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JPS61111251A - Holding device for flat laminar member - Google Patents

Holding device for flat laminar member

Info

Publication number
JPS61111251A
JPS61111251A JP22895584A JP22895584A JPS61111251A JP S61111251 A JPS61111251 A JP S61111251A JP 22895584 A JP22895584 A JP 22895584A JP 22895584 A JP22895584 A JP 22895584A JP S61111251 A JPS61111251 A JP S61111251A
Authority
JP
Japan
Prior art keywords
held
base plate
suction
substrate
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP22895584A
Other languages
Japanese (ja)
Other versions
JPH0215461B2 (en
Inventor
Masuo Shiaku
塩飽 万寿男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KURESEN SANGYO KK
Original Assignee
KURESEN SANGYO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KURESEN SANGYO KK filed Critical KURESEN SANGYO KK
Priority to JP22895584A priority Critical patent/JPS61111251A/en
Publication of JPS61111251A publication Critical patent/JPS61111251A/en
Publication of JPH0215461B2 publication Critical patent/JPH0215461B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H3/00Separating articles from piles
    • B65H3/08Separating articles from piles using pneumatic force
    • B65H3/14Air blasts producing partial vacuum

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manipulator (AREA)
  • Specific Conveyance Elements (AREA)
  • Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)

Abstract

PURPOSE:To prevent slip down of a member by means of a positioning control means, by a method wherein an attraction force is generated from an adsorbing surface, spaced close to the surface of a member to be held at a specified gap therebetween, through a high speed fluid film formed by injecting an air flow. CONSTITUTION:The under surface of an adsorbing plate 10 is a plane and forms an adsorbing surface 10a to which a base plate 7 is held. A ventilating hole 11 is bored in its central part, control members 14a, having thickness 0.2-0.8mm thicker than that of the base plate 7, are securely located to the corner parts of the surface 10a to prevent slip-down of the base plate 7. The base plate 7 is positioned below the surface 10a in a condition to feed air through the hole 11 and in a condition in that the diagonal line of the base plate 7 with the plate 10 is varied by 45 deg., the surface 10a approaches the base plate 7 to reduce a gap distance (d) to a fine gap distance of 0.2-0.8mm, air is exhausted in the distance (d) through the hole 11 at a high speed toward the outside to generate buoyancy by means of a negative pressure produced in the distance (d) to hold the base plate 7 in a non-contact state.

Description

【発明の詳細な説明】 「産業上の利用分野」 本発明は表面が平滑面である平板状部材の保持装置に係
り、特にウェハ、レチクル、フオットマ持装置に関する
DETAILED DESCRIPTION OF THE INVENTION "Industrial Application Field" The present invention relates to a holding device for a flat member having a smooth surface, and particularly to a wafer, reticle, and formatter holding device.

「従来の技術」 ウェハ、レチクル、フオットマスク等の半導体製造用各
種基板においては、高密度回路形成面にに塵埃、油脂そ
の他の障害物の付着や傷の発生を避ける為に、側縁面を
利用して保持部材を点接触が常である。
``Prior art'' In various substrates for semiconductor manufacturing such as wafers, reticles, and photomasks, side edges are used to prevent dust, oil, and other obstacles from adhering to the surface on which high-density circuits are formed and from causing scratches. The holding member is usually in point contact with the holding member.

その−例を第3A、3B図に基づいて簡単に説明すると
、1は方形平板状の基板を吊下しながら搬送を行う保持
装置で、下方に垂下された垂直軸2よりコの字状に対称
に分岐して配設された一対の分岐軸3,4と、該分岐軸
3,4の下側水平端に固設された保持部材5.6とを有
し、該保持部材5.8の先端係止部は45度の傾斜角を
もって斜め上方に切断すると共に、該傾斜切断面をV溝
状に凹設し、該V溝状保持面5a、8aに基板7両角隅
部下側の側縁面7aが線接触にて吊下保持可能に構成さ
れている。
An example of this will be briefly explained based on FIGS. 3A and 3B. 1 is a holding device that transports a rectangular flat board while suspending it, and the device 1 is a holding device that suspends and transports a rectangular flat board. It has a pair of branch shafts 3, 4 which are symmetrically branched and arranged, and a holding member 5.6 fixed to the lower horizontal end of the branch shafts 3, 4, and the holding member 5.8. The end locking part is cut obliquely upward at an inclination angle of 45 degrees, and the inclined cut surface is recessed in a V-groove shape, and the V-groove-shaped holding surfaces 5a and 8a are provided with the lower sides of both corners of the board 7. The edge surface 7a is configured to be able to be held suspended by making line contact.

