JPS61195961U - - Google Patents
Info
- Publication number
- JPS61195961U JPS61195961U JP1985080484U JP8048485U JPS61195961U JP S61195961 U JPS61195961 U JP S61195961U JP 1985080484 U JP1985080484 U JP 1985080484U JP 8048485 U JP8048485 U JP 8048485U JP S61195961 U JPS61195961 U JP S61195961U
- Authority
- JP
- Japan
- Prior art keywords
- main body
- center hole
- magnet plate
- plate
- facing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Description
第1図は本考案にかゝる片面ラツプ盤のワーク
ホルダの構造を示す分解斜視図、第2図と第3図
は本ワークホルダのラツプ盤内における使用態様
を示したもので、第2図は平面図、第3図は側面
図である。
1……本体、1a……本体の中心孔、2……磁
石板、2a……磁石板の中心孔、3……取付板、
3a……平板部、3b……ボス部、3c……ワー
ク保持用孔、4……ピン、5……溝。
Fig. 1 is an exploded perspective view showing the structure of a work holder for a single-sided lapping machine according to the present invention, and Figs. 2 and 3 show how the work holder is used in the lapping machine. The figure is a plan view, and FIG. 3 is a side view. 1...Main body, 1a...Center hole of main body, 2...Magnetic plate, 2a...Center hole of magnet plate, 3...Mounting plate,
3a...Flat plate part, 3b...Boss part, 3c...Work holding hole, 4...Pin, 5...Groove.
Claims (1)
を有し前記本体に面合せされるゴム系磁石板と、
前記本体および磁石板の中心孔に嵌合されるボス
部を有すると共に、前記磁石板に面合せされる平
板部にワーク保持用の複数の孔を有する取付板と
、前記本体と前記取付板との嵌合部に設けられ両
者の相互回転を規制する回り止め手段とから成る
片面ラツプ盤のワークホルダ。 a disc-shaped main body having a center hole; a rubber magnet plate also having a center hole and facing the main body;
a mounting plate having a boss portion fitted into the center hole of the main body and the magnet plate, and a plurality of holes for holding a workpiece in a flat plate portion facing the magnet plate; A work holder for a single-sided lapping machine, comprising a detent means provided at the fitting part of the two to restrict mutual rotation of the two.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985080484U JPH0351095Y2 (en) | 1985-05-29 | 1985-05-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985080484U JPH0351095Y2 (en) | 1985-05-29 | 1985-05-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61195961U true JPS61195961U (en) | 1986-12-06 |
JPH0351095Y2 JPH0351095Y2 (en) | 1991-10-31 |
Family
ID=30626375
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985080484U Expired JPH0351095Y2 (en) | 1985-05-29 | 1985-05-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0351095Y2 (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5517479A (en) * | 1978-07-25 | 1980-02-06 | Kobe Steel Ltd | Polishing method for test piece for metal microscope and test piece |
JPS6016361A (en) * | 1983-07-05 | 1985-01-28 | Toshiba Corp | Method of separating wafer |
-
1985
- 1985-05-29 JP JP1985080484U patent/JPH0351095Y2/ja not_active Expired
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5517479A (en) * | 1978-07-25 | 1980-02-06 | Kobe Steel Ltd | Polishing method for test piece for metal microscope and test piece |
JPS6016361A (en) * | 1983-07-05 | 1985-01-28 | Toshiba Corp | Method of separating wafer |
Also Published As
Publication number | Publication date |
---|---|
JPH0351095Y2 (en) | 1991-10-31 |