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JPS6117751U - テ−プキヤリア半導体装置 - Google Patents

テ−プキヤリア半導体装置

Info

Publication number
JPS6117751U
JPS6117751U JP1984102593U JP10259384U JPS6117751U JP S6117751 U JPS6117751 U JP S6117751U JP 1984102593 U JP1984102593 U JP 1984102593U JP 10259384 U JP10259384 U JP 10259384U JP S6117751 U JPS6117751 U JP S6117751U
Authority
JP
Japan
Prior art keywords
semiconductor device
tape carrier
carrier semiconductor
tape
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984102593U
Other languages
English (en)
Other versions
JPH0356053Y2 (ja
Inventor
和彦 橋本
孝明 津田
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Priority to JP1984102593U priority Critical patent/JPS6117751U/ja
Publication of JPS6117751U publication Critical patent/JPS6117751U/ja
Application granted granted Critical
Publication of JPH0356053Y2 publication Critical patent/JPH0356053Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は本考案−による一実施例を示す平面図、第２図
は従来装置の平面図である。 ５：テープ、６：半導体素子装着用第１孔、７：位置決
め用第２孔、９：リード端子、１０：補強材。

Claims (1)

    【実用新案登録請求の範囲】
  1. 長尺のテープ表面に被着されたリード導体に半導体素子
    をボンデイングしてなるテープキャリア半導体装置にお
    いて、前記テープに位置決め用の孔を形成し、該穴の周
    囲に、半導体素子をポンデイングするためのリード導体
    と同一導体からなる補強導体を形成してなることを特徴
    とするテープキャリア半導体装置。
JP1984102593U 1984-07-05 1984-07-05 テ−プキヤリア半導体装置 Granted JPS6117751U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984102593U JPS6117751U (ja) 1984-07-05 1984-07-05 テ−プキヤリア半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984102593U JPS6117751U (ja) 1984-07-05 1984-07-05 テ−プキヤリア半導体装置

Publications (2)

Publication Number Publication Date
JPS6117751U true JPS6117751U (ja) 1986-02-01
JPH0356053Y2 JPH0356053Y2 (ja) 1991-12-16

Family

ID=30661988

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984102593U Granted JPS6117751U (ja) 1984-07-05 1984-07-05 テ−プキヤリア半導体装置

Country Status (1)

Country Link
JP (1) JPS6117751U (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63152134A (ja) * 1986-12-17 1988-06-24 Hitachi Ltd 液晶表示装置
JPH02150044A (ja) * 1988-11-30 1990-06-08 Matsushita Electric Ind Co Ltd フィルムキャリァ
JP2006210478A (ja) * 2005-01-26 2006-08-10 Renesas Technology Corp 半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5834952A (ja) * 1981-08-26 1983-03-01 Nec Corp 半導体装置用テ−プキヤリア

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5834952A (ja) * 1981-08-26 1983-03-01 Nec Corp 半導体装置用テ−プキヤリア

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63152134A (ja) * 1986-12-17 1988-06-24 Hitachi Ltd 液晶表示装置
JPH02150044A (ja) * 1988-11-30 1990-06-08 Matsushita Electric Ind Co Ltd フィルムキャリァ
JP2006210478A (ja) * 2005-01-26 2006-08-10 Renesas Technology Corp 半導体装置

Also Published As

Publication number Publication date
JPH0356053Y2 (ja) 1991-12-16

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