JPS61193846A - Double-side metal lined plate for high-frequency circuit - Google Patents
Double-side metal lined plate for high-frequency circuitInfo
- Publication number
- JPS61193846A JPS61193846A JP3551585A JP3551585A JPS61193846A JP S61193846 A JPS61193846 A JP S61193846A JP 3551585 A JP3551585 A JP 3551585A JP 3551585 A JP3551585 A JP 3551585A JP S61193846 A JPS61193846 A JP S61193846A
- Authority
- JP
- Japan
- Prior art keywords
- double
- polyolefin
- high frequency
- frequency circuits
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 title claims description 38
- 239000002184 metal Substances 0.000 title claims description 38
- 229920000098 polyolefin Polymers 0.000 claims description 41
- 239000011888 foil Substances 0.000 claims description 18
- -1 polyethylene Polymers 0.000 claims description 10
- 239000004698 Polyethylene Substances 0.000 claims description 6
- 229920000573 polyethylene Polymers 0.000 claims description 6
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 5
- 150000007933 aliphatic carboxylic acids Chemical class 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 24
- 239000010408 film Substances 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000011521 glass Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 150000008064 anhydrides Chemical class 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 229920003020 cross-linked polyethylene Polymers 0.000 description 2
- 239000004703 cross-linked polyethylene Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920001179 medium density polyethylene Polymers 0.000 description 2
- 239000004701 medium-density polyethylene Substances 0.000 description 2
- 150000001451 organic peroxides Chemical class 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 235000021122 unsaturated fatty acids Nutrition 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical compound CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- 235000017399 Caesalpinia tinctoria Nutrition 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 241000388430 Tara Species 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229920005676 ethylene-propylene block copolymer Polymers 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 238000000386 microscopy Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000005673 monoalkenes Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920006113 non-polar polymer Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
［技術分野］
本発明は、宇宙衛星放送受信７ンテナ回路板、マイクロ
ス） ＋７ツプ超高周波回路板、宇宙衛星放送受信コン
バータ回路板、パーソナル無線用回路板、その他高周波
応用機器用回路板などとして用いられる高周波回路用両
面金属張板に関するものである。[Detailed Description of the Invention] [Technical Field] The present invention relates to a space satellite broadcast receiving 7 antenna circuit board, a microscopy +7 tup super high frequency circuit board, a space satellite broadcast receiving converter circuit board, a circuit board for personal radio, etc. This invention relates to a double-sided metal clad plate for high frequency circuits used as circuit boards for high frequency applied equipment.
【背景技術］
従来上りこの種の高周波用プリント回路板として用いら
れる高周波回路用金属張板としては、がラス基材テフロ
ン銅張板、ガラス基材架橋ポリエチレン銅張板、アルミ
ナセラミック基板などが知られている。しかしアルミナ
セラミック基板は誘電体損失（ｔａｎδ）が１０−４レ
ベルで高周波特性が優れてい゛るいるものの、５０Ｘ５
０ａ＋−程度が限度で大きな寸法のものを得ることがで
きず、用途に大きな制約がある。＊た〃ラス基板テア０
ン銅張板やガラス基板架橋ポリエチレン銅張板は、樹脂
部界面とガラス繊維の界面との開においで誘電損失が増
加し、ｔａｎδが大きくなって高周波伝送損失が大きい
という問題があり、しかもいずれも材料コストが高くて
民生用途において普及させることは難しいという問題も
ある。また上記ポリエチレン系の高周波用回路金属張板
においてはポリエチレンと回路を形成する金属箔との接
着性が極めて悪く、回路が剥離し易いという問題もあっ
た。[Background technology] Conventionally known metal clad boards for high frequency circuits used as this type of high frequency printed circuit boards include glass base Teflon copper clad boards, glass base crosslinked polyethylene copper clad boards, and alumina ceramic boards. It is being However, although the alumina ceramic substrate has a dielectric loss (tan δ) of 10-4 level and excellent high frequency characteristics, the 50×5
The limit is about 0a+-, and large dimensions cannot be obtained, and there are significant restrictions on the use. *Tara board tear 0
Copper clad boards and glass substrate cross-linked polyethylene copper clad boards have the problem that dielectric loss increases due to the opening between the resin part interface and the glass fiber interface, tan δ increases, and high frequency transmission loss increases. However, there is also the problem that the materials cost is high and it is difficult to popularize it for consumer use. Further, in the above-mentioned polyethylene-based high-frequency circuit metal clad board, there was a problem in that the adhesiveness between the polyethylene and the metal foil forming the circuit was extremely poor, and the circuit was easily peeled off.