「発明が解決しようとする問題点」 しかしながら、かかる従来技術においては、例え回路形
成に影響の少ない基板側縁面7aを利用して保持部材5
,6を接触保持するにしても非接触ではない為に完全に
塵埃等の付゛着を避けることが出来ず、例えば前記接触
部に付着した洗浄液等が、搬送中に塵埃を伴なって基板
7表面中央部の回路形成面まで流下してしまったりする
場合もあり、基板7搬送に使用する保持装置1として不
完全なものであった。
"Problems to be Solved by the Invention" However, in this prior art, even if the holding member 5 is
, 6 are held in contact with each other, it is not possible to completely avoid the adhesion of dust and the like because they are not non-contact. In some cases, the holding device 1 used for transporting the substrate 7 was incomplete because it sometimes flowed down to the circuit forming surface at the center of the surface of the substrate 7.

又、前記従来技術によれば、前記保持装置1に適用し得
る基板の形状及び大きさが前記保持部材5、Bの保持面
形状と保持面間空隙幅に限定される為に汎用性に乏しく
、当該基板の形状と寸法に基I   づいてその都度設
計の必要があった。
Further, according to the prior art, the shape and size of the substrate that can be applied to the holding device 1 is limited to the shape of the holding surface of the holding member 5, B and the gap width between the holding surfaces, resulting in poor versatility. However, it was necessary to design each case based on the shape and dimensions of the board.

本発明が解決しようとする技術的課題は半導体製造用基
板その他の平滑な表面を有する平板部材を非接触の状態
で所定位置に保持し得る保持装置を提供することを目的
とする。
The technical problem to be solved by the present invention is to provide a holding device that can hold a semiconductor manufacturing substrate or other flat plate member having a smooth surface in a predetermined position in a non-contact manner.

「問題点を解決しようとする手段」 本発明はかかる技術的課題を達成する為に、被保持部材
表面に一定の隙間をもたせて近接可能な吸着面と、該吸
着面より被保持部材表面に向け気流を噴射させ、該吸着
面と被保持部材間に高速流体膜を介して吸引力を生じせ
しめ、該被保持部材を吸着面に吸引保持させる保持手段
と、前記吸着面側に形成され、被保持部材の滑落を防止
し得る位置規制手段からなる技術手段を提案する。
"Means for Solving Problems" In order to achieve the above technical problem, the present invention provides a suction surface that can be approached with a certain gap on the surface of the held member, and a suction surface that can be approached from the suction surface to the surface of the held member. a holding means for ejecting a directed airflow to generate a suction force between the suction surface and the held member via a high-speed fluid film, and suction-holding the held member on the suction surface; formed on the suction surface side; We propose a technical means consisting of a position regulating means that can prevent a held member from sliding down.

ここで前記規制手段は機械的作用(後記第一実施例参照
)、又は流体的作用(後記第二実施例参照)、更には電
気的作用により位置規制を行ういずれの規制手段を用い
てもよい。
Here, the regulating means may be any regulating means that regulates the position by mechanical action (see first embodiment below), fluid action (see second embodiment below), or even electrical action. .

