JPS61145229A - Production of laminate - Google Patents

Abstract

PURPOSE:To obtain a laminate for printed circuits, excellent in high-frequency characteristics, by laminating nonwoven glass cloth bases impregnated with a varnish comprising a specified 1,2-polybutadiene resin and DAP resin. CONSTITUTION:Nonwoven glass cloth bases are impregnated with a thermoset ting resin varnish comprising a 1,2-polybutadiene resin having pendant vinyl groups and DAP resin. These nonwoven cloth bases are laminate-molded to obtain the purpose laminate. The DAP resin is prepared by using allyl alcohol which is its hydrolyzate as a principal material, has polymerizable double bonds in the molecule, and undergoes crosslinking with 1,2-polybutadiene to form a three-dimensional polymer. In this way, a laminate having a dielectric constant as high as that obtained when only the polybutadiene resin is used and improved heat resistance can be obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for producing a printed circuit laminate having excellent high frequency characteristics.

Conventional technology Conventionally used as a laminate for printed circuits in electronic equipment.

Glass cloth base epoxy laminate using epoxy resin,
Glass non-woven fabric base epoxy laminates are often used. However, in recent years, as mounting density has increased and wiring patterns have become denser, an increase in heat generation has become a problem. However, the epoxy resin-based laminates have unsatisfactory characteristics.

On the other hand, as a thermosetting resin with excellent high frequency properties, 1.2
Polybutadiene resin is known, and laminates using it have been proposed.

Problems to be Solved by the Invention However, when a polybutadiene resin with a relatively low molecular weight (molecular weight i, ooo to about 5.000) is used, the curing speed is extremely slow, and the curing speed is extremely slow, and the curing speed is extremely low at a constant temperature. When the temperature reaches that point, it hardens with rapid heat generation, resulting in a laminate with large curing shrinkage. Still relatively high molecular weight (
When using a polymer with a molecular weight of about 100,000 to 200,000, there is no such drawback, but it is difficult to increase the crosslinking density of the cured product, and it becomes elastic rubber-like with a relatively low transition point.
Heat resistance is required and it is not suitable for Class B laminates.

In addition, in an attempt to solve these problems, there have been cases in which modified polybutadiene resins in which hydroxyl groups, carboxyl groups, epoxy groups, etc. There is no real solution.

The present invention aims to solve these drawbacks of laminates using 1.2 polybutadiene resin.

Means for Solving the Problems The present invention impregnates a glass nonwoven fabric substrate with a thermosetting resin varnish consisting of a polybutadiene resin having vinyl pendant groups and a dump resin.

This is characterized by lamination molding.

Functional dump resin is mainly made from allyl chloride obtained by chlorinating propylene or allyl alcohol, which is a hydrolyzate thereof, and has a polymerizable double bond in the molecule, and has 1.2 polybutadiene and allyl alcohol. A crosslinking reaction results in a three-dimensional polymer. By removing this material, a laminate with improved heat resistance and a dielectric constant equivalent to that of 1.2 polybutadiene when used alone can be obtained.

Furthermore, by selecting a glass nonwoven fabric as the base material, the resin content can be increased, and the amount of glass fibers having a relatively poor dielectric constant can be reduced in the entire laminate.

Example In the present invention, the polybutadiene having vinyl pendant groups is preferably contained in the polymer chain at 80wt1 or more,
It is desirable to use one having a molecular weight of 50,000 to 150,000. 1.2 Containing 80 wt% or more of polybutadiene in the polymer chain significantly improves heat resistance, and it is preferable to use polybutadiene with a relatively large molecular weight in terms of faster curing speed and less curing shrinkage. It is not particularly limited.

As the DAMP resin, a liquid DAP monomer or a solid DAMP prepolymer which is a first condensation product can be used, and the amount thereof is preferably 5 to 5 to 1.2 polybutadiene.
0 wt%, more preferably 10 to 20 wtq6.

If the molecular weight of the 1,2 polybutadiene resin used is low, it is preferable to use a DUP prebolymer, and if it is high, it is preferable to use a DAMP monomer.
The best results were obtained using polybutadiene and 10-20 wt% dump monomer.

Similarly, various monomers such as styrene monomer and methyl methacrylate were investigated in place of dump resin, but good results could not be obtained.

Furthermore, it is desirable to select a glass nonwoven fabric that has as little binder as possible and has high tensile strength when heated.

Next, a conventional example, an example of the present invention, and a comparative example will be described.

Conventional Examples 1 to 5 Eight impregnated nonwoven fabrics or impregnated fabrics obtained from the combinations of base materials and resins shown in Table 1 are laminated, copper foil is placed on both surfaces, and a pressure of 301y/crll is applied for 30 minutes. Thickness i by heating and pressurizing
: A 1.6 mm double-sided copper-clad laminate was obtained.

Table 1 *1 Dicumyl peroxide Qin 2 Diami*Diphenylmethane Examples 1 to 5. Comparative Examples 1 to 2 Impregnated nonwoven fabrics or impregnated fabrics obtained from the combinations of base materials and resins shown in Table 2 were heated and pressurized in the same manner as in the conventional examples to form double-sided copper-clad laminates with a thickness of 1.6 mm. Got the board.

Table 3 shows the characteristics test results for each of the above laminates.

The test method is as shown in Table 4.

From the results shown in Table 3 and Table 4, it can be seen that when the 1.2 polybutadiene resin is combined with the Dasobu resin, the curing speed of the varnish is high, and a laminated plate with a low dielectric constant and good heat resistance can be obtained. Combining the dump monomer with the polymeric 1.2 polybutadiene suppressed curing shrinkage of the varnish to a minimum and also provided the best heat resistance.

Effects of the Invention As described above, according to the present invention, a laminate can be obtained which has a fast curing speed during molding, has a dielectric constant of 1.2 equivalent to that of using polybutadiene alone, and has excellent heat resistance. High density wiring patterns, which had been a problem in the past, due to cracking.
It is possible to achieve high propagation speed for high-speed switch signals, and its industrial value is extremely great.

Claims (1)

[Claims] A method for producing a laminate, which comprises impregnating a glass nonwoven fabric base material with a thermosetting resin varnish made of a 1.2 polybutadiene resin having a vinyl pendant group and a DAP resin, and laminating and molding the same.