JPS61174654A - Resin-encapsulated semiconductor device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [Field of application of the invention] The present invention relates to a resin-sealed semiconductor device.

[Background of the invention]

Resin-sealed semiconductor devices are exposed to high temperature conditions (for example, 65
℃, 95% relative humidity, 121° C., 2 atm supersaturated water vapor (PCT, etc.), there is a problem that the aluminum wiring and bonding wires on the element corrode and break. This is caused by ionic impurities contained in the packaging material.

This is caused by stress on the device, adhesion, adhesion, various corrosion accelerators contained in the outside air and solder flux, and moisture intrusion into the package.

By the way, the mainstream of resin compositions for packaging is epoxy-based materials that use novolac type phenolic resin as a curing agent. Countermeasures for the above problems include increasing the purity of the material (especially the resin component), improving the adhesion and adhesion between the element and the cured resin, lowering the stress of the cured resin, and improving the glass transition point. has been done. However, there is a need for even better reliability. In addition, in connection with this application, Plas
ticsEngineering, &4, P3
1 (1981) is known.

[Purpose of the invention]

An object of the present invention is to provide a resin-sealed semiconductor device that can operate with high reliability even when left at high temperatures for a long time.

[Summary of the invention]

The present invention has been made in view of the above situation, and the gist thereof is at least a linear formula (wherein R is H or CH, m+n)2. m is 1 to 5
0m and n may be the same or different, where n is any one of 0 to 5, and m and n may be the same or different. A semiconductor device resin-sealed with a characteristic resin composition.

and at least a linear formula [wherein R is H or CH, m+n>2. m is 1 to 5
1. A semiconductor device sealed with a resin composition, wherein n includes any one of O to 5.

and at least the following formula [wherein R is H or CH, m+n>2. m is 1 to 5
, and n is any one of O to 5.Even if 0m and n are the same, they are different, and the semiconductor device is sealed with an object.

In the present invention, the epoxy compound having a diaminate end group can be obtained, for example, by the following reaction.

+ BrCmi [in the formula, R is H or CH,, m+n)2, m is 1 to 5
and n is any one of O to 5. 0m and n may be the same or the same.

Here, CM.C=N may be used instead of Br-C=N, and tertiary amines such as triethylamine are effective as catalysts.

The resin composition of the present invention includes epoxy resin, phenol resin, melamine resin, urea resin, polyester resin, urethane resin, polyamide resin, polyimide resin (including addition type polyimide), polysulfone resin, polyhydroxystyrene resin, polybutadiene resin. , polystyrene, various polystyrene copolymers, silicone resins, fluoropolymers, diallyl phthalate resins, and the like may be added and used.

Among these, the use in combination with an epoxy resin is particularly beneficial for expanding the uses and effects of the present invention.

Examples of polyfunctional epoxy compounds include diglycidyl ether of bisphenol A, butadiene jepoxide, 3,4-epoxycyclohexylmethyl-(3,4
-Epoxy (cyclohexane carboxylate, vinyl cyclohexane dioxide, 4.4'-di(1,2-epoxyethyl) diphenyl ether, 4.4'-1,2
-epoxyethyl)biphenyl, 2,2-bis(3,4
- epoxycyclohexyl) propane, glycidyl ether of resorcinol, diglycidyl ether of phloroglucin, diglycidyl ether of methylphloroglucin,
bis-(2,3-epoxycyclopentyl)ether,
2-(3,4-epoxy)-cyclohexane-5.5
-spiro(3,4-epoxy)-cyclohexane-m-
Difunctional epoxy compounds such as dioxane, bis-(3,4-epoxy-6-methylcyclohexyl)adipate, N*N'-m-phenylenebis(4,5-epoxy-1,2-cyclohexane)dicarboximide ,
Triglycidyl ether of para-aminophenol, polyallyl glycidyl ether, 1,3°5-tri(1,2
-epoxyethyl)benzene.

2.2', 4.4'-tetraglycidoxybenzophenone, tetraglycidoxytetraphenylethane, polyglycidyl ether of phenol formaldehyde novolac, triglycidyl ether of glycerin, triglycidyl ether of trimethylolpropane, etc. Epoxy compounds are used.

Next, as the condensation reaction product (B) of phenol and aldehyde, resins produced by addition condensation reaction of various phenol compounds and aldehyde compounds in the presence of an acidic or basic catalyst are used. Useful are novolak resins, which are synthesized by acid catalysis, especially using phenol, cresol, etc., and formaldehyde.

Furthermore, in the present invention, various catalysts can be added for the purpose of accelerating the curing reaction of the composition containing the three components, such as triethanolamine, tetramethylbutanediamine, and tetramethylpentane. Tertiary amines such as diamines, tetramethylhexanediamine, triethylenecyanine and dimethylaniline, oxyalkylamines such as dimethylaminoethanol and dimethylaminopentanol, and amines such as tris(dimethylaminomethyl)phenol and methylmonocarbons. can be applied.

For the same purpose, catalysts such as cetyltrimethylammonium bromide, cetyltrimethylammonium chloride, dodecyltrimethylammonium iodide, trimethyldodecylammonium chloride,
Benzyldimethyltetradecylammonium chloride, benzylmethylpalmethylammonium chloride,
Quaternary ammonium salts such as allyldodecyltrimethylammonium bromide, benzyldimethylstearylammonium bromide, stearyltrimethylammonium chloride and benzyldimethyltetradecylammonium acetate can be applied;
-undecylimidazole, 2-methylimidazole,
2-ethylimidazole, 2. Heptadecylimidazole, 2-methyl-4-ethylimidazole, 1-butylimidazole, 1-propyl-2-methylimidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-
2-undecylimidazole, 1-cyanoethyl-2-
Phenylimidazole.

