JPS61191568A - Method of burning ceramic injection molded body - Google Patents
Method of burning ceramic injection molded bodyInfo
- Publication number
- JPS61191568A JPS61191568A JP2883785A JP2883785A JPS61191568A JP S61191568 A JPS61191568 A JP S61191568A JP 2883785 A JP2883785 A JP 2883785A JP 2883785 A JP2883785 A JP 2883785A JP S61191568 A JPS61191568 A JP S61191568A
- Authority
- JP
- Japan
- Prior art keywords
- molded body
- injection molded
- temperature
- ceramic injection
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims description 30
- 238000002347 injection Methods 0.000 title claims description 24
- 239000007924 injection Substances 0.000 title claims description 24
- 238000000034 method Methods 0.000 title claims description 11
- 239000010410 layer Substances 0.000 claims description 17
- 229920002050 silicone resin Polymers 0.000 claims description 16
- 239000000126 substance Substances 0.000 claims description 13
- 238000010304 firing Methods 0.000 claims description 11
- 239000012044 organic layer Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 2
- 229920006122 polyamide resin Polymers 0.000 claims description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 2
- -1 fluororesin Polymers 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 description 11
- 239000005416 organic matter Substances 0.000 description 7
- 239000000843 powder Substances 0.000 description 7
- 238000005336 cracking Methods 0.000 description 5
- 239000011368 organic material Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229910002113 barium titanate Inorganic materials 0.000 description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical group [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Landscapes
- Combustion Methods Of Internal-Combustion Engines (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、？ｌｉ子部品や自動車部品に用いられるセラ
ミック射出成形体の焼成方法に関するものである。[Detailed Description of the Invention] Industrial Field of Application What is the scope of the present invention? The present invention relates to a method for firing ceramic injection molded bodies used for Lithium ion parts and automobile parts.
従来の技術
従来、この種のセラミック射出成形体の焼成方法として
は、例えば、特公昭５９−３９７７５号公報に示されて
いるようにセラミック粉末と粘結用有機物を混合し、射
出成形して得られたセラミック射出成形体をｌｏ−３ａ
ｍＨｇ以下の減圧下で加熱して有機物を除去したのち、
さらに高温で焼成する方法などがある。BACKGROUND ART Conventionally, as a firing method for this type of ceramic injection molded body, for example, as shown in Japanese Patent Publication No. 59-39775, a ceramic powder and an organic substance for caking are mixed and the mixture is injection molded. The ceramic injection molded body
After removing organic matter by heating under reduced pressure of mHg or less,
There is also a method of firing at a higher temperature.
発明が解決しようとする問題点
このような従来の方法では、セラミック射出成形体中の
有機物除去のための加熱の際に、有機物の溶融が生じて
保形性が低下し、成形体の変形が生ずるといった問題が
あった。また、変形を防止するために、成形体をセラミ
ック敷粉中に埋込んだ状態で有機物除去のための加熱と
焼結のための高温加熱とを行なう方法も提案されている
が、焼成中にセラミック粉末が成形体と反応したり、成
形体の焼成のために必要な雰囲気が充分得られなかった
りして好しくなかった。Problems to be Solved by the Invention In such conventional methods, during heating to remove organic matter from a ceramic injection molded body, organic matter melts, reducing shape retention and causing deformation of the molded body. There was a problem that occurred. In addition, in order to prevent deformation, a method has been proposed in which the molded body is embedded in ceramic bedding powder and heated to remove organic matter and heated at high temperature for sintering. This was undesirable because the ceramic powder reacted with the molded body and a sufficient atmosphere required for firing the molded body could not be obtained.
本発明は、上記従来の問題点を解消するもので。The present invention solves the above-mentioned conventional problems.
保形用のセラミック敷粉を用いずに、変形、クラック及
び空孔等の発生を防止することができるセラミック射出
成形体の焼成方法′を提供することを目的とする。It is an object of the present invention to provide a method for firing a ceramic injection molded body that can prevent deformation, cracks, pores, etc. from occurring without using a shape-retaining ceramic bedding powder.
問題点を解決するための手段
上記問題点を解決するために１本発明のセラミック射出
成形体の焼成方法は、粘結用有機物を含有するセラミッ
ク射出成形体を開口を有する耐熱性有機物層で被覆した
後、第１の温度まで加熱して粘結用有機物を除去し、さ
らに第１の温度よりも高い第２の温度まで加熱して耐熱
性有機物層を除去し、最後に第２の温度よりも高い第３
の温度まで加熱して成形体を焼結させるものである。Means for Solving the Problems In order to solve the above problems, the method for firing a ceramic injection molded body of the present invention includes coating a ceramic injection molded body containing a caking organic substance with a heat-resistant organic layer having openings. After that, it is heated to a first temperature to remove the caking organic substance, further heated to a second temperature higher than the first temperature to remove the heat-resistant organic substance layer, and finally heated to a temperature higher than the second temperature. Also high 3rd
The molded body is sintered by heating to a temperature of .
作用
上記力・法においては、耐熱性有機物層によりセラミッ
ク射出成形体を覆うことにより、第１の温度の加熱によ
り粘結用有機物が軟化もしくは溶融して成形体の強度が
低下しても、成形体は変形しない。また、溶融した粘結
用有機物は耐熱性有機物層の開口から充分飛散させるこ
とができる。さらに、耐熱性有機物層は、第１の温度よ
りも高い第２の温度で熱処理することにより除去できる
。In the above-mentioned force/method, by covering the ceramic injection molded body with a heat-resistant organic substance layer, even if the caking organic substance softens or melts due to heating at the first temperature and the strength of the molded body decreases, the molding will continue. The body does not transform. Furthermore, the molten caking organic substance can be sufficiently scattered through the openings of the heat-resistant organic substance layer. Furthermore, the heat-resistant organic layer can be removed by heat treatment at a second temperature higher than the first temperature.
この結果、焼成過程において変形、クラック、空孔等が
発生することなく良好な焼結体が得られる。As a result, a good sintered body can be obtained without deformation, cracks, holes, etc. occurring during the firing process.
実施例 以下、本発明の一実施例を添付図面に基づき説明する。Example Hereinafter, one embodiment of the present invention will be described based on the accompanying drawings.
セラミック粉末として平均粒径１．２μｍのチタン酸バ
リウム系半導体セラミック原料を用い、これにポリスチ
レン及びアタクチックプロピレンとパラフィンから成る
熱可塑性樹脂を粘結用有機物として１８．５ｗｔ％添加
し、２００℃で１時間ニーダ中で加熱混練した後、押出
し成形機により４ｍＪ’Ｘ１０■１のペレット状に成形
した。次に、このペレットを用い射出成形機により１８
０℃、８００ｋｇ／（ｊにて射出成形し、外径３０■、
内径１５閤、厚さ８■のリング状セラミック射出成形体
を作製した。かかるセラミック射出成形体を耐熱性有機
物であるシリコン樹脂中に浸漬し１時間硬化させた後、
一方のシリコン樹脂面を研磨除去し第１図に示すような
試料を作製した。同図において（１）はリング状セラミ
ック射出成形体、（２）は開口を有するシリコン樹脂層
（耐熱性有機物層）である０次に、シリコン樹脂層（２
）で被覆したセラミック射出成形体（１）を８℃／ｈｒ
の昇温速度で２６０℃まで昇温した後。A barium titanate semiconductor ceramic raw material with an average particle size of 1.2 μm was used as the ceramic powder, and 18.5 wt% of a thermoplastic resin consisting of polystyrene, atactic propylene, and paraffin was added as a caking organic substance, and the mixture was heated at 200°C. After heating and kneading in a kneader for 1 hour, the mixture was molded into pellets of 4 mJ' x 10 cm by an extruder. Next, using this pellet, an injection molding machine is used to make 18
Injection molded at 0℃, 800kg/(j, outer diameter 30cm,
A ring-shaped ceramic injection molded body having an inner diameter of 15 cm and a thickness of 8 cm was produced. After immersing such a ceramic injection molded body in silicone resin, which is a heat-resistant organic material, and curing it for one hour,
One silicone resin surface was removed by polishing to prepare a sample as shown in FIG. In the figure, (1) is a ring-shaped ceramic injection molded body, (2) is a silicone resin layer (heat-resistant organic material layer) having an opening, and a silicone resin layer (2).
) The ceramic injection molded body (1) coated with
After raising the temperature to 260°C at a heating rate of .
その温度にて４時間保ち、射出成形に用いた粘結用有機
物を加熱除去した０次に、８℃／ｈｒの昇温速度で４０
０℃まで昇温した後、その温度にて２時間保ちシリコン
樹脂層（２）を飛散除去した。最後に、２００℃／ｈｒ
の昇温速度で１３００℃まで昇温し、１時間１３００℃
を保った後、１００℃／ｈｒの速度で冷却して試料！を
作製した。なお、粘結用有機物及びシリコン樹脂層（２
）の除去の際には、０．１ｒｎ’／ｓｉｎの空気流中で
処理した。一方、比較例としてシリコン樹脂層で全面被
覆したセラミック射出成形体についても同じ温度スケジ
ュールにて焼成し試料２を作製した。また、シリコン樹
脂で被覆しないセラミック射出成形体について昇温速度
を８℃／ｈｒ及び２℃／ｈｒとする温度スケジュールに
て焼成し試料３．４を作製した。The temperature was maintained at that temperature for 4 hours, and the caking organic substances used in injection molding were removed by heating.
After raising the temperature to 0° C., it was kept at that temperature for 2 hours to scatter and remove the silicone resin layer (2). Finally, 200℃/hr
Raise the temperature to 1,300℃ at a heating rate of 1,300℃ for 1 hour.
After maintaining the temperature, the sample is cooled at a rate of 100°C/hr. was created. In addition, the organic matter for caking and the silicone resin layer (2
) was removed in an air flow of 0.1 rn'/sin. On the other hand, as a comparative example, a ceramic injection molded body whose entire surface was covered with a silicone resin layer was also fired at the same temperature schedule to prepare Sample 2. In addition, Sample 3.4 was prepared by firing a ceramic injection molded body not coated with silicone resin using a temperature schedule in which the heating rate was 8° C./hr and 2° C./hr.
以上のようにして得られた焼結体の目視による変形及び
クラックの発生を確認した結果を第１表に示す。Table 1 shows the results of visually confirming the deformation and cracking of the sintered bodies obtained as described above.
第１表
第１表において、例えば３／ｌＯは、１０個中２個に変
形もしくはクラックが発生したことを示している。同表
より明らかなように、セラミック射出成形体を、シリコ
ン樹脂層により開口を有するように被覆することにより
変形及びクラックのない良好な焼結体を効率的に得るこ
とができる。すなわち、従来のように、何ら被覆を施こ
さず、通常の昇温速度（８℃／ｈｒ）で焼成した場合（
試料３）、変形及びクラックの発生が著しい。また、シ
リコン樹脂層により全面を被覆した場合（試料２）には
、粘結用有機物がシリコン樹脂層の分解飛散時まで飛散
除去されず、シリコン樹脂層の分解と同時に急激に飛散
するためにクラックの発生が著しくなる。In Table 1, for example, 3/lO indicates that deformation or cracking occurred in 2 out of 10 pieces. As is clear from the table, by covering the ceramic injection molded body with a silicone resin layer so as to have openings, a good sintered body free from deformation and cracks can be efficiently obtained. That is, when fired at the normal temperature increase rate (8°C/hr) without any coating as in the past (
Sample 3) shows significant deformation and cracking. In addition, when the entire surface is covered with a silicone resin layer (sample 2), the caking organic matter is not scattered and removed until the silicone resin layer decomposes and scatters, and cracks occur because it rapidly scatters at the same time as the silicone resin layer decomposes. The occurrence of this becomes significant.
なお、従来のように何ら被覆を施こさずとも、粘結用有
機物の急激な分解飛散を防ぐために昇温速度を遅くした
場合（試料４）には、変形及びクラックの発生を減らす
ことはできるが、焼成に長時間を要する。Furthermore, even if no coating is applied as in the conventional case, deformation and cracking can be reduced if the heating rate is slowed down (Sample 4) to prevent the rapid decomposition and scattering of the caking organic matter. However, it takes a long time to bake.