「作用」 かかる技術手段によれば、吸着面・と被保持部材間に生
じた吸引力により高速流体膜を介して被保持部材が吸着
面上に非接触の状態で保持されると共に、吸着面の水平
位置からの傾動により生ずる滑落を防止する為、吸着面
側に被保持部材の滑落を防止し得る位置規制手段が設け
られ、この結果、前記吸着面を任意の方向に傾動させて
も非保持部材が非接触の状態で確実に所定位置に保持さ
せることが出来る。
"Operation" According to this technical means, the suction force generated between the suction surface and the held member holds the held member on the suction surface in a non-contact state via the high-speed fluid film, and the suction surface In order to prevent the member from sliding down due to tilting from the horizontal position, a position regulating means is provided on the suction surface side to prevent the held member from sliding off.As a result, even if the suction surface is tilted in any direction, it will not occur. The holding member can be reliably held in a predetermined position without contact.

又かかる技術手段によれ吸着面より被保持部材表面に向
け噴射される気流により吸着面と被保持部材間の微小隙
間を流れる高速流体が形成され、該高速流体膜により減
圧効果(吸引効果)を得る構成の為に、吸着面と一定の
隙間をもたせて近接可能な平板状の部材であれば、その
大きさ形状に制約されることなく確実に保持が可能であ
り、汎用性を有する。
Moreover, with this technical means, a high-speed fluid flowing through a minute gap between the suction surface and the held member is formed by the airflow jetted from the suction surface toward the surface of the held member, and the high-speed fluid film produces a decompression effect (suction effect). Because of the structure obtained, a flat member that can be approached with a certain gap from the suction surface can be reliably held without being restricted by its size and shape, and has versatility.

「実施例」 以下、図面を参照して本発明の好適な実施例を例示的に
詳しく説明する。ただしこの実施例に記載されている構
成部品の寸法、材質、形状、その相対配置などは特に特
定的な記載がない限りは、この発明の範囲をそれのみに
限定する趣旨ではなく、単なる説明例に過ぎない。
"Embodiments" Hereinafter, preferred embodiments of the present invention will be described in detail by way of example with reference to the drawings. However, unless otherwise specified, the dimensions, materials, shapes, and relative arrangements of the components described in this example are not intended to limit the scope of this invention, but are merely illustrative examples. It's nothing more than that.

第1A乃至13図は機械的作用により位置規制を行う基
板保持装置を示す。
1A to 13 show a substrate holding device that performs position regulation by mechanical action.

10は方形平板状の吸着板で、下面を平面状に形成し、
基板7を保持する吸着面10aを形成すると共に、その
中央部に上面まで貫通する送気孔11を穿設する。送気
孔11上面側には袋ナツト12を介してエアーホース1
3が取り付けられており、前記吸着面10a側に3〜4
 kg/crn”の圧縮空気が送気されるよう構成する
10 is a rectangular flat suction plate with a flat bottom surface;
A suction surface 10a for holding the substrate 7 is formed, and an air supply hole 11 penetrating to the upper surface is formed in the center thereof. An air hose 1 is connected to the top side of the air supply hole 11 via a cap nut 12.
3 is attached, and 3 to 4 are attached to the suction surface 10a side.
It is configured so that compressed air of 1 kg/crn is supplied.

又前記吸着板lOは、吸着面LOa側角隅部に夫々規制
部材14a・・・を固設し、基板7が前記吸着面と平行
に5滑落するのを防止している。
Further, the suction plate 1O has regulating members 14a fixedly installed at the corners on the suction surface LOa side, respectively, to prevent the substrate 7 from sliding down in parallel with the suction surface LOa.

規制部材14a・・・は鍵形形状をなし、その肉厚が「
基板7肉厚+0.2〜Q、8 a+Jになるよう設定す
る。尚、前記規制部材14a・・・の形状は特に限定さ
れることなく円柱状でも方形状でもいずれでもよいが、
本装置を基板7上に戴置す・る際に規制部材14a・・
・が障害にならない配置間隔でもって取り付けられてい
ればよい、又該規制部材14a・・・の材質はシリコン
その他の硬質樹脂部材で形成するのが好ましい。
The regulating member 14a... has a key-shaped shape, and its wall thickness is "
Set the thickness of the board 7 to be +0.2~Q, 8 a+J. The shape of the regulating member 14a is not particularly limited and may be cylindrical or rectangular, but
When placing this device on the board 7, the regulating member 14a...
It is sufficient that the regulating members 14a are attached at intervals that do not cause an obstruction, and the material of the regulating members 14a is preferably made of silicone or other hard resin material.