1-Azine-2-methylimidazole and 1-azine-
Imidazole compounds such as 2-undecylimidazole, triphenylphosphine tetraphenylborate, triethylaminetetraphenylborate, N-
Methylmorpholine tetraphenylborate, pyridine tetraphenylborate 2-ethyl-4-methylimidazole tetraphenylborate and 2-ethyl-1,4-
Tetraphenylboron salts such as dimethylimidazole tetraphenylborate are useful.

Two or more of the above catalysts can also be used in combination, and the amount thereof is 1 per 100 of the polyfunctional epoxy compound (A).
It may be used in a weight ratio of 0.01 to 20.

The epoxy resin composition of the present invention may also contain, for example, calcium carbonate, depending on its intended use.

Silica, alumina, titania, aluminum hydroxide, aluminum silicate, zirconium silicate.

Powders and short fibrous fillers such as zircon, glass, talc, mica, graphite, aluminum, steel, and iron, mold release agents such as fatty acids and waxes, epoxy silane, vinyl silane,
Coupling agents such as borane compounds and alkyl titanate compounds, and also flame retardants such as antimony and phosphorous compounds and halogen-containing compounds can be added.

The resin composition of the present invention is prepared by rolling the above-mentioned components.

It is prepared by heating (about 70 to 80°C) and kneading using a kneader, co-kneader, Henschel mixer, or the like. Moreover, when the component compounds are solid, they can also be blended by a tri-blend method in which they are pulverized and then mixed. The resulting composition can be cured in a short period of time at temperatures of about 150-200°C.

[Embodiments of the invention]

Examples 1 and 2 Synthesis of a compound having a cyanamide end group and a hydroxyl end group 100 g of a novolac-type phenol-formaldehy condensate (number average molecular weight: 375) was dissolved in 300 g of methyl ethyl ketone. to this.

10.6 g (0.1 mole) of B r-C=N were added dropwise followed by 0.5 m m of triethylamine.

After that, after heating under reflux for 60 minutes and washing with water,
Water was separated by drying. The obtained reaction product had a softening point of 79~
The temperature was 83°C.

60 parts by weight of the above reactant having a cyanamide end group and a hydroxyl group, ortho-
Talesol novolak type epoxy (epoxy equivalent: 21
5. 100 parts by weight each of Nippon Kayaku Co., Ltd.) and XD-9053-00L (epoxy equivalent: 204, Dow Chemical Co., Ltd.), and triethylamine as a curing accelerator.
2 parts by weight of tetraphenylborate (TEAK), 1.5 parts by weight of epoxysilane KBM303 (manufactured by Shin-Etsu Chemical Co., Ltd.) as a coupling agent, and 1.0 parts by weight of red phosphorus as a flame retardant.
parts by weight and 5 parts by weight of aluminum hydroxide (Al(OH)3), fused silica glass powder (V.

Two types of formulations were prepared by blending 495 parts by weight of Th content (i, oppb or less) and 2.0 parts by weight of carbon black CM-800 (manufactured by Cabot Co., Ltd.) as a coloring agent.

Next, this blend was kneaded with two rolls heated to 75-80°C. After cooling, it was coarsely ground to obtain the desired resin composition. Using this resin composition, Bit D-R was applied to 256.
AM memory LSI is manufactured using a transfer molding machine.
Mold was carried out under the conditions of 180°C, 70 kg/aJ, and 2 minutes. The obtained resin packaged memory LSI is
After leaving it in supersaturated steam at 121°C and 2 atm (pressure hooker test, PCT) for a specified period of time, take it out and
The presence or absence of corrosion and disconnection of the electrode was checked.

Also, -50'e,! A cooling/heating cycle at +150°C was performed to check for defects. The results are shown in Table 1.

Table 1 Procedural amendment (method) % formula % Display of case 1985 Patent Application No. 14243 Name of invention Resin-encapsulated semiconductor device Person making amendment/Relationship with case 1 Patent applicant name U: t5101 Co., Ltd. Hitachi Manufacturers Agent Contents of Personal Correction [Background of the Invention] Resin-sealed semiconductor devices are manufactured under high-temperature conditions (for example, 65
℃, 95% relative humidity, 121℃, 2 atm supersaturated water vapor (such as PCT), there is a problem that the aluminum wiring and bonding wires on the element will corrode and break. This is caused by ionic impurities contained in the package material, stress on the device, adhesion, adhesion, and various corrosion accelerators contained in the outside air and solder flags.

This is due to the infiltration of moisture into the package.

By the way, the mainstream of resin compositions for packaging is epoxy-based materials that use novolac type phenolic resin as a curing agent. Countermeasures for the above problems include increasing the purity of the material (especially the resin component), improving the adhesion and adhesion between the element and the cured resin, and improving the low stress and high glass transition temperature of the cured resin. has been done. However, there is a need for even better reliability. In connection with this application, engineering plastics (Plastics specification f)
Correct page s2 on the attached sheet.

Claims (1)

[Claims] 1. At least the following formula ▲ Numerical formula, chemical formula, table, etc. ▼ [In the formula, R is H or CH_2, m+n>2, m is 1 to
5, n is any one of 0 to 5, m
and n may be the same or different. ] A resin-encapsulated semiconductor device comprising a compound having a cyanamide terminal group and a hydroxyl terminal group.