JPS6076056U - metal core printed wiring board - Google Patents
metal core printed wiring boardInfo
- Publication number
- JPS6076056U JPS6076056U JP16739783U JP16739783U JPS6076056U JP S6076056 U JPS6076056 U JP S6076056U JP 16739783 U JP16739783 U JP 16739783U JP 16739783 U JP16739783 U JP 16739783U JP S6076056 U JPS6076056 U JP S6076056U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- core printed
- metal core
- metal plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
図面は本考案の説明に供するもので、第1図は従来の金
属板の一層タイブの金属コアプリント配線板の断面図、
第2図は従来の金属板の多層タイプの金属コアプリント
配線板の断面図、第3図は本考案の第1の実施例を示す
第1図と同様の図、第4図は本考案の第2の実施例を示
す第1図と同様の図、第5図は本考案の第3の実施例を
示す第2図と同様の図である。
1・・・絶縁層、2・・・金属板、2a・・・露出部、
3・・・導体配線層、4・・・スルーホール、5・・・
接着層、6・・・フィン、7・・・貫通孔。The drawings are for explaining the present invention, and FIG. 1 is a cross-sectional view of a conventional single-layer metal core printed wiring board;
Figure 2 is a cross-sectional view of a conventional multilayer metal core printed wiring board made of metal plates, Figure 3 is a diagram similar to Figure 1 showing the first embodiment of the present invention, and Figure 4 is a diagram of the present invention. FIG. 5 is a diagram similar to FIG. 1 showing a second embodiment, and FIG. 5 is a diagram similar to FIG. 2 showing a third embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Insulating layer, 2... Metal plate, 2a... Exposed part,
3... Conductor wiring layer, 4... Through hole, 5...
Adhesive layer, 6... Fin, 7... Through hole.
Claims (1)
において、上記金属板の表面のうち導体配線層、スルー
ホールなどの形成および部品類の搭載などに必要な部分
を絶縁層により被覆して、該金属板の端部の一部あるい
は全部を露出させ、該露出部に放熱を促進する構造部を
設けたことを特徴とする金属コアプリント配線板。In a metal core printed wiring board having a single layer or multilayer metal plate, parts of the surface of the metal plate necessary for forming conductor wiring layers, through holes, etc. and mounting components are covered with an insulating layer. A metal core printed wiring board characterized in that a part or all of an end of a metal plate is exposed, and a structure for promoting heat radiation is provided in the exposed part.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16739783U JPS6076056U (en) | 1983-10-31 | 1983-10-31 | metal core printed wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16739783U JPS6076056U (en) | 1983-10-31 | 1983-10-31 | metal core printed wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6076056U true JPS6076056U (en) | 1985-05-28 |
Family
ID=30366236
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16739783U Pending JPS6076056U (en) | 1983-10-31 | 1983-10-31 | metal core printed wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6076056U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63296290A (en) * | 1987-05-27 | 1988-12-02 | Ok Print Haisen Kk | Electronic device |
-
1983
- 1983-10-31 JP JP16739783U patent/JPS6076056U/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63296290A (en) * | 1987-05-27 | 1988-12-02 | Ok Print Haisen Kk | Electronic device |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS6076056U (en) | metal core printed wiring board | |
JPS6022889U (en) | multilayer printed wiring board | |
JPS6076055U (en) | metal core printed wiring board | |
JPS58106968U (en) | printed wiring board | |
JPS59177973U (en) | Inner layer circuit board for multilayer printed wiring board | |
JPS6127271U (en) | Printed board | |
JPS5812973U (en) | multilayer printed circuit board | |
JPS6011463U (en) | enamel board | |
JPS59146999U (en) | Shield structure of printed circuit board | |
JPS6057154U (en) | flexible printed board | |
JPS602861U (en) | Metal core printed wiring board | |
JPS6042795U (en) | Printed board | |
JPS6033474U (en) | Laminated printed wiring board | |
JPS6013769U (en) | printed wiring board | |
JPS59138259U (en) | Manufacturing method of printed circuit board with heatsink | |
JPS5929071U (en) | Inner layer structure of multilayer printed wiring board | |
JPS60133690U (en) | Substrate for electronic components | |
JPS59169064U (en) | printed circuit board | |
JPS6022846U (en) | hybrid integrated circuit | |
JPS6138996U (en) | Heat dissipation structure of printed circuit board | |
JPS59192870U (en) | printed circuit board equipment | |
JPS60116267U (en) | Al-based circuit board | |
JPS59187166U (en) | Laminated printed wiring board | |
JPS5815375U (en) | Substrate for hybrid integrated circuits | |
JPS6020148U (en) | Hybrid integrated circuit device |