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JPS61189545A - Liquid resist coating roller - Google Patents

Liquid resist coating roller

Info

Publication number
JPS61189545A
JPS61189545A JP3188485A JP3188485A JPS61189545A JP S61189545 A JPS61189545 A JP S61189545A JP 3188485 A JP3188485 A JP 3188485A JP 3188485 A JP3188485 A JP 3188485A JP S61189545 A JPS61189545 A JP S61189545A
Authority
JP
Japan
Prior art keywords
resist
roller
coating roller
coating
resist coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3188485A
Other languages
Japanese (ja)
Inventor
Shigeru Nishizawa
西沢 茂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP3188485A priority Critical patent/JPS61189545A/en
Publication of JPS61189545A publication Critical patent/JPS61189545A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Coating Apparatus (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 〔概要〕 本発明はプリント基板上を転がりながら該基板に液状レ
ジストを塗布するレジスト塗布装置に11点備された液
状レジスト塗布ローラの改良に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Summary] The present invention relates to an improvement in a liquid resist coating roller provided in a resist coating device with 11 points, which coats a liquid resist onto a printed circuit board while rolling over the substrate.

本発明による液状レジスト塗布ローラは、°該ローラの
外周面に設けられたレジスト供給溝が螺旋状の溝型に形
成された点に特徴があり、該塗布ローラの外周面に付着
した液状レジストは塗布ローラの回転につれて螺旋型レ
ジスト供給溝のピッチ方向へ送られプリント基板面と逐
次接触しながらレジスト塗布を行うため塗布ムラが発生
しないといった利点がある。
The liquid resist application roller according to the present invention is characterized in that the resist supply groove provided on the outer peripheral surface of the roller is formed in a spiral groove shape, and the liquid resist adhered to the outer peripheral surface of the application roller is As the coating roller rotates, it is sent in the pitch direction of the spiral resist supply groove and the resist is coated while successively contacting the printed circuit board surface, which has the advantage that uneven coating does not occur.

〔産業上の利用分野〕[Industrial application field]

最近のプリント基板は益々大型化し、且つ部品実装密度
も高(なっている。従って、配線パターン精度の向上要
求に伴ってレジスト塗布工程におけるレジストの塗布精
度、特に“塗すムラ”に関する品質要求が厳しくなって
きている。
Recently, printed circuit boards have become larger and larger, and the density of component mounting has also increased. Therefore, along with the demand for improved wiring pattern accuracy, quality requirements regarding resist coating accuracy in the resist coating process, especially regarding "coating unevenness", have increased. It's getting tougher.

本発明は上記の要望に応えるべく開発された塗すムラ防
止用のレジスト塗布ローラに関する。
The present invention relates to a resist coating roller for preventing uneven coating, which was developed to meet the above-mentioned needs.

〔従来の技術〕[Conventional technology]

第2図は従来のレジスト塗布部の構造例を示す要部斜視
図、第3図(a)は塗布ローラの外周面に形成されたレ
ジスト供給溝の形態を示す模式図、(blはレジスト供
給溝の形状例を示す要部断面図である。
FIG. 2 is a perspective view of main parts showing an example of the structure of a conventional resist coating section, FIG. 3(a) is a schematic diagram showing the form of resist supply grooves formed on the outer peripheral surface of the coating roller, FIG. 3 is a cross-sectional view of a main part showing an example of the shape of a groove.

第2図に示す如(、装置のレジスト塗布部は、矢印へ方
向に回動してプリント基板2を矢印B方向へ搬送する基
板搬送ローラ1と、搬送されるプリン)M板2に接触し
て矢印A゛方向回転しながら該基板2に液状レジスト5
を塗布するレジスト塗布ローラ3と、液状レジスト5を
前記塗布ローラ3と従動ローラ7との間に供給するレジ
スト供給ノズル6とによって構成されている。
As shown in FIG. 2, the resist coating section of the apparatus contacts the M board 2 (the board conveying roller 1 rotates in the direction of the arrow and conveys the printed circuit board 2 in the direction of arrow B, and the printed circuit board being conveyed). The liquid resist 5 is applied to the substrate 2 while rotating in the direction of arrow A.
The resist supply nozzle 6 includes a resist application roller 3 that applies liquid resist 5, and a resist supply nozzle 6 that supplies liquid resist 5 between the application roller 3 and the driven roller 7.

従動ローラ7はレジスト塗布ローラ3の外周面と接触し
ており、該ローラ3に従動して回転しながら前記液状レ
ジスト5を均一な厚さに圧延して塗布ローラ3の外周面
へ付着させる。
The driven roller 7 is in contact with the outer circumferential surface of the resist coating roller 3, and while rotating following the roller 3, the liquid resist 5 is rolled to a uniform thickness and adhered to the outer circumferential surface of the coating roller 3.

そしてレジスト塗布ローラ3は上記手段によって外周面
に付着したレジスト5をプリント基板2と圧接すること
によって該基板5に転写する。
Then, the resist application roller 3 transfers the resist 5 adhered to the outer circumferential surface by the above-mentioned means onto the printed circuit board 2 by pressing the resist 5 into contact with the printed circuit board 2 .

前記レジスト塗布ローラ3にはレジスト供給溝4として
第3図(alに示す如き複数の平行型独立溝4aが形成
されているので、該:a4a内に溜められたレジスト5
は前述せる塗布ローラ3と基板2との圧接により外部へ
押し出されてプリント基板2側に転写塗布される。
The resist coating roller 3 is formed with a plurality of parallel independent grooves 4a as resist supply grooves 4 as shown in FIG.
is pushed out by the aforementioned pressure contact between the coating roller 3 and the substrate 2, and is transferred and coated onto the printed circuit board 2 side.

第3図fbl 4*レジスト塗布ローラ3の外周面に設
けられたレジスト供給溝4の一形状例を示す断面図であ
って、該供給溝4は平行等間隔に且つ塗布ローラ3の中
心0を中心とする同心円状に複数条形成されている。
FIG. 3 is a cross-sectional view showing an example of the shape of resist supply grooves 4 provided on the outer circumferential surface of the resist coating roller 3, and the supply grooves 4 are arranged parallel to each other at equal intervals and centered around the center 0 of the coating roller 3. Multiple strips are formed concentrically around the center.

なお上記レジスト塗布ローラ3は一般に弾性体材で且つ
レジスト5と良く馴染む材料、例えばブチルゴム等で製
作される。
The resist coating roller 3 is generally made of an elastic material and a material that blends well with the resist 5, such as butyl rubber.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

然しなから上記従来のレジスト塗布ローラのレジスト供
給溝4は、第3図(a)で説明したように同心円平行型
の独立溝4aで形成されているのでプリント基板2上で
はレジスト5の左右への流動が殆ど行われないため、溝
部つまり凹部と表面部つまり凸部とでは基板2に対する
レジスト5の塗布量に差が生じ、基板2表面に縦縞模様
の塗すムラ8が発生する。また、 該塗りムラ8はレジスト5の付着厚さの濃淡を示すもの
で、レジスト膜の平坦性が悪く、パターン精度が低下す
るのみならずレジスト膜の剥離事故等にも発展する危険
性がある。
However, as explained in FIG. 3(a), the resist supply grooves 4 of the conventional resist coating roller are formed of concentric parallel independent grooves 4a, so that on the printed circuit board 2, the resist supply grooves 4 are formed to the left and right of the resist 5. Since almost no flow occurs, there is a difference in the amount of resist 5 applied to the substrate 2 between the grooves, ie, recesses, and the surface, ie, protrusions, resulting in uneven coating 8 in a vertical striped pattern on the surface of the substrate 2. Furthermore, the coating unevenness 8 indicates the density of the adhesion thickness of the resist 5, and the flatness of the resist film is poor, which not only reduces the pattern accuracy but also poses a risk of developing a resist film peeling accident. .

本発明はレジスト塗布時における最大の問題点である上
記塗りムラ現象を回避するためになされたものである。
The present invention has been made in order to avoid the above-mentioned uneven coating phenomenon, which is the biggest problem during resist coating.

〔問題点を解決するための手段〕[Means for solving problems]

上記問題点は塗布ローラの外周面に設けられたレジスト
供給溝が、螺旋状の連続した溝型に形成されたことを特
徴とする液状レジスト塗布ローラの提供によって解決さ
れる。
The above problem can be solved by providing a liquid resist coating roller characterized in that the resist supply groove provided on the outer peripheral surface of the coating roller is formed in a continuous spiral groove shape.

〔作用〕[Effect]

本発明の液状レジスト塗布ローラは外周面のレジスト供
給溝が螺旋状に形成されているため、レジストがプリン
ト基板の面上を右または左方向へ流動(移動方向は螺旋
の形成方向によって決まることになる)しながら塗布さ
れて行くので塗りムラの発生が的確に防止される。
In the liquid resist application roller of the present invention, the resist supply groove on the outer peripheral surface is formed in a spiral shape, so that the resist flows to the right or left on the surface of the printed circuit board (the direction of movement is determined by the direction in which the spiral is formed). Since the coating is applied while the coating is being applied, the occurrence of uneven coating can be accurately prevented.

〔実施例〕〔Example〕

以下本発明の実施例を図面によって詳述する。 Embodiments of the present invention will be described in detail below with reference to the drawings.

第1図は本発明による液状レジスト塗布ローラの一実施
例を示す図であって、(a)は斜視図、(b)は塗布ロ
ーラの外周面に形成されたレジスト供給溝の形態を示す
模式図である。
FIG. 1 is a diagram showing an embodiment of a liquid resist application roller according to the present invention, in which (a) is a perspective view, and (b) is a schematic diagram showing the form of resist supply grooves formed on the outer peripheral surface of the application roller. It is a diagram.

なお全図を通じて同一符号は同一対象物を示すものとす
る。
Note that the same reference numerals indicate the same objects throughout the figures.

同図(a)に示す如く本発明のレジスト塗布ローラ3は
、レジスト供給溝4の形状が例えば8点を起点としE点
を終点とする螺旋型連続溝4bに形成されている点に特
徴がある。
As shown in FIG. 3(a), the resist coating roller 3 of the present invention is characterized in that the resist supply groove 4 is formed into a continuous spiral groove 4b starting from point 8 and ending at point E, for example. be.

このため矢印B方向へ搬送されるプリント基板2に接触
して矢印A”方向へ回動するレジスト塗布ローラ3によ
り塗布されるレジストは、螺旋型連続溝4bに沿って矢
印C方向へと流動しながらプリント基板2に塗布されて
行くので塗りムラを生じることはない。
Therefore, the resist applied by the resist coating roller 3, which contacts the printed circuit board 2 being conveyed in the direction of arrow B and rotates in the direction of arrow A'', flows in the direction of arrow C along the spiral continuous groove 4b. However, since it is applied to the printed circuit board 2, uneven coating does not occur.

螺旋型連続溝4hは同図(blに示す如く塗布ローラ3
の外周面に等間隔で螺旋状に形成され、その断面形状は
第3図(b)の場合と同様である。
The spiral continuous groove 4h is connected to the coating roller 3 as shown in the same figure (bl).
are spirally formed at equal intervals on the outer circumferential surface of , and the cross-sectional shape is the same as that shown in FIG. 3(b).

なお前記螺旋型連続溝4bの螺旋形成方向や始点S及び
終点Eの位置等は装置のレイアウトに応じて適宜決定す
れば良いことはいうまでもない。
It goes without saying that the spiral forming direction of the spiral continuous groove 4b, the positions of the starting point S and the ending point E, etc. may be determined as appropriate depending on the layout of the device.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明による液状レジスト塗布ロー
ラは、ローラの外周面に設けた螺旋型連続溝によってレ
ジストがプリント基板に均等に付着する構造であるため
、塗布ムラを的確に防止し得るといった効果類る大なる
ものである。
As explained above, the liquid resist application roller according to the present invention has a structure in which the resist is evenly adhered to the printed circuit board by the spiral continuous groove provided on the outer peripheral surface of the roller, and therefore has the effect of accurately preventing uneven application. It is something of a similar magnitude.

