JPS61189111U - - Google Patents
Info
- Publication number
- JPS61189111U JPS61189111U JP7171485U JP7171485U JPS61189111U JP S61189111 U JPS61189111 U JP S61189111U JP 7171485 U JP7171485 U JP 7171485U JP 7171485 U JP7171485 U JP 7171485U JP S61189111 U JPS61189111 U JP S61189111U
- Authority
- JP
- Japan
- Prior art keywords
- base material
- heating element
- view
- thermal conductivity
- large number
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 238000005034 decoration Methods 0.000 claims 1
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Central Heating Systems (AREA)
Description
第１図は本考案の一実施例の一部の断面図、第
２図及び第３図はそれぞれ本考案の他の実施例の
一部の断面図と一部切欠斜視図、第４図は同上の
斜視図、第５図は同上の施工状態の一部の断面図
、第６図は床の全体を示す縮小平面図、第７図及
び第８図はそれぞれ従来例を示す一部の断面図で
ある。
１は基材、２は発熱体、３は熱伝導材である。
FIG. 1 is a sectional view of a part of an embodiment of the present invention, FIGS. 2 and 3 are a sectional view and a partially cutaway perspective view of another embodiment of the invention, respectively, and FIG. A perspective view of the same as above, FIG. 5 is a cross-sectional view of a part of the same as above in the construction state, FIG. 6 is a reduced plan view showing the entire floor, and FIGS. 7 and 8 are a cross-sectional view of a part of the conventional example. It is a diagram. 1 is a base material, 2 is a heating element, and 3 is a heat conductive material.
Claims (1)
し、発熱体に下端部が接触する熱伝導性の良好な
多数本の熱伝導材を基材内に埋入させて成る床暖
房パネル。 A floor heating panel consisting of a heating element laminated on the bottom surface of a base material with surface decoration, and a large number of thermally conductive materials with good thermal conductivity embedded in the base material, the lower ends of which are in contact with the heating element. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7171485U JPS61189111U (en) | 1985-05-15 | 1985-05-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7171485U JPS61189111U (en) | 1985-05-15 | 1985-05-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61189111U true JPS61189111U (en) | 1986-11-26 |
Family
ID=30609456
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7171485U Pending JPS61189111U (en) | 1985-05-15 | 1985-05-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61189111U (en) |
-
1985
- 1985-05-15 JP JP7171485U patent/JPS61189111U/ja active Pending