【発明の目的Ｊ
本発明は、上記の点に鑑みて為されたものであり、ポリ
オレフィンを誘電体層として用いて誘電体損失が小さく
、しかも金属箔との接着性に優れると共に安価に形成で
きる高周波回路用両面金属張板を提供することを目的と
するものである。[Objective of the Invention J] The present invention has been made in view of the above points, and uses polyolefin as a dielectric layer to have low dielectric loss, excellent adhesion to metal foil, and can be formed at low cost. The object of the present invention is to provide a double-sided metal clad plate for high frequency circuits.
［発明の開示Ｊ
しかして本発明に係る高周波回路用両面金属張板は、無
極性ポリオレフィンの層３の表裏面にそれぞれ不飽和脂
肪族カルボン酸類で変性した変性ポリオレフィンの層２
，２を介して金属箔１，１を積層接着して成ることを特
徴とするものであり、以下本発明の詳細な説明する。[Disclosure of the Invention J] However, the double-sided metal clad plate for high frequency circuits according to the present invention has layers 2 of modified polyolefin modified with unsaturated aliphatic carboxylic acids on the front and back surfaces of the layer 3 of non-polar polyolefin, respectively.
, 2, the metal foils 1, 1 are laminated and bonded together.The present invention will be described in detail below.
本発明において、誘電体層を形成させるための樹脂とし
て、誘電体損失を下げるために、分子構造的には非極性
高分子を選択し、イオン伝導物質や分子内の不純な極性
基を減少させ、結晶性を増加させたものを用いるもので
、このような樹脂として無極性ポリオレフィンを採用す
るものである。In the present invention, in order to reduce dielectric loss, a non-polar polymer is selected in terms of molecular structure as the resin for forming the dielectric layer, and ion conductive substances and impure polar groups in the molecule are reduced. , a resin with increased crystallinity is used, and a nonpolar polyolefin is used as such a resin.
そしてこの無極性ポリオレフィンとしては、高密度ポリ
エチレン、中密度ポリエチレン、低密度ポリエチレン、
属領状低密度ポリエチレン、ポリプロピレン、ポリブテ
ン−１，４−メチルペンテンポリマーなどのモノオレフ
ィンポリマー類、エチレン−プロピレンコポリマー、エ
チレンープロピレンブロックコボリマー、エチレンブテ
ンコポリマーなどのオレフィンコポリマー類、及びこれ
らの混合物などを挙げることができ、なかでもポリエチ
レンを用いるのが好ましい、無極性ポリオレフィンは０
．５〜２ｍ−程度の厚みのフィルム（シート）として高
周波回路用両面金属張板の製造に供される。This non-polar polyolefin includes high density polyethylene, medium density polyethylene, low density polyethylene,
Monoolefin polymers such as polypropylene, polypropylene, polybutene-1,4-methylpentene polymer, olefin copolymers such as ethylene-propylene copolymer, ethylene-propylene block copolymer, ethylene butene copolymer, and mixtures thereof, etc. Among them, it is preferable to use polyethylene, and non-polar polyolefins include 0
．． It is used as a film (sheet) with a thickness of about 5 to 2 m to produce double-sided metal clad plates for high frequency circuits.
