JPS608446Y2 - Insulation device using flexible substrate - Google Patents

Description

[Detailed description of the invention] This invention is an insulating device using a flexible board, which insulates electrical components mounted on a printed circuit board between its main body or other parts such as lead wires and a chassis. Regarding.

If an electrical component is mounted on a printed circuit board and the printed wiring pattern surface of this printed circuit board is close to the chassis or other components, there may be electrical contact between the electrical component lead wires or the electrical component body and this other component. There is a risk of short circuit.

For this reason, it is necessary to electrically insulate between the electrical component body or lead wire and other members.

Conventionally, such an insulator (with double-sided adhesive tape) has been pasted, but in addition to being expensive, this insulator is subject to restrictions on the positioning of pasting.

Furthermore, there is a risk of peeling off due to aging.

This idea was made in order to eliminate the above-mentioned drawbacks of the conventional methods, and by interposing a flexible board between the main body of the electrical component or its lead wire and other members such as the chassis, the insulation between the two can be maintained for a long period of time. In addition to being able to maintain the
An object of the present invention is to provide an insulating device using a flexible substrate that is not subject to positioning restrictions.

Hereinafter, embodiments of an insulating device using the flexible substrate of this invention will be described based on the drawings.

FIG. 1 is a perspective view showing one embodiment. 1 in FIG. 1 is a printed circuit board.

A flexible substrate 2 is bonded to the back side of the printed circuit board 1.

The flexible board 2 has approximately the same width as the printed board 1, but is longer than the printed board 1.

A predetermined printed wiring pattern is provided on the back side of the printed circuit board 1, the back side of the flexible board 2, or both the printed circuit board and the flexible board.

In the following description, it is assumed that a printed wiring pattern is applied to the flexible substrate 2 at a portion facing the printed circuit board 1.

That is, no printed wiring pattern is formed on the flexible substrate that protrudes from the outer shape of the printed circuit board.

Corresponding to this printed wiring pattern, electrical components 3 such as resistors, capacitors, and semiconductor devices are arranged on the top surface of the printed circuit board 1, and the lead wires 3 of these electrical components 3
a penetrates through the printed circuit board 1 and the flexible circuit board 2, and is soldered to the printed wiring pattern on the back side of the flexible circuit board 2.

In this way, the printed circuit board 1 with the electrical components 3 mounted thereon
To attach the flexible board 2 to the chassis 4, bend the flexible board 2 to the bottom side of the printed circuit board 1 so that it is parallel to the printed board 1, use this bent part as the insulating part 2a, and attach the insulating part 2a to the chassis 4. Fix it on top.

As a result, the electrical components 3 mounted on the printed circuit board 1
Even if the lead wire 3a passes through the printed circuit board 1 and the flexible circuit board 2, the lead wire 3a is completely insulated from the chassis 4 by the insulating portion 2a of the flexible circuit board 2.

FIG. 2 is a perspective view showing a second embodiment of this invention.

In the case of this figure 2, the chassis 4 is shaped like a
The horizontal portion 4a of the flexible substrate 2 and the electrical component 3 are insulated by the insulating portion 2a of the flexible substrate 2.

That is, the electrical components 3 are mounted on the printed circuit board 1 and the lead wires 3a are soldered to the printed wiring pattern of the flexible circuit board 2 in the same way as in the case of FIG. 1, but in the embodiment of FIG. , bend the insulating part 2a of the flexible board 2 from the right side of FIG. This is what I did.

By doing so, it is possible to insulate the head of the electrical component 3 or the side of the electrical component 3, that is, between the main body of the electrical component 3 and the horizontal portion 4a of the chassis 4 by the insulating portion 2a. .

In the first and second embodiments above, a flexible board with a printed wiring pattern formed on the part facing the printed circuit board was used, but a flexible board with a printed wiring pattern formed on the entire surface of the flexible board was used. It's okay.

Furthermore, FIG. 3 shows a third embodiment of this invention.

FIG. 3 shows an example in which a flexible substrate 4 is used instead of the insulating paper.

That is, in FIG. 3, a 'T-shaped locking tongue piece 4 is provided at a predetermined location on the chassis 4, for example, as shown in the figure.
b is formed integrally with the chassis 4, and a locking hole 2b is formed at a predetermined location of the flexible substrate 2 in correspondence with the locking tongue piece 4b.

This locking hole 2b is locked to the locking tongue 4b of the chassis 4, and then the printed circuit board 1 (not shown in FIG. 3) is mounted on the flexible board 2.

After attaching the printed circuit board and mounting the electrical components 3, the flexible circuit board 2 is bent toward the upper surface of the printed circuit board 1, as in the case of FIG.

As described above, according to the insulating device using the flexible circuit board of this invention, a flexible circuit board with a longer dimension is attached to the printed circuit board on which electrical components are mounted, and the flexible circuit board is placed on the lower or upper surface of the printed circuit board. Since the flexible board is bent between the electrical component body or the lead wire and other members such as the chassis, complete insulation is achieved between the electrical component body or the lead wire and other members.

In addition, flexible circuit boards have excellent durability, so
Unlike conventional insulators with double-sided tape, there is no deterioration due to aging or restrictions on positioning.Furthermore, it can be manufactured at low cost by using a flexible circuit board with no printed wiring pattern, and it can be easily manufactured between printed circuit boards, etc. By using a flexible substrate on which a printed wiring pattern is formed for electrical connection, there is no need for special insulating materials, which results in excellent effects such as low cost and low manufacturing cost. .

[Brief explanation of drawings]

Fig. 1 is a perspective view showing one embodiment of the insulating device using the flexible substrate of this invention, Fig. 2 is a perspective view showing another embodiment of the insulating device using the flexible substrate of this invention, and Fig. 3 FIG. 2 is a perspective view showing the chassis and flexible substrate portions in still another embodiment of the insulating device using the flexible substrate of this invention. 1... Printed circuit board, 2... Flexible board, 2a... Insulating section, 2b...
Locking hole, 3...Electrical component, 3a...Lead wire, 4...Chassis, a...Horizontal part, 4b... Locking tongue.

Claims (2)

[Scope of utility model registration request] (1) A printed circuit board on which electrical components are mounted, a flexible circuit board that is longer than the outer dimensions of the printed circuit board, and a portion of which is connected to the printed circuit board, and there is a risk of electrical short-circuiting when the circuit board is close to the printed circuit board. and a member, and the flexible board is interposed between the printed circuit board and the member to insulate the electrical component main body or the lead wire of the electrical component from the member. insulation device. (2) The insulating device using a flexible substrate according to claim 1, wherein the flexible substrate has a printed wiring pattern at least in a portion facing the printed circuit board.