次にかかる実施例に基づいて方形の基板7を保持する方
法について説明する。
Next, a method for holding the rectangular substrate 7 will be explained based on this embodiment.

吸着板10の送気孔11よりエアーを送気させたまま、
規制部材14a・・・により囲まれる吸着面下方に基板
7が位置するように、基板7と吸着板10の対角線を4
5°変向させた状態で基板7を戴置しである設置面16
上に吸着板lOを戴置させると、前記吸着面10aが基
板7上に近接してその隙間間隔dが0.2〜0.8 m
mの微小間隔になり、且つ送気孔11より送気されたエ
アーが前記間隔内を相当な高速空気速度でもって外方に
向け排気される為、前記隙間間隔6間に生じる負圧によ
り浮力が生じ、この結果基板7が設置面より浮き上がり
、吸着面10aに前記高速空気流膜を介して非接触の状
態で近接保持されることとなる。
While supplying air from the air supply hole 11 of the suction plate 10,
The diagonal line between the substrate 7 and the suction plate 10 is set at 4 so that the substrate 7 is located below the suction surface surrounded by the regulating members 14a...
Installation surface 16 on which the board 7 is placed with its orientation changed by 5°
When the suction plate 1O is placed on top, the suction surface 10a approaches the substrate 7, and the gap distance d is 0.2 to 0.8 m.
m, and the air fed from the air supply hole 11 is exhausted outward at a considerably high speed within the gap, so the negative pressure generated between the gaps 6 causes buoyancy. As a result, the substrate 7 rises from the installation surface and is held close to the suction surface 10a in a non-contact manner via the high-speed air flow membrane.

一方かかる状態では、基板7が吸着面10aに非i  
 接触の状態で保持されていることとなる為に、吸着板
10の僅かな傾動により基板7が吸着面に沿って平行に
滑落してしまう危険性があるが、本実施例においては前
記滑動の規制を行う規制部材i4a・・・が、基板7を
囲む如く吸着面10a角隅部に取りイ・1けられている
為、基板7が吸着面10aから外れて滑動する事なく確
実な保持が可能となる。
On the other hand, in such a state, the substrate 7 is not attached to the suction surface 10a.
Since the substrate 7 is held in a contact state, there is a risk that a slight tilting of the suction plate 10 may cause the substrate 7 to slide down parallel to the suction surface. Since the regulating member i4a for regulating the substrate 7 is placed at the corner of the suction surface 10a so as to surround the substrate 7, the substrate 7 can be held securely without slipping off the suction surface 10a. It becomes possible.

従ってかかる実施例によれば吸着板10傾動の際に基板
7側縁面が規制部材14a・・・に接触する場合がある
が、基板7上には基板?中心より外方に向け常にエアー
が送気されている為、基板7側縁面に例え洗浄液等が付
着していてもこれを外方に吹き飛ばし、吸着板lOを傾
動しても基板7表面中央部の回路形成面まで垂れてしま
ったりする恐れがない。
Therefore, according to this embodiment, when the suction plate 10 is tilted, the side edge surface of the substrate 7 may come into contact with the regulating member 14a. Since air is always sent outward from the center, even if there is cleaning liquid, etc. attached to the side edge surface of the substrate 7, it will be blown outward, and even if the suction plate 10 is tilted, the center of the surface of the substrate 7 will be removed. There is no risk of it dripping down to the circuit forming surface of the part.

第2A、2B図は流体的作用により位置規制を行い、前
記基板が完全に非接触状態を維持し得る他の実施例を示
す。
Figures 2A and 2B show another embodiment in which the position is controlled by fluid action and the substrate can maintain a completely non-contact state.