この無極性ポリオレフィンは誘電体損失が小さく誘電体
層として適しているものではあるが、無極性であるため
に金属箔に対する接着性が極めて悪い、そこで本発明で
は接着の層としてポリオレフィンを変性したものを用い
る。この変性ポリオレフィンは上記列挙したポリオレフ
ィン（特にポリエチレンが好ましい）を不飽和脂肪酸カ
ルボン酸やその無水物によって変性することで得られる
ものである。不飽和脂肪酸カルボン酸やその無水物とし
ては、マレイン酸、イタコン酸、シトラコン酸、アクリ
ル酸、無水マレイン酸、無水イタコン酸、無水シトラコ
ン酸が例示されるが、なかでも無水マレイン酸が最も好
ましい、変性の程度は、不飽和脂肪族カルボン酸やその
無水物に基づく含量がｏ、ｏ ｏ ｉ〜３重量％程度に
なるように設定するのがよい、＃に着の面から０．００
１重置％であることが必要である。ｐ＆水マレイン酸で
ポリオレフィンを変性する一例を示すと、無水マレイン
酸とポリオレフィンと有機過酸化物との混合物を押出し
機を用いて溶融混練することによって変性ポリオレフィ
ンを得ることができることになる。Although this non-polar polyolefin has a small dielectric loss and is suitable as a dielectric layer, since it is non-polar, its adhesion to metal foil is extremely poor.Therefore, in the present invention, a modified polyolefin is used as an adhesive layer. Use. This modified polyolefin is obtained by modifying the polyolefin listed above (polyethylene is particularly preferred) with an unsaturated fatty acid carboxylic acid or its anhydride. Examples of unsaturated fatty acid carboxylic acids and their anhydrides include maleic acid, itaconic acid, citraconic acid, acrylic acid, maleic anhydride, itaconic anhydride, and citraconic anhydride, of which maleic anhydride is most preferred. The degree of modification is preferably set so that the content based on unsaturated aliphatic carboxylic acids and their anhydrides is about 3% by weight.
It is necessary to have 1 overlapping %. To give an example of modifying a polyolefin with p&water maleic acid, a modified polyolefin can be obtained by melt-kneading a mixture of maleic anhydride, polyolefin, and organic peroxide using an extruder.
また有機過酸化物に代えて周期律表のＩＩ−ａ％Ｉ［［
ｌ１％ｌ属會属の酸化物や硫酸塩から選ばれたＳ機金属
化合物を０．１〜１０重量％用いてポリオレフィンの融
点以上の温度で反応させて得ることができる。この変性
ポリオレフィンは３０〜２００μ程度の厚みのフィルム
として高周波回路用両面金属張板の製造に供される。Also, instead of organic peroxides, II-a%I[[
It can be obtained by reacting 0.1 to 10% by weight of an S metal compound selected from oxides and sulfates belonging to the 11% genus at a temperature equal to or higher than the melting point of the polyolefin. This modified polyolefin is used as a film with a thickness of about 30 to 200 microns to produce double-sided metal clad plates for high frequency circuits.
また金属箔としては、厚み５〜１００μの銅、アルミニ
ウム、ニッケル、鉄、及びこれらの合金の箔体物、金属
ペーストの印刷薄膜などの電気良導笛体を用いることが
できる。Further, as the metal foil, an electrically conductive body such as a foil of copper, aluminum, nickel, iron, or an alloy thereof having a thickness of 5 to 100 μm, or a printed thin film of metal paste can be used.
しかして第２図に示すように、金属Ｎ１、変性ポリオレ
フィンのフィルム６．１ｍ性ポリオレフィンのフィルム
７、変性ポリオレフィンのフィルム６、金属Ｗｉ１をこ
の咳に重ね、これを２〜２０Ｋｇ／ａｍ”程度、１１０
〜１７０℃程度の条件で２〜２０分間程度加熱加圧する
ことによって、第１図に示すような誘電体層８となる無
極性ポリオレフィンの層３に変性ポリオレフィンの層２
，２を接着層として金属箔１．１を溶着ｆ／ｆｔＭｆ”
せ、高周波回路用両面金属張板を得ることができるもの
である。As shown in FIG. 2, the metal N1, the modified polyolefin film 6.1m, the modified polyolefin film 7, the modified polyolefin film 6, and the metal Wi1 are layered on top of this layer, and this is applied at a weight of about 2 to 20 kg/am''. 110
By heating and pressurizing for about 2 to 20 minutes at a temperature of ~170°C, the modified polyolefin layer 2 is added to the nonpolar polyolefin layer 3, which will become the dielectric layer 8 as shown in FIG.