【図面の簡単な説明】[Brief explanation of drawings]

第1図(a)および(blは本発明による液状レジスト
塗布ローラの一実施例を示す図であって、f8)は斜視
図、(b)は塗布ローラの外周面に形成されたレジスト
供給溝の形態を示す模式図、 第2図は従来のレジスト塗布部の構造例を示す要部斜視
図、 第3図(alおよび(blは従来のレジスト塗布ローラ
の溝形状を示す図であって、(alは塗布ローラの外周
面に形成されたレジスト供給溝の形態を示す模式図、(
b)はレジスト供給溝の形状例を示す要部断面図である
。 図中、1は基板搬送ローラ、2はプリント基板、3はレ
ジスト塗布ローラ、4はレジスト供給溝、4aは平行型
独立溝、4bは螺旋型連続溝、5は液状レジスト、6は
レジスト供給ノズル、7は従動ローラ、8は塗りムラ、
Oは塗布ローラの中心、Sは螺旋型連続溝の始点、Eは
同じく終点をそれぞれ示す。 (Q) (b) 第1図 す1.上め乙ヲ°゛スト璧しPr * /1j!kmイ
列第2図 4毛璋4インモ0−ラi鼻形猷゛を才1磨第3図
FIGS. 1(a) and 1(bl) are views showing one embodiment of a liquid resist coating roller according to the present invention, f8 is a perspective view, and FIG. 1(b) is a resist supply groove formed on the outer peripheral surface of the coating roller. FIG. 2 is a perspective view of a main part showing an example of the structure of a conventional resist coating section; FIG. 3 is a diagram showing the groove shape of a conventional resist coating roller; (Al is a schematic diagram showing the form of the resist supply groove formed on the outer peripheral surface of the coating roller, (
b) is a sectional view of a main part showing an example of the shape of a resist supply groove. In the figure, 1 is a substrate conveyance roller, 2 is a printed circuit board, 3 is a resist coating roller, 4 is a resist supply groove, 4a is a parallel independent groove, 4b is a spiral continuous groove, 5 is a liquid resist, and 6 is a resist supply nozzle. , 7 is a driven roller, 8 is uneven coating,
O indicates the center of the application roller, S indicates the start point of the spiral continuous groove, and E indicates the end point. (Q) (b) Figure 1.1. Above all, I will strike Pr * /1j! km i row 2nd figure 4 mao 4 inmo 0-rai i nose shaped fox figure 3

Claims (1)

【特許請求の範囲】[Claims]  液状レジストをプリント基板側へ転写して塗布を行う
レジスト塗布装置の塗布ローラであって、該レジスト塗
布ローラの外周面に設けられたレジスト供給溝が、螺旋
状の連続した溝型に形成されてなることを特徴とする液
状レジスト塗布ローラ。
A coating roller of a resist coating device that transfers and coats a liquid resist onto a printed circuit board, wherein a resist supply groove provided on an outer peripheral surface of the resist coating roller is formed in a spiral continuous groove shape. A liquid resist coating roller characterized by:
JP3188485A 1985-02-19 1985-02-19 Liquid resist coating roller Pending JPS61189545A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3188485A JPS61189545A (en) 1985-02-19 1985-02-19 Liquid resist coating roller

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3188485A JPS61189545A (en) 1985-02-19 1985-02-19 Liquid resist coating roller

Publications (1)

Publication Number Publication Date
JPS61189545A true JPS61189545A (en) 1986-08-23

Family

ID=12343459

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3188485A Pending JPS61189545A (en) 1985-02-19 1985-02-19 Liquid resist coating roller

Country Status (1)

Country Link
JP (1) JPS61189545A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH044065A (en) * 1990-04-18 1992-01-08 Kemikaraijingu Kenkyusho:Kk Device for applying liquid
JP2009226371A (en) * 2008-03-25 2009-10-08 Fujifilm Corp Coating method and apparatus
CN103143479A (en) * 2013-03-27 2013-06-12 苏州裕同印刷有限公司 Gluing unit of CTP (Computer To Plate)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH044065A (en) * 1990-04-18 1992-01-08 Kemikaraijingu Kenkyusho:Kk Device for applying liquid
JP2009226371A (en) * 2008-03-25 2009-10-08 Fujifilm Corp Coating method and apparatus
CN103143479A (en) * 2013-03-27 2013-06-12 苏州裕同印刷有限公司 Gluing unit of CTP (Computer To Plate)

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