本実施例の構成を空気の流れ順に従って説明す−に、2
0は、成る種の搬送装置に取り付は可能に    1上
端に螺子部21を螺刻した本体で、その上側中腹部に中
心部材30の軸線上に穿設した主孔31まで達する圧縮
空気導入口22を形成する。
The configuration of this embodiment will be explained in accordance with the order of air flow.
0 can be attached to various types of conveying devices. 1 A main body with a threaded part 21 threaded on the upper end, and a compressed air inlet that reaches a main hole 31 bored on the axis of the central member 30 in the upper midsection of the main body. A mouth 22 is formed.

中心部材30は、前記主孔31の下流側円周部位に開口
部31aを穿設すると共に、該開口部31aを囲設する
如く環状オリフィス32を固設する。
The central member 30 has an opening 31a formed in a downstream circumferential region of the main hole 31, and has an annular orifice 32 fixed therein so as to surround the opening 31a.

環状オリフィス32は中心部材30外周との間で形成さ
れる縮径されたリング状オリフィス溝32aを有し、そ
の出口側を本体20内周と中心部材30外周間により形
成されるリング状スリット溝23に連通させる。即ちオ
リフィス溝32aとスリット溝23は、いわゆる流体増
幅部を形成している。従ってオリフィス溝32a開口面
積はスリット溝23開口面積より大幅に小に設定しであ
る。
The annular orifice 32 has a reduced diameter ring-shaped orifice groove 32a formed between the outer periphery of the center member 30 and a ring-shaped slit groove formed between the inner periphery of the main body 20 and the outer periphery of the center member 30 on the exit side. Connect to 23. That is, the orifice groove 32a and the slit groove 23 form a so-called fluid amplification section. Therefore, the opening area of the orifice groove 32a is set to be much smaller than the opening area of the slit groove 23.

リング状スリット溝23はその上流側を、本体20中腹
部より穿設されフィルタ24を介して外気と連通ずる副
孔25と連通させ、一方下流側は略放射線状に形成した
中心部材30外周に沿って底面に開口23aさせている
The upstream side of the ring-shaped slit groove 23 communicates with an auxiliary hole 25 that is bored from the midsection of the main body 20 and communicates with the outside air via the filter 24, while the downstream side communicates with the outer periphery of the central member 30 formed in a substantially radial shape. An opening 23a is formed along the bottom surface.

尚開口23aにより空気流の噴射角度は本体側底面27
に対し、僅かな傾斜角度、具体的には5度以下になるよ
う設定している。このように形成することにより、高速
流体が本体側底面27に沿って略水平方向に噴射される
こととなり、基板7表面への近接が容易になると共に1
本体側底面27と基板7表面間の減圧(吸引)効果も好
ましいものになる。
Note that the injection angle of the airflow is adjusted to the bottom surface 27 of the main body side due to the opening 23a.
However, the angle of inclination is set to be small, specifically 5 degrees or less. By forming in this way, the high-speed fluid is injected in a substantially horizontal direction along the bottom surface 27 of the main body side, making it easier to approach the surface of the substrate 7 and
The reduced pressure (suction) effect between the main body side bottom surface 27 and the surface of the substrate 7 is also favorable.

底面は本体側底面27と中心部材側底面37がほぼ面−
又は中心部材側底面37が僅かに凹になるよう形成し、
スリット溝23より送気されたエアーの流れる方向の底
面、即ち本体側底面27を基板7と対応させて平面状に
形成し、基板吸着面となす。
As for the bottom surface, the bottom surface 27 on the main body side and the bottom surface 37 on the center member side are almost flat.
Or the center member side bottom surface 37 is formed to be slightly concave,
The bottom surface in the direction in which the air blown from the slit groove 23 flows, that is, the bottom surface 27 on the main body side, is formed into a flat shape corresponding to the substrate 7, and serves as a substrate suction surface.