, 2 as an adhesive layer and weld the metal foil 1.1 f/ftMf"
Thus, a double-sided metal clad plate for high frequency circuits can be obtained.
またこのように変性ポリオレフィンや無極性ポリオレフ
ィンをそれぞれフィルム６．７として用いるようにする
ほか、まず無極性ポリオレフィン層の両面に変性ポリオ
レフィン層を有する複合ポリオレフィンシートを同時押
出し方法やシート貼り合わせ方法などによって作成し、
これを金属Ｍ１゜１の闇にはさんで、後は上記と同様に
して加熱加圧することによって高周波回路用両面金属張
板を得るようにすることもでき、このようにすれば連続
的に製造をおこなうことが可能になるものである。この
ようにして得た高周波回路用両面金属張板は、金属Ｍ１
にエツチングなどによって常法に従ってプリント回路を
形成することによつて、高周波用の回路板として使用に
供されることになり、このとき一対の金属箔１．１のう
ち一方のみに回路を形成するようにすれば他方の金属箔
１は接地極として使用することができ、また一対の金属
箔１．１のそれぞれに回路を形成するようにすれば両面
回路板として用いることもできることになる。In addition to using modified polyolefin and non-polar polyolefin as the films 6 and 7, first, a composite polyolefin sheet having modified polyolefin layers on both sides of a non-polar polyolefin layer is prepared by co-extrusion method or sheet bonding method. make,
It is also possible to obtain a double-sided metal clad plate for high-frequency circuits by sandwiching this between two layers of metal M1゜1 and heating and pressurizing it in the same manner as above.In this way, it is possible to manufacture it continuously. This makes it possible to do the following. The double-sided metal clad plate for high frequency circuits obtained in this way has metal M1
By forming a printed circuit in a conventional manner by etching or the like, it can be used as a high frequency circuit board. At this time, a circuit is formed on only one of the pair of metal foils 1.1. In this way, the other metal foil 1 can be used as a ground electrode, and if a circuit is formed on each of the pair of metal foils 1.1, it can also be used as a double-sided circuit board.
上記のようにして得た高周波回路用両面金属張板にあっ
ては、ガラス繊維が基材となっておらず誘電体損失の小
さい無極性ポリオレフィンの層３が誘電体層８を構成す
るようになっているために、誘電体損失が小さく高周波
帯域における電気特性の優れた回路板を作成することが
できることにな□す、また無極性のまたは変性のポリオ
レフィンによって形成されるために材料コストを安価に
製造することができて、民生用途に１１！１ｆｆｌを広
げることが可能になるものである。そして誘電体層とな
ろ無極性ポリオレフィンの層３は極性を有するように変
性されたポリオレフィンの層２によって金属箔１に良好
に接着されることになり、金属箔１による回路が剥離し
たりするようなおそれがなくなるものである。In the double-sided metal clad plate for high frequency circuits obtained as described above, glass fiber is not used as a base material, and the dielectric layer 8 is composed of the non-polar polyolefin layer 3 with low dielectric loss. This makes it possible to create circuit boards with low dielectric loss and excellent electrical properties in high frequency bands, and the material cost is low because it is made of non-polar or modified polyolefin. This makes it possible to expand the range of 11!1ffl into consumer applications. The dielectric layer 3, which is made of non-polar polyolefin, is well adhered to the metal foil 1 by the layer 2 of polyolefin modified to have polarity, so that the circuit formed by the metal foil 1 does not peel off. Furthermore, this will eliminate that fear.
