JPS6088717U

JPS6088717U - Resin mold equipment

Info

Publication number: JPS6088717U
Application number: JP18239883U
Authority: JP
Inventors: 寛之山口
Original assignee: 関西日本電気株式会社
Priority date: 1983-11-26
Filing date: 1983-11-26
Publication date: 1985-06-18

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of the drawing]

第１図は樹脂モールド型電子部品の一例を示す平面図、
第２図は第１図Ａ−Ａ線の断面図、第３図は従来のアッ
パープランジャ型樹脂モールド装置の金型の一部省略平
面図、第４図は第３図Ｂ　−Ｂ線の拡大断面図、第５図
は第４図一部の樹脂モールド成形動作時の拡大断面図、
第６図はアッパープランジャ型樹脂モールド装置のポッ
ト内に投入された樹脂タブレットの概略側断面図、第７
図はマルチプランジャ型樹脂モールド装置の金型の一部
省略平面図、第８図は樹脂モールド装置のポット内で溶
融軟化した樹脂タブレットの概略側断面図、第９図は本
考案に係る樹脂モールド装置の一実施例の要部概略側面
図で、第１０図はそのプランジャ部の概略側面図で、第
１１図はそのプランジャの平断面図である。１６・・・下金型、１７・・・ポット、１８・・・プラ
ンジャ、２０・・・サーモパイプ。第５図Ｉλ 第６図とｔ＋FIG. 1 is a plan view showing an example of a resin molded electronic component;
Figure 2 is a sectional view taken along line A-A in Figure 1, Figure 3 is a partially omitted plan view of the mold of a conventional upper plunger type resin molding device, and Figure 4 is an enlarged view taken along line B-B in Figure 3. A sectional view, FIG. 5 is an enlarged sectional view of a part of FIG. 4 during resin molding operation,
Figure 6 is a schematic side sectional view of the resin tablet placed in the pot of the upper plunger type resin molding device;
The figure is a partially omitted plan view of a mold of a multi-plunger type resin molding device, FIG. 8 is a schematic side sectional view of a resin tablet melted and softened in a pot of a resin molding device, and FIG. 9 is a resin mold according to the present invention. 10 is a schematic side view of the plunger portion of the device, and FIG. 11 is a cross-sectional plan view of the plunger. 16... Lower mold, 17... Pot, 18... Plunger, 20... Thermopipe. Figure 5 Iλ Figure 6 and t+

Claims

[Scope of utility model registration request]

A pot is formed through the lower mold to supply the resin tablet, and a cavity communicating with the pot is formed on the abutting surface of the upper and lower molds, and the resin supplied into the pot is heated by a plunger. In a device in which fluidized resin is forced into a cavity and resin molded, a thermopipe is arranged along the axis of the plunger, one end of which is connected to the plunger and the other end of which is cooled. Characteristic resin molding equipment.