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JPS61164077U - - Google Patents

Info

Publication number
JPS61164077U
JPS61164077U JP2816285U JP2816285U JPS61164077U JP S61164077 U JPS61164077 U JP S61164077U JP 2816285 U JP2816285 U JP 2816285U JP 2816285 U JP2816285 U JP 2816285U JP S61164077 U JPS61164077 U JP S61164077U
Authority
JP
Japan
Prior art keywords
printed circuit
semi
circuit board
electrode part
transparent part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2816285U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2816285U priority Critical patent/JPS61164077U/ja
Publication of JPS61164077U publication Critical patent/JPS61164077U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Combinations Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案のプリント基板接続装置の斜視
図、第2図は同接続装置の使用例を示す断面図、
第3図は同接続装置の位置決め作業を示す平面図
である。 1……プリント基板、3……半田レジスト膜、
4……接続電極、5……半透明部。
Fig. 1 is a perspective view of the printed circuit board connection device of the present invention, and Fig. 2 is a sectional view showing an example of use of the connection device.
FIG. 3 is a plan view showing the positioning work of the connecting device. 1... Printed circuit board, 3... Solder resist film,
4... Connection electrode, 5... Semi-transparent part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 複数のプリント基板同士を相互に接続するため
の接続装置において、それぞれのプリント基板端
部に形成される接続電極部の裏面に被覆される半
田レジスト膜を除去して半透明部を形成してなり
、前記半透明部に光を照射した際接続電極部分を
陰となし、その位置を明確にしたことを特徴とす
るプリント基板接続装置。
In a connection device for interconnecting a plurality of printed circuit boards, a semi-transparent part is formed by removing the solder resist film covering the back surface of the connection electrode part formed at the end of each printed circuit board. . A printed circuit board connecting device characterized in that when the semi-transparent part is irradiated with light, the connecting electrode part is shaded to make its position clear.
JP2816285U 1985-02-26 1985-02-26 Pending JPS61164077U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2816285U JPS61164077U (en) 1985-02-26 1985-02-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2816285U JPS61164077U (en) 1985-02-26 1985-02-26

Publications (1)

Publication Number Publication Date
JPS61164077U true JPS61164077U (en) 1986-10-11

Family

ID=30525790

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2816285U Pending JPS61164077U (en) 1985-02-26 1985-02-26

Country Status (1)

Country Link
JP (1) JPS61164077U (en)

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