JPS61156714A - Manufacture of electronic parts - Google Patents

Abstract

PURPOSE:To improve productivity by providing a bending portion whose width is wider than a bore in a lead wire which is finer than a through hole of a cylindrical electronic parts, by coating liquid adhensive agent, and by heating after pressing it in the hole. CONSTITUTION:A bending portion 14 whose width d' is wider than a diameter D of a through hole 18 of beads 11 is formed extending over a length (b) of at most a length B of ferrite beads 11 in a center portion of a lead wire of diameter d. When a proper quantity of adhesive agent 16 is coated on the bending portion 14 and pressed in a hole 18, a part of the adhesive agent is sucked in a hole 12 together with the bending portion 14, and the rest is adhered to an outside of the hole 18. The ratio of a diameter D and d is chosen to be a value which makes a liquid adhesive agent generate capillary phenomenon by a space g. After the adhesive agent 16 is heated, coeffecient of viscosity is lowered, and after the adhesive agent 10 outside the hole 18 is accomodated in the through hole 12, it is heat-hardened. As the bending portion 14 is functioned by tacking and easily manufactured, an adhesive agent is filled in a short time and parts of good appearance is massproduced.

Description

Detailed Description of the Invention (Field of Industrial Application) The present invention involves inserting a lead wire into a through hole of a cylindrical electronic component body and fixing the lead wire to the electronic component body with an adhesive. This invention relates to a method for manufacturing electronic components.

(Prior Art) In general, various electronic devices are equipped with a
As shown in the figure, a lead wire 3 is inserted into a through hole 2 of a cylindrical ferrite bead 1, and this ferrite bead 1 acts as an inductance against noise passing through the lead wire 3, thereby blocking the passage of this noise. electronic components are used.

By the way, in order to manufacture electronic components as shown in FIG. 8, conventionally, ferrite beads 1 and lead wires 3 cut to the required length are prepared,
After inserting the lead 113 into the ferrite bead 1 and positioning the ferrite bead 1 at a predetermined position, ring-shaped fixing fittings 4 and 5 are fitted from both ends of the lead wire 3, respectively, and these fixing fittings 4 and 5 are attached to the ferrite bead 1. At that position, the fixing metal fittings 4.5 are deformed in the radial direction toward the lead wire 3 and caulked, thereby fixing the ferrite bead 1 at a predetermined position on the lead wire 3. Ta.

However, when manufacturing electronic components as described above, there is nothing on the lead wire 3 to position the ferrite bead 1, making it difficult to position the ferrite bead 1. It was necessary to caulk near both end faces of the fixing metal fittings 4.5, and the caulking work of the fixing metal fittings 4.5 was also difficult, resulting in low productivity and not being suitable for mass production.

(Objective of the Invention) The present invention has been made in view of the above-mentioned points, and is intended to prevent the appearance of an electronic component formed by inserting a lead wire into a through hole of a cylindrical electronic component body and fixing the component. The purpose of the present invention is to provide a method for manufacturing electronic components that can be easily manufactured on a daily basis with improved productivity.

(Summary of the Invention) The present invention provides a lead wire to be inserted into and fixed to a cylindrical electronic component body, which has a bent portion having a bend larger than the inner diameter of the opening hole of the electronic component body. After applying a liquid adhesive to the lead wire and press-fitting it into the through-hole of the electronic component body, the adhesive is heated to lower its viscosity, and the bent part of the lead wire and the inner wall of the through-hole of the electronic component body are bonded together. This is characterized in that the lead wire is fixed to the electronic component body by filling the space between the lead wire and the lead wire.

(Example) An example of the present invention will be described below in detail with reference to the drawings.

Embodiments in which the present invention is applied to electronic components having the same functions as those shown in FIG. 8 are shown in FIGS. 1 to 7.

First, as shown in FIG.
2, a ferrite bead 11 as a cylindrical electronic component body having a length of B is prepared.

Similarly, as shown in FIG. 2, a lead wire 13 having a diameter of d is prepared. This lead l1l13 has a bent portion having a bending radius d- larger than the diameter of the through hole 12 of the ferrite bead 11 over a length b (≦B) that is less than or equal to the length B of the ferrite bead 11 at approximately the center thereof. form 14.

As shown in FIG. 3, a liquid adhesive 16 such as a thermosetting one-component epoxy resin is applied to the bent portion 14 formed on the lead wire 13 using a dispenser 15, or Alternatively, as shown in FIG. 4, a similar adhesive 16 is supplied to the outer peripheral surface of the O-roller 17 rotating in the direction indicated by arrow A1 or A2, and the bent portion 14 of the lead wire 13 is connected to the outer peripheral surface of the roller 17. This bent portion 14 is brought into contact with the surface.
Apply adhesive 16 to.

It is desirable that the amount of adhesive 16 applied does not exceed the amount that is applied between the inner wall of the negative through hole 12 of the ferrite bead 11 and the lead wire 13.

As above, create the bent part 14! ! The lead wire 13 coated with the agent 16 is inserted into the through hole 12 of the ferrite bead 11 from the opening 18 at one end of the ferrite bead 11 as shown in FIG. The bent portion 14 of the lead wire 13 coated with the adhesive 16 is press-fitted into the through hole 12 .

