JPS6115399A - Electronic device by heat convection heat sink housing structure - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [A δ, Ming technical field] The present invention relates to an electronic device having a heat convection heat dissipation type housing structure.

[Technical background of the invention and its problems]

General ≦-1 In electronic equipment, for example, swiss.

JP, jj If for some reason, such as noise or cost, it is not possible to provide a forced cooling mechanism such as an air cooling fan or a cooler in the housing, a heat dissipation structure using natural convection is adopted. An electronic device housing with a heat dissipation structure based on this natural convection 52 (2)
When a plurality of heat-generating elements, for example, a plurality of PCBs (circuits) are mounted in a step-like manner in a state where they can be inserted and removed, the following problems occur. In.

Inside the housing 1, two PCB chassis 2, 2 are provided in a stepped manner, and the lower PCB chassis 2 has PCBs 3. J, .
There was a problem in that the heat generated in B remained, and as a result, the heat dissipation effect of the lower PCB was impaired.

To explain this drawback using FIG. 5, the heat generated from the C, D, and E slots of the lower PCB chassis 2 is
As a result, the I) CB installed in the C, D, and E slots of the lower I) CB chassis 2 stays in the empty slot 4 of the CB chassis 2 and is removed from the PCBC yarn. Heat dissipation becomes poor, leading to malfunctioning tongue.

[Purpose of the invention]

The present invention has been made in view of the above-mentioned circumstances.
Heat convection can be promoted for mounted components C2 that have heat generating elements such as circuit boards to be mounted, even if the surrounding conditions change so as to impede convection.

It is an object of the present invention to provide an electronic device having a heat convection heat dissipation type housing structure that can maintain the desired heat dissipation effect by heat convection.

[Summary of the invention]

The present invention provides an electronic device having a heat dissipation casing structure using natural convection, in which a heat source for promoting convection is provided above a circuit section from which heat is radiated in the casing. For mounted components C2 that have heat generating elements such as circuit boards mounted inside the body, even if the surrounding conditions change to prevent convection, it is possible to promote heat convection and achieve the desired heat dissipation effect by heat convection. can be maintained.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to the drawings. $1
In Figure C2, 11 is a housing, 12 is a PCB chassis arranged in a stepped manner, and 13, 13°, . . . are PCBs. 15. 15... are dummy &-domains inserted into empty slots of the upper PCB chassis 12 for promoting heat convection.

In Fig. 2, the dummy board 15 is shown, and I: on the board is the slot C in the lower chassis 12; heating elements 16, 16... are mounted.

The heat generated in the C, D, and E slots of the lower PCB chassis J2 is transferred to the heating element 1 of the dummy Z-board 15 for promoting heat convection.
6,16. Due to the heat generated by C2, the heated air is drawn out into the opening at the top of the PCB chassis by the rising effect C2. That is, the chimney effect is promoted by the heating elements 16, 16, .

In this way, by mounting the dummy z-card 15 for promoting heat convection in the empty slot in the PCB chassis 12,
In order to discharge the heat accumulated in the empty slots to the outside of the PCB chassis, as a result, cold air from outside the housing 11 enters through the lower opening of the lower PCB chassis to reliably cool the PCBJj.

Figures 3(a) and 3(b) respectively show the experimental results. In Figure 1, A is the upper part C: one embodiment of the present invention (when the dummy tate 15 for promoting heat convection is mounted according to the second embodiment).

It also shows the temperature changes in the required parts of the heat radiated parts divided into two lower tiers C when the B drain board is removed and the slot is left as an empty slot. Figure 1 as a regulator power supply device (
Figure a) shows the temperature of the winding part of the converter transformer, and Figure (b) shows the shell temperature of the seven-hour power transistor (2SC3046). Incidentally, in both cases A and B, the load 'magnetic current of the power supply device is the same and constant.

Here, a temperature drop of about 2°C occurred in both the winding part of the converter transformer and the shell part of the nozzle transistor, since a dummy board for promoting thermal convection was mounted.

〔Effect of the invention〕

As described in detail above, according to the electronic device having the heat convection heat dissipation type housing structure of the present invention, the electronic device C having the heat dissipation housing structure by natural convection C: a circuit to be heat dissipated in the housing. The structure is such that a heat source is provided above the device to promote convection. Even if the conditions change so as to impede convection, it is possible to promote heat convection and maintain the desired heat dissipation effect by heat convection.

[Brief explanation of drawings]

Figure 1 is an explanatory diagram of the configuration in one embodiment of the present invention, 4)2
The figure is a perspective view showing the dummy bead for promoting heat convection in the above embodiment (2), and Figures 3 (a) and 3 (b) are based on experimental results f2 showing a comparison between the configuration of the present invention and the configuration of the conventional example. A diagram showing a temperature curve of a heat radiated part, No. 4I71 is a perspective view showing a casing structure for explaining a conventional configuration, and FIG. .12...PC, LB chassis.

Claims (1)

[Claims] In an electronic device having a heat dissipation housing structure using natural convection, the heat dissipation type housing structure is characterized in that a heat source for promoting convection is provided above a circuit section to be heat dissipated in the housing. Electronic equipment by.