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JPS60956U - printed circuit board equipment - Google Patents

printed circuit board equipment

Info

Publication number
JPS60956U
JPS60956U JP1983088277U JP8827783U JPS60956U JP S60956 U JPS60956 U JP S60956U JP 1983088277 U JP1983088277 U JP 1983088277U JP 8827783 U JP8827783 U JP 8827783U JP S60956 U JPS60956 U JP S60956U
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
engaged
flexible printed
boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983088277U
Other languages
Japanese (ja)
Inventor
広川 雅巳
Original Assignee
ソニー株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ソニー株式会社 filed Critical ソニー株式会社
Priority to JP1983088277U priority Critical patent/JPS60956U/en
Priority to KR2019840004887U priority patent/KR890000597Y1/en
Publication of JPS60956U publication Critical patent/JPS60956U/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

図面は本考案を適用したプリント基板装置の実施例を示
したものであって、第1図は第1実施例を示した全体の
分解斜視図、第2図は同上の半田付は作業状態を示した
斜視図、第3図は第2図の要部の拡大平面図、第4図は
第3図IV−IV線での拡大断面図、第5図は第2実施
例を示した要部の分解斜視図、第6図は同上の半田付は
作業状態を示した斜視図、第7図は第3実施例を示した
要部の分解斜視図、第8図は同上の半田付は作業状態を
示した斜視図である。また図面に用いられた符号におい
て、1・・・・・・プリント基板、2・・・・・・配線
パターン面、3・・・・・・配線パターン、3b・・・
・・・配線パターンの接続端子、7・・・・・・電子回
路部品、7a・・・・・・リード、10・・・・・・フ
レキシブルプリント基板、11・・・・・・配線パター
ン、11b・・・・・・配線パターン   −の接続端
子、15・・・・・・係合部、17・・・・・・被係合
部、18・・・・・・リード挿通孔、20・・・・・・
半田付け、である。
The drawings show an embodiment of a printed circuit board device to which the present invention is applied. Fig. 1 is an exploded perspective view of the entire first embodiment, and Fig. 2 shows the same soldering operation state. 3 is an enlarged plan view of the main part of Fig. 2, Fig. 4 is an enlarged sectional view taken along line IV-IV of Fig. 3, and Fig. 5 is a main part showing the second embodiment. Figure 6 is an exploded perspective view of the same soldering process, Figure 7 is an exploded perspective view of the main parts showing the third embodiment, and Figure 8 is a perspective view of the same soldering process. It is a perspective view showing a state. In addition, in the symbols used in the drawings, 1...Printed board, 2...Wiring pattern surface, 3...Wiring pattern, 3b...
...Wiring pattern connection terminal, 7...Electronic circuit component, 7a...Lead, 10...Flexible printed circuit board, 11...Wiring pattern, 11b... Connection terminal for wiring pattern -, 15... Engaging portion, 17... Engaged portion, 18... Lead insertion hole, 20...・・・・・・
It's soldering.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント基板にフレキシブルプリント基板の少なくとも
一部を重ね、これら両基板に形成されている配線パター
ンの接続端子どうしを半田付けして成るプリント基板装
置において、上記プリント基板に保合部を設けると共に
その係合部に係合される被係合部を上記フレキシブルプ
リント基板に設け、これら両プリント基板の上記両接続
端子を上記係合部と被係合部とに夫々引出し、上記フレ
キシブルプリント基板をその被係合部によって上記係合
部に係合させた状態でこのフレキシブルプリント基板の
少なくとも一部を上記プリント基板に重ね、かつその両
プリント基板の係合によりこれら両プリント基板の上記
両接続端子を互いに近接させて位置決めさせ、この状態
でこれら両接続端子どうしを半田付けして成るプリント
基板装置。
In a printed circuit board device in which at least a part of a flexible printed circuit board is overlapped with a printed circuit board and connection terminals of wiring patterns formed on both boards are soldered to each other, a retaining portion is provided on the printed circuit board and the engagement portion is provided. An engaged portion to be engaged with the mating portion is provided on the flexible printed circuit board, and the connecting terminals of both printed circuit boards are drawn out to the engaging portion and the engaged portion, respectively, and the flexible printed circuit board is connected to the flexible printed circuit board. At least a portion of the flexible printed circuit board is overlapped with the printed circuit board while being engaged with the engaging portion by the engaging portion, and the connecting terminals of the two printed circuit boards are connected to each other by the engagement of both printed circuit boards. A printed circuit board device in which these connection terminals are positioned close to each other and soldered to each other in this state.
JP1983088277U 1983-06-09 1983-06-09 printed circuit board equipment Pending JPS60956U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1983088277U JPS60956U (en) 1983-06-09 1983-06-09 printed circuit board equipment
KR2019840004887U KR890000597Y1 (en) 1983-06-09 1984-05-25 Printed Board Device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983088277U JPS60956U (en) 1983-06-09 1983-06-09 printed circuit board equipment

Publications (1)

Publication Number Publication Date
JPS60956U true JPS60956U (en) 1985-01-07

Family

ID=30218190

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983088277U Pending JPS60956U (en) 1983-06-09 1983-06-09 printed circuit board equipment

Country Status (2)

Country Link
JP (1) JPS60956U (en)
KR (1) KR890000597Y1 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56107591A (en) * 1980-01-30 1981-08-26 Matsushita Electric Ind Co Ltd Device for connecting printed circuit board

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56107591A (en) * 1980-01-30 1981-08-26 Matsushita Electric Ind Co Ltd Device for connecting printed circuit board

Also Published As

Publication number Publication date
KR890000597Y1 (en) 1989-03-11

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