JPS61180465A - Lead connecting method - Google Patents

Abstract

PURPOSE:To prevent an electrode from oxidization and to perform connection of the electrode with a lead at low-cost by a method wherein oil is subjected to impose between a semiconductor element or an electrode of a display and the lead and is pressed down thereto. CONSTITUTION:An Si system's thermal resistant oil is applied to a lead 1 at least on a surface where a substrate is faced to an electrode 4. Positioning the lead 1 and the electrode 4 on the substrate 3 is performed and pressing down is performed thereon. Thereafter, a hardening resin 5 covers containing the electrode 4 of the substrate 3 and the lead 1, and they are cured and fixed. By means of curing the hardening resin 5, the electrode 4 of the substrate 3 and the lead 1 are fixed permanently at the state that oil is interposed between them at a part of the boundary.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for connecting leads in high-density, thin, and compact packaging of semiconductor devices and the like, and a method for connecting electrodes of a display panel and external leads.

2. Description of the Related Art In recent years, semiconductor devices such as 1G and LSI have been introduced into the fields of various home appliances and industrial equipment.

These home appliances and industrial equipment are resource-saving.

In order to save power or expand the scope of use, so-called portable devices, which are multifunctional, smaller, and thinner, are being promoted.

In order to respond to the trend of portability in semiconductor devices,
There is a growing demand for smaller and thinner packaging. After the diffusion process and electrode wiring process have been completed, the silicon slice is cut into chips of semiconductor element units, and electrode leads are taken out from the aluminum electrode terminals provided around the chip to external terminals to make combs for easy handling and for mechanical protection. packaged in. Usually, the packaging of these semiconductor devices includes DIL, chip carrier, flip chip,
Knob, film carrier methods, etc. are used.

On the other hand, the electrodes of liquid crystal display panels and EL display panels are generally formed on a glass plate using a conductive film such as SnO2゜ITO. is mechanically pressed against the electrode of the display, or a metal film of N1.Au, Cr-Au, etc. is formed on the electrode, and this and the flexible substrate are fixed by soldering. ing.

Problems to be Solved by the Invention As mentioned above, there are various packaging methods for semiconductor devices, but all of these methods require the use of expensive materials for semiconductor devices, or the use of vapor deposition, photoetching, or plating. Since complicated steps such as processing are used, the cost of this step is high. Yet again. In order to connect the electrodes and external leads of semiconductor elements that have undergone these treatments, it is necessary to form an alloy at high temperatures and high pressures, which not only requires equipment that generates high temperatures and high pressures, but also - Due to the high pressure, the semiconductor element is also subjected to thermal and mechanical stress, which may damage its properties.

Furthermore, the method of press-contacting the flexible substrate to the electrodes of the display requires a press-contact means such as a spring material, and it is not possible to make the display smaller and thinner.

However, the method of forming a metal film on the electrodes of a display, as in the case of the semiconductor element described above, requires extensive materials and equipment, leading to high costs in this process.

In view of such conventional problems, the present invention provides semiconductor devices,
It is an object of the present invention to provide a simple and inexpensive lead connection method for connecting electrodes and leads of a display panel without relying on metal film formation or pressure bonding.

Means to Solve the Problems In order to solve the above problems, the present invention interposes oil between the electrodes and leads of a semiconductor element or display, brings them into pressure contact, and hardens them with a curable resin. .

Effect: This prevents oxidation of the electrode and enables inexpensive lead connection for electrically connecting the electrode and the lead.

Example A first embodiment of the present invention will be described using FIG.

At least the surface of the lead 1 facing the electrode 4 of the substrate 3 is coated with, for example, a silicone-based heat-resistant oil 2. The lead 1 and the electrode 4 on the substrate 3 are aligned and pressed together (FIG. 1(a)) and pressed together (FIG. 1(b)). Thereafter, the electrodes 4 and leads 1 on the substrate 3 are covered with a curable resin 6 and cured.

Fix it (Fig. 1(C)). By curing the curable resin 5, the electrode 4 of the substrate 3 and the lead 1 are fixed at least permanently, with oil (oil film) interposed at a part of the boundary. Further, at the contact point between the electrode 4 and the lead 1, the oil film is partially removed by pressure contact, and an electrical connection is established. The oil (oil film) prevents oxidation of the lead 1 and the substrate electrode, and also prevents contact between external moisture that has permeated the curable resin and the lead and the substrate electrode, and prevents electrolytic corrosion, etc. .

In the configuration of this embodiment, it is sufficient to simply interpose oil between the leads and the electrodes of the substrate, press them together, and harden them with a curable resin, which is extremely simple and does not require large-scale equipment.