一方、中心部材側底面37軸線上には吸引孔33が穿設
され、該吸引孔33はその上端において矩形状に拡径さ
れた拡径部33aを有し、小孔34を介して拡径部33
aとリング状スリット溝23の流路中に連通させる。そ
して中心部材側底面37の吸引孔33周囲にはドーナツ
状凹所35を形成し、基板7の位置規制部となす。
On the other hand, a suction hole 33 is bored on the axis of the bottom surface 37 on the side of the center member, and the suction hole 33 has an enlarged diameter part 33a in a rectangular shape at its upper end, and the diameter is enlarged through a small hole 34. Part 33
a and the flow path of the ring-shaped slit groove 23. A donut-shaped recess 35 is formed around the suction hole 33 on the bottom surface 37 on the side of the central member, and serves as a position regulating portion for the substrate 7.

即ち小孔34とスリット溝23は、いわゆる流体吸引部
を形成している。
That is, the small hole 34 and the slit groove 23 form a so-called fluid suction section.

次にかかる実施例の作用を説明する。Next, the operation of this embodiment will be explained.

先ず圧縮空気導入口22より3〜4 kz/cm”の圧
縮空気を送気させると、主孔31を通ってその下流側の
開口部31aより環状オリフィス32内に入り込み、そ
して縮径されたオリフィス溝32aよりリング状スリッ
ト溝23内に噴射される。
First, when compressed air of 3 to 4 kHz/cm" is supplied from the compressed air inlet 22, it passes through the main hole 31 and enters the annular orifice 32 from the opening 31a on the downstream side, and then enters the reduced diameter orifice. It is injected into the ring-shaped slit groove 23 from the groove 32a.

リング状スリット溝23では圧縮空気の流速により、そ
の上流側に連通ずる副孔25よりフィルタ24を介して
清浄な外気を吸引し、流量を増した送気流が下流側に流
れ、中心部材30外周に沿って出口側開口部23aより
本体側底面27側外方に送気される。
In the ring-shaped slit groove 23, due to the flow rate of the compressed air, clean outside air is sucked through the filter 24 from the sub-hole 25 communicating with the upstream side, and the air flow with increased flow rate flows downstream, and the outer periphery of the central member 30 is Air is sent outward from the outlet side opening 23a along the main body side bottom surface 27 side.

一方、リング状スリット溝23の流路途中では、小孔3
4を介して吸引孔33の拡径部33aと連通している為
に、該吸引孔33より中心部材側底面37側の外気をも
吸い込みながら本体側底面27に送気させている。
On the other hand, in the middle of the flow path of the ring-shaped slit groove 23, the small hole 3
4 and communicates with the enlarged diameter portion 33a of the suction hole 33, the outside air on the side of the bottom surface 37 on the center member side is also sucked in from the suction hole 33, and the air is supplied to the bottom surface 27 on the main body side.

かかる状態÷、基板7表面と本体底面27との平!  
  行状態を維持したまま、該装置を基板7表面に近接
させ、その隙間間隔dが略0.2〜0.8Hの間に達す
ると、リング状スリット溝23より本体側底面27に送
気されたエアーが前記間隔d内を相当な高速空気速度で
もって外方に向け排出される為、前記実施例と同様に隙
間間隔6間に生じる負圧により基板7に浮力が生じ、こ
の結果基板7が浮き上がり、本体側底面27に前記高速
空気流膜を介して非接触の状態で近接保持されることと
なる。
This condition ÷ the flatness of the surface of the board 7 and the bottom surface 27 of the main body!
While maintaining the row state, the device is brought close to the surface of the substrate 7, and when the gap distance d reaches approximately 0.2 to 0.8H, air is blown from the ring-shaped slit groove 23 to the bottom surface 27 of the main body side. Since the air inside the gap d is discharged outward at a considerably high air velocity, buoyancy is generated on the substrate 7 due to the negative pressure generated between the gap 6, as in the previous embodiment, and as a result, the substrate 7 floats up and is held close to the main body side bottom surface 27 through the high-speed air flow membrane in a non-contact state.