By this press-fitting, a part of the adhesive 16 is drawn into the through hole 12 of the ferrite bead 11 together with the bent part 14 of the lead wire 13, and the rest is attached to the outside of the opening 18 at one end.

Incidentally, the ratio of the diameter of the through hole 12 of the ferrite bead 11 to the diameter d of the lead wire 13 is the same as the one end opening 18 of the through hole 12 formed between the inner wall of the through hole 12 of the ferrite bead 11 and the lead wire 13. However, in the capillary gap 9 communicating with the opening 19 at the other end, at least the liquid adhesive 16 is arranged in one direction so that a capillary phenomenon occurs.

In this state, the adhesive 16 is heated to a predetermined temperature by blowing hot air or the like to lower its viscosity, and the adhesive 16 adhering to the outside of the opening 18 at one end is quickly accommodated in the four holes 12.

Further, when the adhesive 16 is completely accommodated in the through hole 12, heating is performed to harden the adhesive 16.

In this case, the first heating that lowers the viscosity of the adhesive 16 is
The heating for curing and heating may not be performed separately, but may be performed simultaneously in the same curing furnace or the like.

Note that if the lead wire is coated with solder, use adhesive 1
It is desirable that the heating in step 6 be performed at a temperature below the melting temperature of the solder.

For example, d = 0.65mm X[) = 1.0m
When an adhesive with a viscosity of 70,000±15,000 cps at 25° C. to 30° C. is heated and used at 125° C., complete filling takes place in 10 to 30 seconds.

In this way, the bent portion 14 of the lead wire 13 can be used for positioning the ferrite bead 11 and for positioning the ferrite bead 11.
The bent portion 14 of the lead wire 13 is press-fitted into the ferrite bead 11 and serves as a temporary fixing for the ferrite bead 11 until the adhesive 16 hardens, thereby greatly facilitating the manufacture of electronic components.

Further, by pressing the lead wire into the through hole 12 of the ferrite bead 11 and heating the adhesive 16 adhering to the bent portion 14 to lower the viscosity, the adhesive 16 is caused to penetrate through the through hole 12 by the capillary phenomenon. The adhesive 16 is quickly drawn into the hole 12, and as shown in FIG. 7, there is almost no swelling of the adhesive 16 from the end face of the ferrite bead 11, and the appearance of the electronic component is not damaged by the adhesive 16.

The method for manufacturing electrical parts of this Komei is achieved by the method described below, but it is not limited to the method of the above embodiment, and may be modified as appropriate without changing the gist. Needless to say.

For example, adhesives are heat cured! It is not limited to one-component epoxy resin, but it is one whose viscosity decreases when heated, and what can be done to reduce the viscosity so that it easily adheres to the bent part of the lead wire at room temperature (25°C to 30'C). Other adhesives may be used if available.

Further, heating for curing the adhesive may not necessarily be necessary depending on the type of adhesive used.

Furthermore, the electronic component body is limited to ferrite beads; (
It does not have to be the same, but it can be something else.

The shape of the electronic component is also not limited to the axial type, and may be other shapes such as the radial type.

(Effects of the Invention) As explained above, the method for manufacturing an electronic component of the present invention includes the following steps:
The bent part formed on the lead wire is used to position and temporarily fix the electronic component body, and after the bent part of the lead wire is press-fitted into the through hole of the electronic component body, the adhesive attached to this bent part is removed. By heating the agent to lower its viscosity, the capillary action of the agent is used to fill the through-hole of the electronic component body, so that the electronic component body is reliably positioned at a predetermined position. Adhesive can be filled in a short time, and it has various effects such as easy mass production of electronic components with good appearance.

[Brief explanation of drawings]

1 to 7 are explanatory diagrams of a method of manufacturing an electronic component according to the present invention, and FIG. 8 is a sectional view of an electronic component manufactured by a conventional method of manufacturing an electronic component. 11-ferrite bead, 12-through hole, 13-lead wire, 14-bending part, 15-dispenser, 16-adhesive, 17-roller, 18-@opening, 19-other end opening, 9
- Capillary space. Figure 1 Figure 2 Figure 3

Claims (1)

[Scope of Claims] A method for manufacturing an electronic component, which comprises inserting a lead wire into a through hole of a cylindrical electronic component body and fixing the lead wire to the electronic component body with an adhesive. forming a bent part having a bending width larger than the inner diameter on the lead wire having a smaller diameter than the inner diameter of the through hole, applying a liquid adhesive to the bent part, and attaching the lead wire to the electronic component. After inserting the wire through the opening at one end of the through-hole of the element body and press-fitting this bent part into the through-hole, a capillary gap leading from one end of the through-hole to the other end is formed by the through-hole and the lead wire forming the bent part. , an electronic component characterized in that the adhesive is heated to lower its viscosity, and the adhesive enters from the outside of the through-hole toward the inside by capillary action caused by the capillary gap to fill the inside of the through-hole. manufacturing method.