

DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of the present invention will be described based on FIGS. 4 to 6. Note that in this embodiment, the same reference numerals as in the conventional one indicate the same components.

In this embodiment, as shown in FIG. 4, a pair of independent adhesives 7a and 7b are applied between the opposing copper foil lands 2 and 2 on the printed wiring board 1, and are divided into two on the center line. There is. And this pair of adhesives 7a, 7b
is applied in a trapezoidal shape in plan view so that the opposing inner sides are narrower than the outer sides. In this way, the adhesive 7a.

When 7b is applied, when chip-shaped circuit components are installed, the 5th
The adhesive is crushed as shown in Figure A9, and the copper foil land 2
, 2 will not protrude. Even if the adhesive is misaligned as shown in Fig. 6 (a) 9, the amount of adhesive 7a and yb that protrudes onto the copper foil land 2 is extremely small, and soldering as shown in Fig. 3 is not possible. It will not become defective. Therefore, soldering defects due to adhesive extrusion can be prevented, and the quality of the solder dipping method can be stabilized and reliability can be improved.

In the above embodiments, leadless chip-shaped circuit components have been described, but as shown in Figure 7, A-9, the leads of discrete components may be soldered to copper foil lands without inserting them into holes in the board. Even if there is, the same effect can be obtained. Furthermore, although the shape of the adhesive has been explained as being trapezoidal, it may also be formed into a triangular fan shape, etc., as shown in FIG. This can be done by making the opposing inner sides narrower than the outside. In addition, the inner and outer dimensions of the adhesive application shape are set according to conditions such as the internal dimensions of the copper foil land and the dimensions of the chip components.

Effects of the Invention As described above, the present invention provides a pair of adhesives that are applied independently between the copper foil lands of a printed wiring board on which a chip-shaped circuit component is attached so as to be divided on the center line between the lands. , the adhesive is applied so that the inner sides facing each other are narrower in the planar shape, and the chip-shaped circuit components are mounted on this adhesive, so even if the adhesive is misaligned, the copper foil land There is almost no amount of adhesive extruding from the solder dip method, and therefore the quality of soldering by the solder dip method can be stabilized, and its reliability can be significantly improved.

[Brief explanation of the drawing]

Figure 1 A1 is a plan view and a cross-sectional view showing the printed shape of the adhesive of a conventional mounting device; Figure 3 A 1 opening is a plan view and cross-sectional view of the case where the printing position of the adhesive has shifted in the same device, Figure 3 C is a sectional view of the state where the adhesive has protruded, and Figure 4 A 2 opening and H 6 is a plan view and a sectional view showing the printed shape of the adhesive of an embodiment of the mounting device of the present invention, and FIG. Figure 6 (A) 9 is a plan view and cross-sectional view of the case where the printing position of the adhesive in the same embodiment is misaligned, Figure 7 (A) is a front view of the circuit component with lead terminals, and Figure 8 (A) is a front view of the circuit component with lead terminals. FIG. 7 is a diagram showing the printed shape of the adhesive of another example. 1...Printed wiring board, 2-...Copper foil land, 4-
. . . Entire chip-shaped circuit component, 6. . . - Electrodes of the chip-shaped circuit component, 7a, 7b . Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure no. Figure 3 So 9 Danteha 8 S 8 q So

Claims (1)

[Claims] It is applied independently between opposing copper foil lands on a printed wiring board on which a chip-shaped circuit component is mounted, so that the inner sides facing each other become narrower in a planar shape so as to be divided along the center line between the lands. A mounting device for a chip-shaped circuit component, characterized in that a chip-shaped circuit component is mounted on a pair of adhesives.