次ぎに実施例によって本発明を置体的に説明する。Next, the present invention will be explained in detail with reference to Examples.
無極性ポリオレフィンフィルムとして厚さ１−一の中密
度ポリエチレンシート（Ｌｉｎｅａｒ ＬＯ替−ｄｅ
ｎｓｉｔｉｙ Ｐ ｏｌｙｅｔｈｙｌｅｎｅ 密度
０．９３、メルトインデックスＭ、Ｉ、＝４）を用い、
これを変性ポリオレフィンフィルムとしての２枚の厚さ
７５μのエチレン−マレインｍａｎ合体フィルム（マレ
イン酸無水物含有量１重量％）闇にはさみ、さらに１８
μ厚の２枚の＃！笛の間にこれをはさんで、第２図と同
様な層構成に積層し、これを温度１３５℃、圧力２〜５
Ｋｇ／ａｍ”の条件で２〜３分間保持して一体化し、さ
らに冷却することによって高周波回路用両面金属張板を
作成した。A medium density polyethylene sheet with a thickness of 1-1 (Linear LO replacement-de) is used as a non-polar polyolefin film.
using polyethylene density 0.93 and melt index M, I = 4),
This was sandwiched between two 75μ thick ethylene-maleic man composite films (maleic anhydride content 1% by weight) as modified polyolefin films, and further 18
Two μ-thick #! This was sandwiched between whistles, laminated in a layered structure similar to that shown in Figure 2, and then heated at a temperature of 135℃ and a pressure of 2 to 5℃.
A double-sided metal clad plate for high frequency circuits was produced by holding the mixture for 2 to 3 minutes under the condition of ``Kg/am'' to integrate and further cooling.
このよう、にして得た高周波回路用両面金属張板につい
で各種特性を測定した結果を次表に示す。The results of measuring various properties of the double-sided metal clad plate for high frequency circuits thus obtained are shown in the following table.
次表の「処理条件」においてｒＡＪは受理状態のままを
、＊ タ例、ｔ １ｒｒＤ−２／１００」ハ１００ ’
Ｃノ蒸留水ニ画表の結果、本発明のものでは！１箔の接
着強度が優れ、誘電率や誘電正接の値として極めて小さ
いものが得られ、高周波特性が向上していることが確認
された。特に誘電率や誘電正接において第３図（ａ）（
ｂ）に示すように本発明のものは他の材料よりも着しく
優れることが確認される。第３図においてＡは〃ラスエ
ポキシ銅張板、Ｂはガラスポリイミド銅張板、Ｃはプラ
ステフロン銅張板、Ｄは本発明の実施例品を示す。In the "Processing conditions" in the table below, rAJ remains in the accepting state.
As a result of the C-distilled water chart, it is not the one of the present invention! It was confirmed that the adhesive strength of the 1 foil was excellent, the dielectric constant and dielectric loss tangent were extremely small, and the high frequency characteristics were improved. In particular, the dielectric constant and dielectric loss tangent are shown in Figure 3 (a) (
As shown in b), it is confirmed that the material of the present invention is significantly superior to other materials. In FIG. 3, A shows a lath epoxy copper clad board, B shows a glass polyimide copper clad board, C shows a plastyeflon copper clad board, and D shows an example product of the present invention.
［発明の効果１
上述のように本発明にあっては、無極性ポリオレフィン
の層の表裏面にそれぞれ不飽和脂肪族カルボンＲＭで変
性した変性ポリオレフィンの層を介して金属箔を積層接
着しであるので、ガラス繊維を基材としで用いることな
く誘電体損失の小さい無極性ポリオレフィンの層によっ
て高周波特性の優れた高周波回路用両面金属張板を得る
ことができるものであり、また無極性のまたは変性のポ
リオレフィンによって形成されるために材料コストを安
価に製造するごとができると共に、誘電体層となる無極
性ポリオレフィンの層は極性を有するように変性された
ポリオレフィンの層によって金属箔に良好に接着される
ことになり、金属箔による回路が剥離するようなおそれ
がないものである。[Effect of the invention 1 As described above, in the present invention, metal foil is laminated and bonded to the front and back surfaces of a layer of non-polar polyolefin through layers of modified polyolefin modified with unsaturated aliphatic carbon RM, respectively. Therefore, it is possible to obtain a double-sided metal-clad plate for high-frequency circuits with excellent high-frequency characteristics by using a layer of non-polar polyolefin with low dielectric loss without using glass fiber as a base material. The non-polar polyolefin layer that serves as the dielectric layer is well bonded to the metal foil by the polar polyolefin layer, which allows the material to be manufactured at low cost. Therefore, there is no risk that the circuit made of metal foil will peel off.
