JPS6114739A - Semiconductor device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor device in which a semiconductor element chip is housed in a package, and more particularly to a semiconductor device in which a package is formed of a transparent material.

[Conventional technology]

2. Description of the Related Art Semiconductor devices as electronic components are generally supplied in a packaged form from the viewpoint of ease of handling, chip protection, mounting on a wiring board, and the like. Various types of packages are known, such as metal packages, ceramic packages, and resin-sealed packages.

Here, FIGS. 4 and 5 are perspective views showing different conventional examples of the semiconductor device as described above.

In these figures 4 and 5, lead terminals (so-called pins) M, 52 are protruding, and among these lead terminals or pins, reference terminals, such as the so-called first pin, etc., are used to display all of them. As a mark, each valley package 41.51 is formed with, for example, a recess 43.53.

That is, in the example of FIG. 4, the pin 42A closest to the recess 43 serving as the 1-bin display mark is the first pin, and in the example of FIG. The pin 52A at the upper left end becomes the first bin.

By the way, when external light is irradiated onto a semiconductor element chip, such as a light receiving element or a light emitting element, or when it is necessary to lead light sound from the semiconductor element chip to the outside, at least one of the above packages is used. A structure in which the part corresponding to the semiconductor element chip is transparent is used, but if you want to avoid complicating the structure by using transparent material for part of the package, or if you want to miniaturize the entire component, panocouples are used. It is also possible to form the entire structure from a transparent material.

[Problem that the invention seeks to solve]

In a semiconductor device using such a completely transparent package sound, even if four parts or convex parts are formed on the package surface in order to display all the lead terminals that serve as the reference for the first bin, etc., the package will not be visible. Since it is transparent, it has the disadvantage that it is difficult to read the irregularities on the surface. This is because the wiring pattern at the bottom of the package is visible not only when handling the semiconductor device but also after it is mounted on a wiring board, making it difficult to visually distinguish between the unevenness on the package surface and the wiring pattern. Therefore, it may be possible to write an ink mark on the surface of the transparent package to indicate the reference bottle, but the ink of the above ink mark may stain the package surface during transportation and handling, reducing light receiving efficiency and light emitting efficiency. In some cases, there is a risk that this may cause malfunction.

In view of these circumstances, the present invention has a simple configuration that allows the reference lead terminals of the first bin, etc. of a semiconductor device located at the bottom of a transparent package to be displayed, and the reference lead terminals of the reference bin can be clearly displayed without the risk of contaminating the surface. It is an object of the present invention to provide a semiconductor device that can perform identification and also allows identification of a reference bottle not only from the front side of a package but also from the back side.

[Means to solve all problems]

That is, the feature of the semiconductor device according to the present invention is that in a semiconductor device in which a semiconductor element chip connected to a plurality of lead terminals (so-called bins) is housed in a transparent package, a standard among the plurality of lead terminals is The shape of the lead terminal, for example, the inside of the transparent package of the first pin,
The shape is different from other lead terminals and can be easily distinguished visually, for example, a circular hole is drilled only in the internal lead part of the first pin, and all reference lead terminals are displayed (for example, 1-bin display). That's true.

[Effect]

Therefore, when viewed through the shape coating of each lead terminal inside the transparent package, the shape of the reference lead terminal such as the first pin is different from the shape of other terminals and can be easily distinguished visually. The reference lead terminal can be reliably identified from both the front and back sides of the package. Furthermore, there is no need to print ink marks or the like on the surface of the package, and there is no risk that the surface will be stained with ink.

〔Example〕

FIG. 1 is a plan view showing a semiconductor device assembly according to a first embodiment of the present invention. In FIG. 1, a plurality of wire bonding electrode bands 3 are formed on a semiconductor element chip 2 sealed in a transparent package 1 made of, for example, transparent resin.
and the end of the lead terminal 4 are electrically connected through the entire bonding wire 5. A plurality of lead terminals 4, for example eight, are provided, and among these lead terminals 4, a reference terminal, for example, inside the transparent package 1 of the first bottle 4A, has a terminal that can be distinguished from other lead terminals. As for the shape, a circular hole 6 is bored. That is, as the lead 0 pattern in the transparent package 1, the lead terminals 4 other than the first bin 4A, which is the reference lead terminal, have, for example, a rectangular hole 7 or no hole. On the other hand, the circular hole 6 is formed only in the first bottle 4A. These in-package lead patterns can be clearly seen from the outside through the transparent package 1, and can be clearly distinguished and read from the shapes of the circular holes 6 and other lead terminals of the first bottle 4A.

Here, the shape of the lead in the package for directing the first bottle 4A' is not limited to the circular hole 6, but is, for example, approximately U-shaped as in the second embodiment of the present invention shown in FIG. A notch may be formed in the first bottle 4A. Of course, this U-shaped notch 11 can also be clearly distinguished from the shape of the other lead terminals 4 in the package.

Next, FIG. 3 shows a third embodiment of the present invention, in which the semiconductor element chip 2 is tilted obliquely with respect to the transparent package 1. Also in the semiconductor device of the third embodiment, as a lead pattern in the transparent package 1, for example, six circular holes are formed only in the first pin 4A, which serves as the reference lead terminal, and the other lead terminals 4 are visually connected to each other. easily identifiable.

Note that the present invention is not limited to the above-mentioned embodiments. For example, the reference lead terminal is not limited to the first pin, and the shape for displaying all the reference lead terminals may also be a circular hole or a U.
In addition to the letter-shaped notch, any shape may be used as long as it can be visually distinguished from other lead terminals. This also includes drilling circular or square holes in the lead terminals other than the reference lead terminals, leaving only the reference lead terminals without holes.

〔Effect of the invention〕

According to the semiconductor device according to the present invention, a lead terminal having a shape different from other shapes when viewed through the surface of the transparent package, such as a lead terminal with a circular hole 6 cut out or a U-shaped notch, can be seen through the surface of the transparent package. 11, etc., it is possible to clearly recognize the reference lead terminal, for example, the first pin 4A'. Since the package is transparent, the reference lead terminals such as the 1st pin can be clearly distinguished not only from the front side of the package but also from the back side, and when the user uses the package while viewing from the back side. etc., the reference lead terminal can be easily read.

Furthermore, compared to the case where irregularities are formed on the surface of the transparent package, it is easier to visually distinguish the reference lead terminal, there is no possibility of misidentification, and the reference lead terminal can be reliably read. Furthermore, compared to the case where ink marks or the like are attached to the surface of a transparent package, it is possible to avoid drawbacks such as a decrease in sensitivity due to stains caused by ink, etc.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing a first embodiment of the invention, FIG. 2 is a plan view showing a second embodiment of the invention, and FIG. 3 is a plan view showing a third embodiment of the invention. , FIG. 4, and FIG. 5 are perspective views showing different conventional examples. 100. Transparent package 2...Semiconductor element tip 4...Lead terminal 4A...Reference lead terminal (first pin) 6...Circular hole 11...U-shaped notch

Claims (1)

[Claims] In a semiconductor device in which a semiconductor element connected to a plurality of lead terminals is housed in a transparent package, the shape inside the transparent package of the reference lead terminal among the plurality of lead terminals is compared to that of the other lead terminals. A semiconductor device characterized in that a reference lead terminal is displayed as a shape different from that of the semiconductor device.