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JPS61186475A - Production of thin metallic film - Google Patents

Production of thin metallic film

Info

Publication number
JPS61186475A
JPS61186475A JP2694185A JP2694185A JPS61186475A JP S61186475 A JPS61186475 A JP S61186475A JP 2694185 A JP2694185 A JP 2694185A JP 2694185 A JP2694185 A JP 2694185A JP S61186475 A JPS61186475 A JP S61186475A
Authority
JP
Japan
Prior art keywords
substrate
polymer substrate
vapor deposition
lengths
wrinkles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2694185A
Other languages
Japanese (ja)
Inventor
Kazuyoshi Honda
和義 本田
Ryuji Sugita
龍二 杉田
Kiyokazu Touma
清和 東間
Taro Nanbu
太郎 南部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2694185A priority Critical patent/JPS61186475A/en
Publication of JPS61186475A publication Critical patent/JPS61186475A/en
Pending legal-status Critical Current

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  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)

Abstract

PURPOSE:To prevent the generation of wrinkles and to form stably a thin metallic film on a long-sized high-polymer substrate by separating the long-sized high-polymer substrate traveling on a can to multiple lengths and forming the thin metallic film over the entire width of a part of such lengths. CONSTITUTION:The long-sized high-polymer substrate 7 travels along the can 8. The substrate 7 contacts tightly with the can 8 at the same instant when the thin metallic film begins to be formed on the substrate 7 by the impression of the voltage to a bias roller 11. The thermal damage of the substrate 7 is thus prevented. Shearing blades 12 are provided in the mid-way from an unwinding system 6 toward the can 8 to cut the substrate 7 plural lengths such as three lengths; one length for the main part for vapor deposition and two lengths for the part including margins. The generation of the wrinkles is eliminated from the difference in thermal load between the main part for vapor deposition and the margin parts. The film deposited by evaporation is thus formed on the main part for vapor deposition without the wrinkles.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は長尺高分子基板上に金属薄膜を形成するだめの
製造方法に関する。
DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method of manufacturing a device for forming a thin metal film on a long polymer substrate.

従来の技術 真空蒸着法(イオンブレーティング法を含む)は金属薄
膜を高速に精度良く形成する手段として広く用いられて
いる。長尺高分子基板上に連続的に金属薄膜を形成する
場合には、第4図に示す様に、真空槽1中に長尺高分子
基板用の搬送系を設け、途中の蒸着用のキャン8に沿っ
て高分子基板7が走行している時に金属薄膜の蒸着形成
を行ない、巻取り系14に巻取る方法が一般的である。
2. Description of the Related Art Vacuum deposition methods (including ion blating methods) are widely used as means for forming metal thin films at high speed and with high precision. In the case of continuously forming a metal thin film on a long polymer substrate, as shown in FIG. Generally, a metal thin film is formed by vapor deposition while the polymer substrate 7 is traveling along the line 8, and then wound onto the winding system 14.

蒸着時の熱負荷による基板の熱損傷を防ぐ為にノ(イア
スローラ11によって基板とキャンの間に)5イアス電
圧を印加して両者の密着度を向上させる。
In order to prevent thermal damage to the substrate due to thermal load during vapor deposition, a voltage of 0.5 mm is applied between the substrate and the can (by the ear roller 11) to improve the degree of adhesion between the two.

発明が解決しようとする問題点 しかし薄い高分子基板を用いた場合には、しわの問題が
起きる。即ち第5図に示すように、高分子基板が受ける
熱負荷が、蒸着部分115とマージン部分16(非蒸着
部分)で異なる為に熱変形に差が生じる。この様な状態
でバイアス電圧によって基板を強制的に固定すると第5
図に示す様なしわが生じる。18は基板進行方向である
。このしわが1ケ所発生すると基板の他の場所にもひず
みを生じ派生的に大きなしわが主要蒸着部分17にまで
入る。
Problems to be Solved by the Invention However, when a thin polymer substrate is used, the problem of wrinkles occurs. That is, as shown in FIG. 5, the thermal load applied to the polymer substrate differs between the vapor deposited portion 115 and the margin portion 16 (non-vapor deposited portion), resulting in a difference in thermal deformation. If the substrate is forcibly fixed using a bias voltage in such a state, the fifth
Wrinkles appear as shown in the figure. 18 is the substrate traveling direction. When such wrinkles occur in one place, distortion occurs in other places on the substrate, resulting in large wrinkles extending to the main deposited area 17.

そこで本発明は薄い高分子基板を用いても、しわが発生
するのを防いで、安定に金属薄膜を形成できるようにす
るものである。
Therefore, the present invention prevents the occurrence of wrinkles even when using a thin polymer substrate, and enables stable formation of a metal thin film.

問題点を解決するだめの手段 上記問題点を解決するため本発明は、キャン上を走行す
る高分子基板を多条にして、その一部の条につい・てば
その全幅で金属薄膜を形成するものである。
Means for Solving the Problems In order to solve the above problems, the present invention makes the polymer substrate running on the can multi-striped, and forms a thin metal film on some of the strips, and in some cases, over the entire width thereof. It is something.

作用 すなわち、キャン上の高分子基板を多命にすることによ
り、マージン部分と蒸着部分が混在している部分を、主
要な蒸着部分と別の条にして分離する。これによって従
来マージン部分と蒸着部分の境界付近から発して幅広基
板の中央付近まで達していたしわが、主要蒸着部分と分
離される。従って主要な蒸着部分については長尺安定に
しわなしに金属薄膜が形成できる。
In other words, by making the polymer substrate on the can multi-functional, the area where the margin area and the vapor deposition area are mixed is separated from the main vapor deposition area in a separate strip. As a result, the wrinkles that conventionally originate near the boundary between the margin portion and the vapor deposition portion and reach near the center of the wide substrate are separated from the main vapor deposition portion. Therefore, a long metal thin film can be formed stably and without wrinkles on the main vapor deposition parts.

実施例 以下、本発明の実施例を添付図面にもとづいて説明する
。第1図において、1は排気系2によって高真空に排気
された真空槽であり、この真空槽1の中に電子銃3から
電子ビーム4を入射されるNiFe合金を蒸着する為の
蒸発源6及び基板搬送系が設置されている。
Embodiments Hereinafter, embodiments of the present invention will be described based on the accompanying drawings. In FIG. 1, reference numeral 1 denotes a vacuum chamber evacuated to a high vacuum by an exhaust system 2, and an evaporation source 6 for evaporating NiFe alloy into which an electron beam 4 is incident from an electron gun 3 into the vacuum chamber 1. and a substrate transport system.

基板搬送系は、巻出し系6から回転方向13に沿フて巻
出された長尺の高分子基板アが、キャン8に沿って走行
中に金属薄膜を蒸着された後に主要蒸着部分巻取り系9
と含マージン部分巻取系1゜に巻取られる構造となって
いる。キャン8の周側面は絶縁物のコーティングが施し
である。また、11はバイアスローラで、このバイアス
ロー211の印加電圧によって、高分子基板上に金属薄
膜が形成され始めると同時に、高分子基板7とキャン8
が密着する0両者の密着によって蒸着時の熱負荷を速や
かにキャン8へ逃がして高分子基板7の熱損傷を防ぐこ
とができる。
The substrate transport system unwinds the long polymer substrate from the unwinding system 6 along the rotational direction 13, has the thin metal film deposited on it while traveling along the can 8, and then winds up the main deposition part. Series 9
It has a structure in which the part winding system including the margin is wound up to 1°. The circumferential side of the can 8 is coated with an insulating material. Further, reference numeral 11 denotes a bias roller, and at the same time a metal thin film starts to be formed on the polymer substrate by the applied voltage of this bias roller 211, the polymer substrate 7 and the can 8
Due to the close contact between the two, the heat load during vapor deposition can be quickly released to the can 8, and thermal damage to the polymer substrate 7 can be prevented.

12は裁断用刃であり、巻出し系6上又は巻出し系6か
らキャ°ン8へ至る途中に設けられる0この裁断用刃1
2によって高分子基板7は主要蒸着部分−条と含マージ
ン部分二条の合計三条に裁断される。刃は硬質の薄刃材
を用いており、裁断用刃の構造としては第2図aに示す
様な片刃方式、同図すに示す様な両刃方式等、どの様な
形式でもよい。第2図aで12は裁断用刃、同図すで1
9は裁断用土刃、20は裁断用下刃である。
12 is a cutting blade, which is provided on the unwinding system 6 or on the way from the unwinding system 6 to the can 8.
2, the polymer substrate 7 is cut into a total of three strips, the main vapor deposition strip and two margin-containing strips. The blade is made of a hard thin blade material, and the structure of the cutting blade may be of any type, such as a single-edged type as shown in FIG. 2a, or a double-edged type as shown in the figure. In Figure 2 a, 12 is the cutting blade, and 1 is already in the same figure.
9 is a cutting blade, and 20 is a lower cutting blade.

こうして厚さ8μmのポリエチレンテレフタレート基板
上に膜厚1500人のNiFe薄膜を形成した。尚、こ
のNiFe薄膜は垂直磁気記録媒体の下地層とするもの
である。その結果、第5図に示す様に主要蒸着部分17
にしわなく蒸着膜が形成できた。
In this way, a NiFe thin film with a thickness of 1,500 wafers was formed on a polyethylene terephthalate substrate with a thickness of 8 μm. Note that this NiFe thin film is to be used as an underlayer of a perpendicular magnetic recording medium. As a result, as shown in FIG.
A deposited film was formed without wrinkles.

上記実施例では巻取系を主要蒸着部分巻取り系9と含マ
ージン部分巻取系10に分けている。巻取系を単一の巻
取系としても良いが、分けた方が主要蒸着部分17を巻
きずれ等なく安定に巻取ることが出来る。
In the above embodiment, the winding system is divided into a main vapor deposition partial winding system 9 and a margin-containing partial winding system 10. The winding system may be a single winding system, but if the winding system is divided, the main vapor deposition portion 17 can be wound stably without winding deviation.

また高分子基板の切断は必要に応じて三条以上の多条と
して良い。
Further, the polymer substrate may be cut in multiple strips of three or more strips, if necessary.

上記実施例では真空槽中で裁断を行なっているが、予め
裁断された高分子基板を用いて、例えば巻出系を主要蒸
着部分巻出系と含マージン部分巻出系に分けても良い。
In the above embodiment, cutting is performed in a vacuum chamber, but the unwinding system may be divided into a main vapor deposition partial unwinding system and a margin-containing partial unwinding system, for example, using pre-cut polymer substrates.

その場合には主要蒸着部分の基板と含マージン部分の基
板の端部を突合わせてキャン上を走行させないとキャン
に蒸着物が多く付着してしまうので搬送系に調整機構を
持たせる必要があり前述の実施例に比べて複雑となる。
In that case, unless the edges of the substrate in the main evaporation area and the edge of the substrate in the margin area are brought together and run on the can, a lot of evaporation material will adhere to the can, so it is necessary to provide an adjustment mechanism in the transport system. This is more complicated than the previous embodiment.

発明の効果 本発明は、金属薄膜を形成しようとする、長尺の高分子
基板を多条にして、蒸着用のキャン上を走行させるもの
であるので、薄い高分子基板上にもしわなしに金属薄膜
を形成できる。
Effects of the Invention In the present invention, a long polymer substrate on which a thin metal film is to be formed is made into multiple strips and is run on a vapor deposition can, so that it can be applied without wrinkles even on a thin polymer substrate. A thin metal film can be formed.