第１図は本発明の一実施例の断面図、第２図は同上の製
造の一工程における分解断面図、第３図（、）（ｂ）は
誘電率と誘電正接のグラフである。
１は金属箔、２は変性ポリオレフィンの層、３は無極性
ポリオレフィンの層である。FIG. 1 is a cross-sectional view of an embodiment of the present invention, FIG. 2 is an exploded cross-sectional view of one of the manufacturing steps of the same, and FIG. 3(a) is a graph of dielectric constant and dielectric loss tangent. 1 is a metal foil, 2 is a modified polyolefin layer, and 3 is a nonpolar polyolefin layer.
Claims (3)
飽和脂肪族カルボン酸類で変性した変性ポリオレフィン
の層を介して金属箔を積層接着して成ることを特徴とす
る高周波回路用両面金属張板。(1) A double-sided metal clad plate for high frequency circuits, characterized in that metal foil is laminated and bonded to the front and back surfaces of a nonpolar polyolefin layer through layers of modified polyolefin modified with unsaturated aliphatic carboxylic acids, respectively.
を特徴とする特許請求の範囲第１項記載の高周波回路用
両面金属張板。(2) The double-sided metal clad plate for high frequency circuits according to claim 1, wherein the nonpolar polyolefin is polyethylene.
ることを特徴とする特許請求の範囲第１項記載の高周波
回路用両面金属張板。(3) The double-sided metal clad plate for high frequency circuits according to claim 1, wherein the unsaturated aliphatic carboxylic acid is maleic anhydride.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3551585A JPS61193846A (en) | 1985-02-25 | 1985-02-25 | Double-side metal lined plate for high-frequency circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3551585A JPS61193846A (en) | 1985-02-25 | 1985-02-25 | Double-side metal lined plate for high-frequency circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61193846A true JPS61193846A (en) | 1986-08-28 |
Family
ID=12443888
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3551585A Pending JPS61193846A (en) | 1985-02-25 | 1985-02-25 | Double-side metal lined plate for high-frequency circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61193846A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0284939A2 (en) * | 1987-03-26 | 1988-10-05 | Nippon Petrochemicals Company, Limited | Finished laminates for high frequency circuits |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5175966A (en) * | 1974-12-25 | 1976-06-30 | Nitto Electric Ind Co | INSATSUKAIROYOKIBANMOSHIKUHAKAIRO |
| JPS5693541A (en) * | 1979-12-28 | 1981-07-29 | Mitsui Petrochemical Ind | Manufacture of laminated structure |
-
1985
- 1985-02-25 JP JP3551585A patent/JPS61193846A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5175966A (en) * | 1974-12-25 | 1976-06-30 | Nitto Electric Ind Co | INSATSUKAIROYOKIBANMOSHIKUHAKAIRO |
| JPS5693541A (en) * | 1979-12-28 | 1981-07-29 | Mitsui Petrochemical Ind | Manufacture of laminated structure |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0284939A2 (en) * | 1987-03-26 | 1988-10-05 | Nippon Petrochemicals Company, Limited | Finished laminates for high frequency circuits |
| EP0284939A3 (en) * | 1987-03-26 | 1990-01-10 | Nippon Petrochemicals Co., Ltd | Finished laminates for high frequency circuits |
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