−男中心部材側底面37側においては吸引孔33より中
心部材側底面37偶の外気を吸引している為に、該吸引
孔33及びその周囲に配したドーナツ状凹所35の空気
が減圧され、はぼ真空状態になる為に、基板7が位置規
制され、滑動する事なく確実な保持が可能となる。
- On the male central member side bottom surface 37 side, since the outside air from the central member side bottom surface 37 is sucked through the suction hole 33, the air in the suction hole 33 and the donut-shaped recess 35 arranged around it is depressurized. Since the substrate 7 is almost in a vacuum state, the position of the substrate 7 is regulated and it is possible to securely hold the substrate 7 without slipping.

かかる実施例によれば流体的作用により基板7を位置規
制する為に、完全に非接触の状態で保持が可能となり、
極めて好ましい保持装置の提供が可能となる。
According to this embodiment, since the position of the substrate 7 is controlled by fluid action, it is possible to hold the substrate 7 in a completely non-contact state.
This makes it possible to provide a very favorable holding device.

「発明の効果」 以上記載した如く本発明によれば、高速流体に  ゛よ
って非保持部材と吸着面間に生じる負圧の為に、基板そ
の他の平板状被保持部材を浮力により非接触の状態で保
持されると共に、吸着部材を傾動させても非保持部材が
滑落することなく、被保持部材が非接触の状態で確実に
所定位置に保持させることが出来る。
"Effects of the Invention" As described above, according to the present invention, due to the negative pressure generated between the non-holding member and the suction surface due to the high-speed fluid, the substrate or other flat member to be held is brought into a non-contact state due to buoyancy. At the same time, even when the suction member is tilted, the non-retained member does not slide down, and the member to be held can be reliably held in a predetermined position without contact.

又本発明によれば高速流体の負圧による吸引力により非
保持部材を保持する構成の為に、被保持部材の大きさ形
状に制約されることなく確実に保持が可能であり、汎用
性を有する他、その保持動作も単に本装置を被保持部材
に近接させるのみであるから精密な制御が必要なく、搬
送装置の構成の簡単化を図ることが出来る、等の種々の
著効を有す。
Furthermore, according to the present invention, since the non-retained member is held by the suction force generated by the negative pressure of the high-speed fluid, it is possible to reliably hold the member without being restricted by the size and shape of the member to be held, thereby increasing versatility. In addition, since the holding operation is simply by bringing the device close to the member to be held, precise control is not required, and the structure of the conveying device can be simplified. .

【図面の簡単な説明】[Brief explanation of drawings]

第1A乃至13図は本発明の一実施例に係り、第1A図
は斜視図、第1B図は正面断面図である。第2A乃至2
B図は本発明の他の実施例に係り、第2A図は正面断面
図、第2B図は底面図である。 第3A乃至3B図は従来技術を示し、第3A図は正面図
、第3B図は第3A図のA−A’線断面図である。
1A to 13 relate to one embodiment of the present invention, with FIG. 1A being a perspective view and FIG. 1B being a front sectional view. 2nd A to 2nd
FIG. B relates to another embodiment of the present invention, FIG. 2A is a front sectional view, and FIG. 2B is a bottom view. 3A and 3B show the prior art, in which FIG. 3A is a front view and FIG. 3B is a sectional view taken along the line AA' in FIG. 3A.

Claims (1)

