JPS6116538A - Tension-adding device for bonding wire - Google Patents
Tension-adding device for bonding wireInfo
- Publication number
- JPS6116538A JPS6116538A JP59138325A JP13832584A JPS6116538A JP S6116538 A JPS6116538 A JP S6116538A JP 59138325 A JP59138325 A JP 59138325A JP 13832584 A JP13832584 A JP 13832584A JP S6116538 A JPS6116538 A JP S6116538A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- tension
- diameter
- capillary
- vacuum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011148 porous material Substances 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 5
- 230000003028 elevating effect Effects 0.000 abstract 1
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
- H01L2224/78621—Holding means, e.g. wire clampers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
- H01L2224/78621—Holding means, e.g. wire clampers
- H01L2224/78631—Means for wire tension adjustments
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は半導体素子などの対象物の所定箇所へワイヤボ
ンディングをする時に、同ワイヤに必要な張力を附加す
るための張力附加装置に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a tension applying device for applying a necessary tension to a wire when wire bonding is performed to a predetermined location of an object such as a semiconductor device.
従来例の構成とその問題点
ワイヤボンディング装置の先端部には第１図に示す通り
、一般に対象物の所定箇所、例えば半導体素子などのポ
ンディングパッド面（図示せず）ヘボンディングワイヤ
（以下単にワイヤと略記）２を案内し、かつ圧接させる
キャピラリ１と、同キャピラリの上方に位置して、前記
ワイヤ２を保持または開放するクランパ３と、更に同タ
ランバ３の上方に位置し、前記ワイヤ２がたわまぬよう
に一定の張力を同ワイヤ２に附加する張力附加装置（図
示せず）とを備えている。Structure of the conventional example and its problems As shown in Fig. 1, the tip of the wire bonding device generally has a bonding wire (hereinafter simply referred to as a A capillary 1 that guides and presses the wire 2; a clamper 3 that is located above the capillary to hold or release the wire 2; A tension applying device (not shown) is provided to apply a constant tension to the wire 2 so that the wire 2 does not bend.
ところが、従来の張力附加装置として、２枚のガラス板
を用い金線を挾持するようにした簡単な構成のものから
、底に微小の穴を複数個設けたＶ字谷の彫込を入れた支
持体上を真空で谷底方向へ吸引しながら通過させる構成
にしたものが用いられていた。However, conventional tension adding devices range from simple structures that use two glass plates to hold a gold wire in place, to those that have a V-shaped valley carved into the bottom with multiple tiny holes. A configuration was used in which the support was passed through while being sucked in a vacuum toward the bottom of the valley.
しかしながら、これ等の張力附加装置では適切な張力を
ワイヤに附加させることが困難で、ワイヤの断線または
たわみがしばしば発生していた。However, with these tension applying devices, it is difficult to apply appropriate tension to the wire, and the wire often breaks or bends.
特にたわみの発生が多く、そのため、所定の高さを上下
するように設定されたキャピラリではそのたわみが吸収
されず、半導体素子とリードピン間との接続が正常な場
合に比べ冗長化されてしまい、樹脂封止過程で、ワイヤ
が断線もしくは他の半導体素子の構成要素部へ不用な接
触を起し、その結果半導体装置の製品歩留が低下してし
まう不都合があった。In particular, deflection occurs frequently, and as a result, the capillary, which is set to move up and down at a predetermined height, cannot absorb the deflection, resulting in redundancy compared to when the connection between the semiconductor element and the lead pins is normal. During the resin sealing process, the wires may break or come into unnecessary contact with other semiconductor element components, resulting in a disadvantage in that the product yield of the semiconductor device is reduced.
発明の目的
本発明の目的は、ボンディングワイヤ工程において、ワ
イヤの断線とたわみを生じることのないよう適度の張力
を附与できるようにしたボンディングワイヤの張力附加
装置の提供にある。OBJECTS OF THE INVENTION An object of the present invention is to provide a bonding wire tensioning device that can apply an appropriate tension to the wire in a bonding wire process to prevent wire breakage and bending.
発明の構成
本発明は、ワイヤの出口に対し送り出し・口の直径が小
さく、かつワイヤがはｙ−直線に通過できる細孔と、同
細孔に対しはソ垂直方向に真空引用の空洞が設けられ、
その先端部に真空ポンプへホースで繋げるための連結用
取付具を備えると共に同取付具と前記ワイヤ通過孔との
間にあって、真空引の状態とそうでない状態とを、前記
空洞部を開・閉できる手段を設けて制御し、ワイヤボン
ディング作業時に、前記空洞部を真空ポンプのところま
で開の状態、すなわち真空引きの状態にすることによっ
てワイヤに張力を附加させる装置であって、これにより
、真空引の状態では、ワイヤが出口に向って送り出され
てワイヤのたわみが解消し、一定の張力がワイヤに加わ
る。Structure of the Invention The present invention provides a fine hole in which the diameter of the feeding port is small with respect to the wire exit and through which the wire can pass in a straight line, and a vacuum vacuum cavity is provided in the vertical direction to the fine hole. is,
It is provided with a connecting fitting for connecting to a vacuum pump with a hose at its tip, and is located between the fitting and the wire passage hole to open and close the cavity to determine whether the vacuum is being evacuated or not. This device applies tension to the wire by controlling and controlling means that can be used to open the cavity up to the vacuum pump during wire bonding work, that is, to apply a vacuum to the wire. In the pulled state, the wire is fed toward the outlet, the wire is unstrained, and a constant tension is applied to the wire.
