JPS6112685Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a heat dissipation structure for a hermetically sealed active circuit module.

In a metal package type active circuit module, a metallized pattern is formed on a ceramic substrate, and the necessary active elements are arranged and fixed to a stem, and a cap is placed over these to isolate them from the outside. . When constructing a microwave communication device, etc. using such an active circuit module, it is customary to place the stem of the module in close contact with the carrier part of the communication device housing, and to radiate heat from the module through the housing. It is. Therefore, in order to efficiently transfer the heat of the module to the carrier portion of the housing, the lower surface of the stem of the module is a flat surface.

In addition, in order to further promote heat dissipation, a heat dissipation structure has been proposed in which an inert heat transfer medium solution is sealed in a sealed casing equipped with a radiator and the active circuit module is immersed in this heat transfer medium solution. The heat transfer medium heated by the module rises by convection, exchanges heat with the outside air through the radiator in the casing, and is cooled, and then comes into contact with the module again to cool it.

However, in such a heat dissipation structure, the stem of the module is attached closely to the casing, so the circulating heat medium cannot directly contact the stem portion that is most exposed to the highest heat. For this reason, the cooling effect of the heat medium could not be sufficiently exerted, and heat tended to accumulate within the module.

The purpose of the present invention is to provide a highly efficient active circuit module heat dissipation structure. In order to achieve this objective, the present invention forms a path for heat medium circulation in the stem of the module to actively circulate the heat medium to the hottest part of the module.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings, and the structure, operation, and effects of the present invention will be clarified.

FIG. 1 shows the active circuit module equipped with the heat dissipation structure of the present invention installed in the casing of a communication device. The active circuit module 1 has a stem 2 and a cap 3, and on the upper surface of the stem 2, an active element (not shown) is fixed as is well known, and a metallized pattern (not shown) is formed. ing. A plurality of mutually parallel grooves 4 are formed on the lower surface of the stem 2 over the entire length of the stem. This active circuit module 1 is tightly fixed to the bottom of a metal casing 5 with one end open. An inert heat medium solution is injected into the casing 5. Fluorinert manufactured by 3M Company can be used as a heat medium. The open end of the casing 5 is closed with a heat sink 6 having a large number of heat sink fins, and a sealing member such as an O-ring is interposed between the heat sink 6 and the end of the casing 5 to seal the heat medium. do.

When mounting the active circuit module in a communication device or the like, the casing 5 is attached to the carrier portion 8 of the casing 7 of the communication device or the like. If necessary, a circulator 9 is installed on the opposite side of the carrier portion, and a filter 10 is installed on the same side. Connections between these elements are made by means of connection terminals 12 inserted into through holes 11 formed in the casing and carrier parts.

In the heat dissipation structure according to the present invention, since the heat medium circulation passage is formed on the lower surface of the stem, the heat medium can circulate by convection while contacting the stem closest to the heat generating part of the active circuit module. can be effectively cooled. Furthermore, since the heat sink is separated from the carrier portion of the housing by the casing, wide free surfaces are left on both sides of the carrier portion. Therefore, various members such as filters and circulators can be easily attached to the free surface of the carrier portion, which is convenient.

In mounting, it is preferable to position the active circuit module so that the stem groove is vertical. By doing so, as shown in Figure 2, the convection of the heat medium will not only be stable and smooth, but also
Even if air is taken into the casing or steam is generated, the heat medium can reliably contact the inner wall of the heat sink and radiate heat.

[Brief explanation of the drawing]

FIG. 1 is a horizontal cross-sectional view of a heat dissipation structure of an active circuit module according to the present invention installed in a part of a casing of a communication device, and FIG. 2 is a cross-sectional view taken from FIG. 1... Active circuit module, 2... Stem, 3
...Cap, 4...Groove, 5...Casing, 6
...heat sink.

Claims (1)

[Scope of utility model registration request] A hermetically sealed active circuit module with a groove formed over the entire length of the stem is tightly attached to the bottom of the casing which is open at one end, and the open end of the casing is sealed with a heat sink having heat dissipating fins to separate the casing and the heat sink. A sealed space is formed in between, an inert heat medium solution is sealed in the sealed space, and the heat dissipation plate with the bottom of the casing fixed to the carrier part of the casing is spaced apart from the carrier part. Heat dissipation structure of circuit module.