The electrode 4 on the substrate 3 is 0.5 when the substrate 3 is a semiconductor element.
It is made of aluminum or aluminum with a thickness of ~1 μm, and the electrode dimensions are 30 μm to 150 μm.

Further, the lead 1 is, for example, a C such as a film carrier.
It is sufficient to use a lead group that is etched with U foil and subjected to Sn plating or human U plating.

When the board 3 is an EL or liquid crystal display panel.

The electrode 4 is formed of a conductive film such as SnO□ or ITO, and the lead 1 is formed of a polyimide film or glass epoxy film with a Cu foil pattern formed thereon so as to correspond to the pattern of the electrode 4.

The oil (oil film) may be formed on the lead 1 side as shown in FIG. 1, or may be formed in advance on the electrode 4 of the substrate 3 as shown in FIG. In FIG. 2, oil (
Oil slick) 2? L is formed, aligned with the lead 1 (FIG. 2(a)), and pressed into contact (FIG. 2(b)). Thereafter, it can be cured and fixed with a curable resin 6 (FIG. 2(C)).

Furthermore, the above-mentioned curable resin was applied in a process in which the lead and the electrode of the board were pressed together, and then the resin was applied and hardened. However, the process is not limited to this, and as shown in FIG. Oil (oil film) 2 is formed on the electrode 4), and hardening resin 5? L is the electrode 4 (or lead 1) of the substrate 3 in advance.
) (FIG. 3(a)), and may be pressed and hardened as is (FIG. 3(b)).

The curable resins described above may be of a type that is cured by temperature or time, or may be of a type that is cured by light.

As described in detail, according to the present invention, the following effects can be obtained.

(1) In order to create an electrical connection by interposing oil (oil film) at the contact boundary between the lead and the electrode of the substrate,
It is possible to prevent electrical connection failure due to an increase in contact resistance due to oxidation of the lead material and the electrode material of the substrate at the contact boundary, and to obtain a highly reliable connection.

(2) Furthermore, even if moisture intrudes through the curable resin, the contact boundary is covered with an oil film, so electrolytic corrosion and oxidation due to moisture at the contact interface can be prevented.
It is possible to prevent electrical connection failures and obtain highly reliable connections.

(3) Furthermore, this was necessary in the past. Since the process of forming metal films on semiconductor element electrodes and display panel electrodes and the expensive equipment needed to form them are not required, the cost of lead connections is not only reduced, but also the cost of semiconductor elements and display panels is reduced. The manufacturing yield will also improve.

(4) The lead and the electrode on the substrate are brought into pressure contact and their surfaces are covered and fixed with a curable resin, while the curable resin functions as the lead and the electrode on the substrate and as a protective film resin for the substrate surface. Therefore, the conventional process of connecting leads and electrodes and the process of applying protective resin can be performed at the same time, reducing equipment and the number of processes. The cost of the connection is therefore significantly lower.

(5) Since a heating jig (bonding tool), which was conventionally required in the connection process, is not required, no thermal stress or excessive pressure is applied to the substrate of the semiconductor element or the glass plate of the display panel. No heat or pressure stress is applied, so semiconductor elements and display panels will not be damaged.

(6) To promote alloying when connecting the metal film of the electrode on the substrate and the lead in the conventional method.

The width of the metal film of the electrode on the substrate must be larger than the width of the lead. For this reason, there are restrictions on narrowing the electrode spacing, and it is not possible to deal with narrow pitches on base running. However, in the present invention, the electrodes and the leads only need to be constructed with a one-to-one width and are pressed into contact with each other, so that it is significantly easier to deal with the narrow pitch that has become the problem described above.

[Brief explanation of the drawing]

FIGS. 1(&) to (C) are cross-sectional views for explaining the lead connection method in one embodiment of the present invention, and FIGS. 2(a) to (C)
C), FIGS. 3(&), and (b) are sectional views for explaining a lead connection method in another embodiment of the present invention. 1...Lead, 2...Oil (oil film), 3...
...Substrate, 4...Electrode, 5...
Hardening resin. Name of agent: Patent attorney Toshio Nakao Haga 1st person
1 Figure /-m-su-F2-m-way 3-m=Board Fig. 2 2'L ---Layout

Claims (4)

[Claims] (1) A lead connection method characterized in that the leads and the electrodes on the substrate are brought into pressure contact with oil interposed between them, and the leads and the electrodes on the substrate are fixed with a curable resin. (2) After forming an oil film on at least one of the leads and the electrodes on the substrate and forming a curable resin between the leads and the electrodes on the substrate, the leads and the electrodes on the substrate are pressed together and the curable resin is applied. Claim 1 characterized in that it is hardened.
Lead connection method described in section. (3) The lead joining method according to claim 1, wherein the curable resin is a photocurable resin. (4) The lead connection method according to claim 1, wherein the oil has heat resistance.