なお、本実施例では耐熱性有機物としてシリコン樹脂を
用いたが、フッ素樹脂、ポリアミド樹脂、ポリフェニレ
ンサルファイド樹脂等を用いても同様の効果が得られる
ことは言うまでもない。また、セラミック粉末としてチ
タン酸バリウム系半導体セラミック材料を用いたが、炭
化ケイ素や酸化ジルコニウム等の他のセラミック粉末を
用いても同様の効果が得られる。Although silicone resin was used as the heat-resistant organic material in this example, it goes without saying that similar effects can be obtained by using fluororesin, polyamide resin, polyphenylene sulfide resin, or the like. Moreover, although barium titanate-based semiconductor ceramic material is used as the ceramic powder, similar effects can be obtained by using other ceramic powders such as silicon carbide or zirconium oxide.
発明の効果
以上述べたごとく本発明によれば、セラミック射出成形
体を開口を有するシリコン樹脂等の耐熱性有機物層によ
り被覆し、粘結用有機物除去時の軟化分解による変形や
クラックの発生を防止するとともに、焼成時間を短縮す
ることができるという効果が得られる。Effects of the Invention As described above, according to the present invention, a ceramic injection molded body is coated with a heat-resistant organic material layer such as a silicone resin having openings, thereby preventing deformation and cracking due to softening and decomposition during removal of the caking organic material. At the same time, the effect of shortening the firing time can be obtained.
第１図は本発明の一実施例におけるシリコン樹脂層によ
り被覆されたセラミック射出成形体の断面図である。
（１）・・・セラミック射出成形体、（２）・・・耐熱
性有機物層（シリコン樹脂層）FIG. 1 is a sectional view of a ceramic injection molded body covered with a silicone resin layer in one embodiment of the present invention. (1) Ceramic injection molded body, (2) Heat-resistant organic layer (silicon resin layer)
Claims (1)
口を有する耐熱性有機物層で被覆した後、第１の温度ま
で加熱して粘結用有機物を除去し、さらに第１の温度よ
りも高い第２の温度まで加熱して耐熱性有機物層を除去
し、最後に第２の温度よりも高い第３の温度まで加熱し
て成形体を焼結させるセラミック射出成形体の焼成方法
。 ２、耐熱性有機物層が、シリコン樹脂、フッ素樹脂、ポ
リアミド樹脂、ポリフェニレンサルファイド樹脂のいず
れかでなる特許請求の範囲第１項に記載のセラミック射
出成形体の焼成方法。[Scope of Claims] 1. A ceramic injection molded body containing a caking organic substance is coated with a heat-resistant organic substance layer having openings, and then heated to a first temperature to remove the caking organic substance; The ceramic injection molded body is heated to a second temperature higher than the first temperature to remove the heat-resistant organic layer, and finally heated to a third temperature higher than the second temperature to sinter the molded body. Firing method. 2. The method for firing a ceramic injection molded body according to claim 1, wherein the heat-resistant organic layer is made of silicone resin, fluororesin, polyamide resin, or polyphenylene sulfide resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2883785A JPS61191568A (en) | 1985-02-16 | 1985-02-16 | Method of burning ceramic injection molded body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2883785A JPS61191568A (en) | 1985-02-16 | 1985-02-16 | Method of burning ceramic injection molded body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61191568A true JPS61191568A (en) | 1986-08-26 |
Family
ID=12259482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2883785A Pending JPS61191568A (en) | 1985-02-16 | 1985-02-16 | Method of burning ceramic injection molded body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61191568A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0273982A1 (en) * | 1986-07-01 | 1988-07-13 | MITSUI TOATSU CHEMICALS, Inc. | Process for removing additive from powder molding |
-
1985
- 1985-02-16 JP JP2883785A patent/JPS61191568A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0273982A1 (en) * | 1986-07-01 | 1988-07-13 | MITSUI TOATSU CHEMICALS, Inc. | Process for removing additive from powder molding |
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