実施例の説明
本発明のボンディングワイヤ張力附加装置の一実施例に
ついて第１図および第２図を用いて詳細に説明する。DESCRIPTION OF EMBODIMENTS An embodiment of the bonding wire tension applying device of the present invention will be described in detail with reference to FIGS. 1 and 2. FIG.
第２図は、ワイヤボンディング作業状態、すなわち、ワ
イヤの張力附加装置が機能しているときの同装置要部の
中心を切断した断面図を表わしている。FIG. 2 shows a cross-sectional view taken through the center of the main part of the wire bonding device, in which the wire tensioning device is functioning.
この装置本体は金属製であって、本体２１の中心部にワ
イヤ２の通過細孔２４，２６が有シ、極めて滑らかな表
面を持つセラミック製の筒状体２２゜２３が埋込まれて
いる。The main body of this device is made of metal, and has pores 24 and 26 through which the wire 2 passes in the center of the main body 21, and a ceramic cylindrical body 22 and 23 with an extremely smooth surface is embedded therein. .
通過細孔２４．２５は、通常、半導体装置に用いるワイ
ヤ例えば３０〜６０ミクロンφの金線などに適用できる
よう送り出し口の直径が０．１２〜０．１５關φ、出口
の直径が０．６〜０．８間φ程度に設定されている。ま
た、夫々の口元２６．２７はワイヤの挿通を容易にする
ために図に示す通シ、幅広く設計されている。The passage pores 24 and 25 usually have a delivery port with a diameter of 0.12 to 0.15 mm and an exit diameter of 0.1 mm so that they can be applied to wires used in semiconductor devices, such as gold wires with a diameter of 30 to 60 microns. It is set to approximately φ between 6 and 0.8. Further, each opening 26, 27 is designed to have a wide opening as shown in the figure in order to facilitate the insertion of the wire.
ところで通過細孔２４．２５が２つの筒状体を用いて形
成されているのは、送９出し側と出口側とで異なる細孔
径の設定が容易にできるだめでおる。By the way, the reason why the passage pores 24 and 25 are formed using two cylindrical bodies is that it is possible to easily set different pore diameters on the outlet side and the outlet side of the feed 9.
また、一方の筒状体２２の末端を楔状にすると対となる
他方の筒状体２３に対し、夫々の細孔の中心合せが行な
われるので、ワイヤ２の挿通性を高めるのに都合が良い
。筒状体２２．２３の中心部にあるワイヤ２の通過細孔
２４．２５の表面はワイヤ２０通過時の摩擦係数が小さ
いものが望ましい。そこで加工性の問題も考慮し、セラ
ミック製の筒状体が選ばれた。Furthermore, if the end of one cylindrical body 22 is wedge-shaped, the centers of the respective pores are aligned with respect to the other cylindrical body 23 forming a pair, which is convenient for improving the insertion property of the wire 2. . It is desirable that the surface of the wire 2 passage hole 24.25 in the center of the cylindrical body 22.23 has a small coefficient of friction when the wire 20 passes through. Therefore, considering the issue of workability, a ceramic cylindrical body was selected.
上記ワイヤの通過細孔２４．２５に対し、はソ直角に真
空引用の約３朋φの空洞２８が設けられその先端はホー
ス取付具３２を介して真空ポンプ（図示せず）に繋がっ
ている。このホース取付具３２とへ細孔２４．２５との
間に真空引きの状態を制御するだめのピストンが設定さ
れている。このピストンは、凸状部３１が１．５１１１
１ｆｆφで他の部分３朋φをした金属体３０と、この凸
状部３１に嵌合するための凹部を備えた金属体２９とに
よって接続一体化されて構成されたもので、その頭部は
ストッパの機能を持つよう直径が４ｍｍφと大きく設定
されている。A cavity 28 with a vacuum diameter of about 3 mm is provided at right angles to the wire passage hole 24, 25, and the tip thereof is connected to a vacuum pump (not shown) via a hose fitting 32. . A piston is provided between the hose fitting 32 and the hole 24.25 to control the state of evacuation. This piston has a convex portion 31 of 1.5111
It is constructed by connecting and integrating a metal body 30 with a diameter of 1 ffφ and a diameter of 3 mm in the other part, and a metal body 29 having a recessed portion for fitting into the convex portion 31. The diameter is set as large as 4mmφ to function as a stopper.
