JPS61182077U - - Google Patents
Info
- Publication number
- JPS61182077U JPS61182077U JP6562585U JP6562585U JPS61182077U JP S61182077 U JPS61182077 U JP S61182077U JP 6562585 U JP6562585 U JP 6562585U JP 6562585 U JP6562585 U JP 6562585U JP S61182077 U JPS61182077 U JP S61182077U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- bag
- compound
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 150000001875 compounds Chemical class 0.000 claims description 2
Landscapes
- Casings For Electric Apparatus (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
第１図は本考案の一実施例を示す側断面図、第
２図は他の実施例を示す側断面図、第３図は従来
例を示す側断面図である。
１……プリント基板、２……電子部品、３……
熱収縮性の袋体、４……コンパウンド。
FIG. 1 is a side sectional view showing one embodiment of the present invention, FIG. 2 is a side sectional view showing another embodiment, and FIG. 3 is a side sectional view showing a conventional example. 1...Printed circuit board, 2...Electronic components, 3...
Heat-shrinkable bag, 4... compound.
Claims (1)
た電子部品２とが、熱収縮された熱収縮性の袋体
３に収納されると共に、該袋体３内に充填したコ
ンパウンド４に埋設されていることを特徴とする
電子装置。 A printed circuit board 1 and an electronic component 2 mounted on the printed circuit board 1 are housed in a heat-shrinkable bag 3 and embedded in a compound 4 filled in the bag 3. An electronic device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985065625U JPH0231807Y2 (en) | 1985-04-30 | 1985-04-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985065625U JPH0231807Y2 (en) | 1985-04-30 | 1985-04-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61182077U true JPS61182077U (en) | 1986-11-13 |
| JPH0231807Y2 JPH0231807Y2 (en) | 1990-08-28 |
Family
ID=30597791
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985065625U Expired JPH0231807Y2 (en) | 1985-04-30 | 1985-04-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0231807Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0621281U (en) * | 1992-08-10 | 1994-03-18 | 株式会社小糸製作所 | Circuit board |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5372164A (en) * | 1976-12-10 | 1978-06-27 | Hitachi Ltd | Method of manufacturing electronic parts |
-
1985
- 1985-04-30 JP JP1985065625U patent/JPH0231807Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5372164A (en) * | 1976-12-10 | 1978-06-27 | Hitachi Ltd | Method of manufacturing electronic parts |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0621281U (en) * | 1992-08-10 | 1994-03-18 | 株式会社小糸製作所 | Circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0231807Y2 (en) | 1990-08-28 |