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JPS61195961U - - Google Patents

Info

Publication number
JPS61195961U
JPS61195961U JP1985080484U JP8048485U JPS61195961U JP S61195961 U JPS61195961 U JP S61195961U JP 1985080484 U JP1985080484 U JP 1985080484U JP 8048485 U JP8048485 U JP 8048485U JP S61195961 U JPS61195961 U JP S61195961U
Authority
JP
Japan
Prior art keywords
main body
center hole
magnet plate
plate
facing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985080484U
Other languages
Japanese (ja)
Other versions
JPH0351095Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985080484U priority Critical patent/JPH0351095Y2/ja
Publication of JPS61195961U publication Critical patent/JPS61195961U/ja
Application granted granted Critical
Publication of JPH0351095Y2 publication Critical patent/JPH0351095Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案にかゝる片面ラツプ盤のワーク
ホルダの構造を示す分解斜視図、第2図と第3図
は本ワークホルダのラツプ盤内における使用態様
を示したもので、第2図は平面図、第3図は側面
図である。 1……本体、1a……本体の中心孔、2……磁
石板、2a……磁石板の中心孔、3……取付板、
3a……平板部、3b……ボス部、3c……ワー
ク保持用孔、4……ピン、5……溝。
Fig. 1 is an exploded perspective view showing the structure of a work holder for a single-sided lapping machine according to the present invention, and Figs. 2 and 3 show how the work holder is used in the lapping machine. The figure is a plan view, and FIG. 3 is a side view. 1...Main body, 1a...Center hole of main body, 2...Magnetic plate, 2a...Center hole of magnet plate, 3...Mounting plate,
3a...Flat plate part, 3b...Boss part, 3c...Work holding hole, 4...Pin, 5...Groove.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 中心孔を有する円板状の本体と、同じく中心孔
を有し前記本体に面合せされるゴム系磁石板と、
前記本体および磁石板の中心孔に嵌合されるボス
部を有すると共に、前記磁石板に面合せされる平
板部にワーク保持用の複数の孔を有する取付板と
、前記本体と前記取付板との嵌合部に設けられ両
者の相互回転を規制する回り止め手段とから成る
片面ラツプ盤のワークホルダ。
a disc-shaped main body having a center hole; a rubber magnet plate also having a center hole and facing the main body;
a mounting plate having a boss portion fitted into the center hole of the main body and the magnet plate, and a plurality of holes for holding a workpiece in a flat plate portion facing the magnet plate; A work holder for a single-sided lapping machine, comprising a detent means provided at the fitting part of the two to restrict mutual rotation of the two.
JP1985080484U 1985-05-29 1985-05-29 Expired JPH0351095Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985080484U JPH0351095Y2 (en) 1985-05-29 1985-05-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985080484U JPH0351095Y2 (en) 1985-05-29 1985-05-29

Publications (2)

Publication Number Publication Date
JPS61195961U true JPS61195961U (en) 1986-12-06
JPH0351095Y2 JPH0351095Y2 (en) 1991-10-31

Family

ID=30626375

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985080484U Expired JPH0351095Y2 (en) 1985-05-29 1985-05-29

Country Status (1)

Country Link
JP (1) JPH0351095Y2 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5517479A (en) * 1978-07-25 1980-02-06 Kobe Steel Ltd Polishing method for test piece for metal microscope and test piece
JPS6016361A (en) * 1983-07-05 1985-01-28 Toshiba Corp Method of separating wafer

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5517479A (en) * 1978-07-25 1980-02-06 Kobe Steel Ltd Polishing method for test piece for metal microscope and test piece
JPS6016361A (en) * 1983-07-05 1985-01-28 Toshiba Corp Method of separating wafer

Also Published As

Publication number Publication date
JPH0351095Y2 (en) 1991-10-31

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