JPS60956U - printed circuit board equipment - Google Patents
printed circuit board equipmentInfo
- Publication number
- JPS60956U JPS60956U JP1983088277U JP8827783U JPS60956U JP S60956 U JPS60956 U JP S60956U JP 1983088277 U JP1983088277 U JP 1983088277U JP 8827783 U JP8827783 U JP 8827783U JP S60956 U JPS60956 U JP S60956U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- engaged
- flexible printed
- boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
図面は本考案を適用したプリント基板装置の実施例を示
したものであって、第1図は第1実施例を示した全体の
分解斜視図、第2図は同上の半田付は作業状態を示した
斜視図、第3図は第2図の要部の拡大平面図、第4図は
第3図IV−IV線での拡大断面図、第5図は第2実施
例を示した要部の分解斜視図、第6図は同上の半田付は
作業状態を示した斜視図、第7図は第3実施例を示した
要部の分解斜視図、第8図は同上の半田付は作業状態を
示した斜視図である。また図面に用いられた符号におい
て、1・・・・・・プリント基板、2・・・・・・配線
パターン面、3・・・・・・配線パターン、3b・・・
・・・配線パターンの接続端子、7・・・・・・電子回
路部品、7a・・・・・・リード、10・・・・・・フ
レキシブルプリント基板、11・・・・・・配線パター
ン、11b・・・・・・配線パターン −の接続端
子、15・・・・・・係合部、17・・・・・・被係合
部、18・・・・・・リード挿通孔、20・・・・・・
半田付け、である。The drawings show an embodiment of a printed circuit board device to which the present invention is applied. Fig. 1 is an exploded perspective view of the entire first embodiment, and Fig. 2 shows the same soldering operation state. 3 is an enlarged plan view of the main part of Fig. 2, Fig. 4 is an enlarged sectional view taken along line IV-IV of Fig. 3, and Fig. 5 is a main part showing the second embodiment. Figure 6 is an exploded perspective view of the same soldering process, Figure 7 is an exploded perspective view of the main parts showing the third embodiment, and Figure 8 is a perspective view of the same soldering process. It is a perspective view showing a state. In addition, in the symbols used in the drawings, 1...Printed board, 2...Wiring pattern surface, 3...Wiring pattern, 3b...
...Wiring pattern connection terminal, 7...Electronic circuit component, 7a...Lead, 10...Flexible printed circuit board, 11...Wiring pattern, 11b... Connection terminal for wiring pattern -, 15... Engaging portion, 17... Engaged portion, 18... Lead insertion hole, 20...・・・・・・
It's soldering.
Claims (1)
一部を重ね、これら両基板に形成されている配線パター
ンの接続端子どうしを半田付けして成るプリント基板装
置において、上記プリント基板に保合部を設けると共に
その係合部に係合される被係合部を上記フレキシブルプ
リント基板に設け、これら両プリント基板の上記両接続
端子を上記係合部と被係合部とに夫々引出し、上記フレ
キシブルプリント基板をその被係合部によって上記係合
部に係合させた状態でこのフレキシブルプリント基板の
少なくとも一部を上記プリント基板に重ね、かつその両
プリント基板の係合によりこれら両プリント基板の上記
両接続端子を互いに近接させて位置決めさせ、この状態
でこれら両接続端子どうしを半田付けして成るプリント
基板装置。In a printed circuit board device in which at least a part of a flexible printed circuit board is overlapped with a printed circuit board and connection terminals of wiring patterns formed on both boards are soldered to each other, a retaining portion is provided on the printed circuit board and the engagement portion is provided. An engaged portion to be engaged with the mating portion is provided on the flexible printed circuit board, and the connecting terminals of both printed circuit boards are drawn out to the engaging portion and the engaged portion, respectively, and the flexible printed circuit board is connected to the flexible printed circuit board. At least a portion of the flexible printed circuit board is overlapped with the printed circuit board while being engaged with the engaging portion by the engaging portion, and the connecting terminals of the two printed circuit boards are connected to each other by the engagement of both printed circuit boards. A printed circuit board device in which these connection terminals are positioned close to each other and soldered to each other in this state.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983088277U JPS60956U (en) | 1983-06-09 | 1983-06-09 | printed circuit board equipment |
KR2019840004887U KR890000597Y1 (en) | 1983-06-09 | 1984-05-25 | Printed Board Device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983088277U JPS60956U (en) | 1983-06-09 | 1983-06-09 | printed circuit board equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60956U true JPS60956U (en) | 1985-01-07 |
Family
ID=30218190
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1983088277U Pending JPS60956U (en) | 1983-06-09 | 1983-06-09 | printed circuit board equipment |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPS60956U (en) |
KR (1) | KR890000597Y1 (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56107591A (en) * | 1980-01-30 | 1981-08-26 | Matsushita Electric Ind Co Ltd | Device for connecting printed circuit board |
-
1983
- 1983-06-09 JP JP1983088277U patent/JPS60956U/en active Pending
-
1984
- 1984-05-25 KR KR2019840004887U patent/KR890000597Y1/en not_active IP Right Cessation
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56107591A (en) * | 1980-01-30 | 1981-08-26 | Matsushita Electric Ind Co Ltd | Device for connecting printed circuit board |
Also Published As
Publication number | Publication date |
---|---|
KR890000597Y1 (en) | 1989-03-11 |
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