【特許請求の範囲】 1)平板状の被保持部材表面に一定の隙間をもたせて近
接可能な吸着面と、該吸着面より被保持部材表面に向け
気流を噴射させ、高速流体の負圧により生じる吸引力に
よって被保持部材に浮力を生じせしめ、前記吸着面と被
保持部材間を高速流体膜を介して互いに吸引保持させる
保持手段と、前記吸着面側に形成され、被保持部材の滑
落を防止し得る位置規制手段とからなることを特徴とす
る平板状部材の保持装置 2)吸着面側に機械的作用による位置規制手段を設けた
ことを特徴とする実用新案登録請求の範囲第1項記載の
保持装置 3)吸着面側に流体的作用による位置規制手段を設けた
ことを特徴とする実用新案登録請求の範囲第1項記載の
保持装置
[Claims] 1) A suction surface that can be approached with a certain gap to the surface of a flat plate-shaped member to be held, and an airflow jetted from the suction surface toward the surface of the member to be held, and a negative pressure of high-speed fluid a holding means that generates buoyancy on the held member by the generated suction force and holds the held member by suction between the suction surface and the held member via a high-speed fluid film; and a holding means formed on the suction surface side to prevent the held member from sliding off 2) A holding device for a flat plate-shaped member characterized by comprising a position regulating means capable of preventing the problem.2) Utility model registration claim 1, characterized in that a position regulating means by mechanical action is provided on the suction surface side. Holding device 3) Holding device according to claim 1 of the utility model registration claim, characterized in that a position regulating means by fluid action is provided on the suction surface side.
JP22895584A 1984-11-01 1984-11-01 Holding device for flat laminar member Granted JPS61111251A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22895584A JPS61111251A (en) 1984-11-01 1984-11-01 Holding device for flat laminar member

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22895584A JPS61111251A (en) 1984-11-01 1984-11-01 Holding device for flat laminar member

Publications (2)

Publication Number Publication Date
JPS61111251A true JPS61111251A (en) 1986-05-29
JPH0215461B2 JPH0215461B2 (en) 1990-04-12

Family

ID=16884476

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22895584A Granted JPS61111251A (en) 1984-11-01 1984-11-01 Holding device for flat laminar member

Country Status (1)

Country Link
JP (1) JPS61111251A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS631647A (en) * 1986-06-23 1988-01-06 Taiyo Tekko Kk Noncontact adsorbing device
WO2011027546A1 (en) * 2009-09-07 2011-03-10 村田機械株式会社 Substrate transfer apparatus and substrate transfer method
JP2012253310A (en) * 2010-09-27 2012-12-20 Toray Eng Co Ltd Substrate transporting device
CN111348412A (en) * 2020-04-27 2020-06-30 聊城市博源节能科技有限公司 A component reclaiming device
CN114104658A (en) * 2021-12-14 2022-03-01 常州先进制造技术研究所 An adaptive control method for sheet feeding

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5140343A (en) * 1974-09-25 1976-04-05 Ota Toshuki Aruminiumuno hyomenshoriho
JPS5338291U (en) * 1976-09-08 1978-04-04
JPS58143989A (en) * 1982-02-15 1983-08-26 株式会社日立製作所 Conveyance device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5140343A (en) * 1974-09-25 1976-04-05 Ota Toshuki Aruminiumuno hyomenshoriho
JPS5338291U (en) * 1976-09-08 1978-04-04
JPS58143989A (en) * 1982-02-15 1983-08-26 株式会社日立製作所 Conveyance device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS631647A (en) * 1986-06-23 1988-01-06 Taiyo Tekko Kk Noncontact adsorbing device
JPH0343175B2 (en) * 1986-06-23 1991-07-01 Taiyo Tekko Kk
WO2011027546A1 (en) * 2009-09-07 2011-03-10 村田機械株式会社 Substrate transfer apparatus and substrate transfer method
JP2011057314A (en) * 2009-09-07 2011-03-24 Murata Machinery Ltd Device and method for transferring substrate
TWI490155B (en) * 2009-09-07 2015-07-01 Murata Machinery Ltd A substrate transfer device, and a substrate transfer method
JP2012253310A (en) * 2010-09-27 2012-12-20 Toray Eng Co Ltd Substrate transporting device
CN111348412A (en) * 2020-04-27 2020-06-30 聊城市博源节能科技有限公司 A component reclaiming device
CN114104658A (en) * 2021-12-14 2022-03-01 常州先进制造技术研究所 An adaptive control method for sheet feeding

Also Published As

Publication number Publication date
JPH0215461B2 (en) 1990-04-12

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