すなわち本発明では、蒸着部分とマージン部分の熱負荷
の違いから発生する大きなしわをなくして、主要蒸着部
分にはしわなしに蒸着できる。
That is, in the present invention, large wrinkles caused by the difference in heat load between the evaporation area and the margin area can be eliminated, and the main evaporation area can be evaporated without wrinkles.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例における金属薄膜の製造方法
の説明図、第2図a、bは本発明に用いる高分子基板裁
断用刃の例を示す斜視図、第3図は本発明により形成さ
れた金属薄膜を示す図、第4図は従来例の金属薄膜の製
造方法の説明図、第5図は従来の方法により生じたしわ
を示す図である。 1・・・・・・真空槽、2・・・・・・排気系、3・・
・・・電子銃、4・・・・・・電子ビーム、5・・・・
・・蒸発源、6・・・・・・巻出系、7・・・・・高分
子基板、8・・・・・・キャン、9・・・・・・主要蒸
着部分巻取系、1o・・・・・・含マージン部分巻取系
、11・・・・・・バイアスローラ、12・・・・・・
裁断用刃、13・・・・・・回転方向、14・・・・・
・巻取系、15・・・・・・蒸着部分、16・・・・・
・マージン部分、17・・・・・・主要蒸着部分、18
・・・・・・基板進行方向、19・・・・・・裁断用上
刃、20・・・・・・裁断用下刃。 を−μの氏名 弁理士 中 尾 敏 男 ほか1名f・
−・Jll空第 2−摺片1 5・−系央源 第 3(!l 第4図 7jKs図
FIG. 1 is an explanatory diagram of a method for manufacturing a metal thin film according to an embodiment of the present invention, FIGS. 2a and 2b are perspective views showing an example of a blade for cutting a polymer substrate used in the present invention, and FIG. FIG. 4 is an explanatory diagram of a conventional method for manufacturing a metal thin film, and FIG. 5 is a diagram showing wrinkles caused by the conventional method. 1... Vacuum chamber, 2... Exhaust system, 3...
...Electron gun, 4...Electron beam, 5...
...Evaporation source, 6...Unwinding system, 7...Polymer substrate, 8...Can, 9...Main evaporation partial winding system, 1o ...Margin partial winding system, 11...Bias roller, 12...
Cutting blade, 13...Rotation direction, 14...
- Winding system, 15... Vapor deposition part, 16...
・Margin part, 17...Main vapor deposition part, 18
. . . Board traveling direction, 19 . . . Upper blade for cutting, 20 . . . Lower blade for cutting. -μ's name Patent attorney Toshio Nakao and 1 other person f.
-・Jll Sky No. 2-Suriban 1 5・-System Central Source No. 3 (!l Fig. 4 7jKs Fig.

Claims (2)

【特許請求の範囲】[Claims] (1)円筒状キャンの周面に沿って走行する長尺高分子
基板上に真空蒸着法またはイオンプレーティング法によ
って金属薄膜を形成する際に、前記キャン上に三条以上
に分離した長尺高分子基板を走行させ、そのうち一条以
上については前記長尺高分子基板上に形成された金属薄
膜と前記キャンとの間に電圧を印加するとともに、その
全幅にわたって金属薄膜を形成することを特徴とする金
属薄膜の製造方法。
(1) When forming a metal thin film by vacuum evaporation or ion plating on a long polymer substrate running along the circumferential surface of a cylindrical can, three or more long strips are separated on the can. A molecular substrate is run, and a voltage is applied between the metal thin film formed on the long polymer substrate and the can in one or more of the strips, and a metal thin film is formed over the entire width thereof. Method for producing metal thin film.
(2)長尺高分子基板の分離を蒸着時に真空槽中で行な
うことを特徴とする、特許請求の範囲第1項記載の金属
薄膜の製造方法。
(2) The method for producing a metal thin film according to claim 1, wherein the long polymer substrate is separated in a vacuum chamber during vapor deposition.
JP2694185A 1985-02-14 1985-02-14 Production of thin metallic film Pending JPS61186475A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2694185A JPS61186475A (en) 1985-02-14 1985-02-14 Production of thin metallic film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2694185A JPS61186475A (en) 1985-02-14 1985-02-14 Production of thin metallic film

Publications (1)

Publication Number Publication Date
JPS61186475A true JPS61186475A (en) 1986-08-20

Family

ID=12207174

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2694185A Pending JPS61186475A (en) 1985-02-14 1985-02-14 Production of thin metallic film

Country Status (1)

Country Link
JP (1) JPS61186475A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112962078A (en) * 2021-02-01 2021-06-15 肇庆宏旺金属实业有限公司 Film coating production line and film coating process

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112962078A (en) * 2021-02-01 2021-06-15 肇庆宏旺金属实业有限公司 Film coating production line and film coating process
CN112962078B (en) * 2021-02-01 2023-07-18 肇庆宏旺金属实业有限公司 Coating production line and coating process

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