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JPS6079749U - Microwave integrated circuit device - Google Patents

Microwave integrated circuit device

Info

Publication number
JPS6079749U
JPS6079749U JP17212983U JP17212983U JPS6079749U JP S6079749 U JPS6079749 U JP S6079749U JP 17212983 U JP17212983 U JP 17212983U JP 17212983 U JP17212983 U JP 17212983U JP S6079749 U JPS6079749 U JP S6079749U
Authority
JP
Japan
Prior art keywords
conductor
integrated circuit
circuit device
microwave integrated
ground
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17212983U
Other languages
Japanese (ja)
Other versions
JPH0249733Y2 (en
Inventor
清裕 柴田
茂 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP17212983U priority Critical patent/JPS6079749U/en
Publication of JPS6079749U publication Critical patent/JPS6079749U/en
Application granted granted Critical
Publication of JPH0249733Y2 publication Critical patent/JPH0249733Y2/ja
Granted legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図、第２図及び第３図はそれぞれ従来のマイクロ波
集積回蕗装置を示す平面図、断面図、及び平面図、第４
図は第゛３図の等価回路を示す図、第５図はこの考案の
一実施例に係るマイクロ波集積回路装置を示す平面図、
第６図は第５図のＢ−Ｂ断面図、第７図はこの考案の他
の実施例を示す平面図である。 ２０−−−ＧａＡｓ基板、２１−・・第１　ノＦＥＴ、
　２２−・・第２のＦＥＴ、　２３．２４・・・接地電
極、２５・・・導体パターン、２６・・・接地導体、２
７・・・接地基体、２８・・・半田、２９・・・パッド
導体、３０・・・切欠部、３１・・・ボンディング線、
３２．３３・・・上部電極、”３４・・・導体パターン
、３５．３６・・・抵抗。1, 2, and 3 are a plan view, a sectional view, and a plan view, respectively, showing a conventional microwave integrated rotary device, and FIG.
The figure shows an equivalent circuit of FIG. 3, and FIG. 5 is a plan view of a microwave integrated circuit device according to an embodiment of the invention.
FIG. 6 is a sectional view taken along line BB in FIG. 5, and FIG. 7 is a plan view showing another embodiment of this invention. 20--GaAs substrate, 21--first FET,
22-... Second FET, 23.24... Ground electrode, 25... Conductor pattern, 26... Ground conductor, 2
7... Grounding base, 28... Solder, 29... Pad conductor, 30... Notch, 31... Bonding wire,
32.33...Top electrode, 34...Conductor pattern, 35.36...Resistance.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 一方の面に複数の能動素子及び回路導体パターンが形成
され、゛他方の面に接地導体が形成された半絶縁性半導
体基板または絶縁体基板の前記接地導体を接地基体に対
し電気的に導通させた状態で固定してなるマイクロ波集
積回路装置において、前記複数個の能動素子の各接地電
極が共通に接続される導体パターンに使用周波数におけ
る線路波長の略１／２００以下の幅のパッド導体を構成
する切欠部を設け、前記パッド導体と前記接地基体とを
使用周波数における空間波長の略１　／２００以下の長
さを有する導体で接続させるように構成したことを特徴
とするマイクロ波集積回路装置。A plurality of active elements and circuit conductor patterns are formed on one surface, and the ground conductor of a semi-insulating semiconductor substrate or insulator substrate with a ground conductor formed on the other surface is electrically connected to the ground base. In the microwave integrated circuit device fixed in a fixed state, a pad conductor having a width of about 1/200 or less of the line wavelength at the operating frequency is provided in the conductor pattern to which the ground electrodes of the plurality of active elements are commonly connected. A microwave integrated circuit device characterized in that the pad conductor and the ground base are connected by a conductor having a length of approximately 1/200 or less of a spatial wavelength at a frequency of use. .
JP17212983U 1983-11-07 1983-11-07 Microwave integrated circuit device Granted JPS6079749U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17212983U JPS6079749U (en) 1983-11-07 1983-11-07 Microwave integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17212983U JPS6079749U (en) 1983-11-07 1983-11-07 Microwave integrated circuit device

Publications (2)

Publication Number Publication Date
JPS6079749U true JPS6079749U (en) 1985-06-03
JPH0249733Y2 JPH0249733Y2 (en) 1990-12-27

Family

ID=30375285

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17212983U Granted JPS6079749U (en) 1983-11-07 1983-11-07 Microwave integrated circuit device

Country Status (1)

Country Link
JP (1) JPS6079749U (en)

Also Published As

Publication number Publication date
JPH0249733Y2 (en) 1990-12-27

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