第２図において、前述の通シ、通過細孔２４゜２６が異
なった直径に設定されているのでキャピラリ１と張力附
加装置間でワイヤ２のたわみがあると、真空引き時の空
気の吸引力が下方の細孔２６側で強くなるために、ワイ
ヤ２が矢印方向に押し上げられる。かくして、ワイヤボ
ンディング作業中、継続的に真空引きの状態にされてい
ると、ワイヤ２は常に矢印方向に引張られ、キャピラリ
１の先端では水素トーチ等で形成されたボール部４がス
トッパとして機能しワイヤ２がビンと張った状態になり
、張力が附加されるのである。In Fig. 2, since the above-mentioned through holes 24 and 26 are set to different diameters, if the wire 2 is bent between the capillary 1 and the tensioning device, the suction force of the air during evacuation will increase. is stronger on the lower pore 26 side, so the wire 2 is pushed up in the direction of the arrow. Thus, when the wire bonding operation is continuously evacuated, the wire 2 is constantly pulled in the direction of the arrow, and the ball portion 4 formed by a hydrogen torch or the like at the tip of the capillary 1 functions as a stopper. The wire 2 becomes taut and tension is applied.
通過細孔２４．２５の寸法関係は、ワイヤ２のたわみが
解消できる程度の直径に選定されれば十分である。It is sufficient that the diameter of the passage pores 24, 25 is selected to such a degree that the deflection of the wire 2 can be eliminated.
次にワイヤボンディング作業を停止、すなわち真空引の
状態を遮断するに（ｒ：ｉ、第２図で示すＡの部分の遊
びが全くなくなるようにピストンの頭部ストッパの部分
まで押し上げ、空洞２８のところへピストンの３ｍｍφ
の直径部分を移動させ、空洞２８の約３Ｍπφの穴径を
完全に塞いでしまえばよい。Next, to stop the wire bonding work, that is, to cut off the vacuum state (r:i), push the piston up to the head stopper part so that there is no play in the part A shown in Fig. 2, and open the cavity 28. Tokoro piston 3mmφ
The hole diameter of about 3Mπφ of the cavity 28 can be completely closed by moving the diameter portion of the hole.
発明の効果
実施例の詳細な説明項で明らかになったように本発明の
ボンディングワイヤ附加装置を用いると常に一定の張力
がボンディングワイヤに加禾９れるため、たわみが発生
しなくなり、半導体装置の製造効率を高めることができ
る。Effects of the Invention As clarified in the detailed explanation section of the embodiments, when the bonding wire attachment device of the present invention is used, a constant tension is always applied to the bonding wire9, so no bending occurs, and the semiconductor device is improved. Manufacturing efficiency can be increased.
第１図はワイヤボンディング作業状態の１部を模式的に
表わした図、第２図は本発明のボンディングワイヤへの
張力附加装置の要部の断面図である。
１・・・・・・キャピラリ、２・・・・・・ワイヤ、３
・・・・・・クランパ、４・・・・・・ボール、２４．
２５・・・・・・ボンディングワイヤの通過細孔、２８
・・・・・・真空引用空洞。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第１
図
わFIG. 1 is a diagram schematically showing a part of the wire bonding work state, and FIG. 2 is a sectional view of the main part of the device for applying tension to the bonding wire of the present invention. 1...Capillary, 2...Wire, 3
... Clamper, 4 ... Ball, 24.
25...Bonding wire passage pore, 28
・・・・・・Vacuum quotation cavity. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
I'm trying to figure it out
Claims (1)
一直線にボンディングワイヤが通過できる細孔と、同細
孔に対し実質的に垂直方向に空洞が設けられ、その先端
部に真空ポンプへの連結用取付具を備えると共に、同取
付具と前記ワイヤ通過孔との間にあって真空引きの状態
が制御できる手段とを設けたことを特徴とするボンディ
ングワイヤへの張力附加装置。There is a pore that has a smaller diameter on the delivery side than the diameter on the exit side and allows the bonding wire to pass through it in a nearly straight line, and a cavity that is substantially perpendicular to the pore, and a hole is provided at the tip of the hole that is connected to the vacuum pump. 1. A device for applying tension to a bonding wire, comprising a connecting fixture and a means for controlling a vacuum state between the fixture and the wire passage hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59138325A JPS6116538A (en) | 1984-07-03 | 1984-07-03 | Tension-adding device for bonding wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59138325A JPS6116538A (en) | 1984-07-03 | 1984-07-03 | Tension-adding device for bonding wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6116538A true JPS6116538A (en) | 1986-01-24 |
| JPH0515066B2 JPH0515066B2 (en) | 1993-02-26 |
Family
ID=15219263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59138325A Granted JPS6116538A (en) | 1984-07-03 | 1984-07-03 | Tension-adding device for bonding wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6116538A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6318837U (en) * | 1986-07-22 | 1988-02-08 | ||
| WO2006049977A1 (en) * | 2004-10-28 | 2006-05-11 | Kulicke And Soffa Industries, Inc. | Wire tensioner for a wire bonder |
-
1984
- 1984-07-03 JP JP59138325A patent/JPS6116538A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6318837U (en) * | 1986-07-22 | 1988-02-08 | ||
| WO2006049977A1 (en) * | 2004-10-28 | 2006-05-11 | Kulicke And Soffa Industries, Inc. | Wire tensioner for a wire bonder |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0515066B2 (en) | 1993-02-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |