JPS6074656A - Heat dissipator for ic module - Google Patents

Abstract

PURPOSE:To enable an IC module to dissipate heat effectively, and to contrive the mounting the modules at high density by a method wherein a closed container of polygonal form having the side surface consisting of a plurality of planes is filled with a liquid coolant, and the modules are stuck on the planes. CONSTITUTION:A heat dissipating container 1 is made up of a polyhedron having the side surface 2 consisting of six planes and is provided with pleat-form hollow fins 3 in the upper part. The inside of this container is filled with the liquid coolant 4 such as fleon. Six IC modules 5 are suck on the six side surface of the closed container 1, respectively. The module is constructed concretely by the mounting of a plurality of IC chips 7 on a substrate 6 of good thermal conductivity, and the substrate is provided e.g. at the bottom side end of the container with a connection terminal 8 for electrical connection to electric apparatus. Since the titled device is thus constructed, the IC chips are thermally connected to the coolant via substrate and the side surface 2 of the container.

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention provides a heat dissipation method for IC modules that can efficiently dissipate heat generated from a large number of IC modules and is suitable for high-density packaging of ICs. Concerning vessels.

[Technical background of the invention and its problems]

2. Description of the Related Art Recently, electronic devices have been miniaturized by making full use of LSI integration technology and high-density packaging technology. A particular problem in achieving high-density packaging of ICs is the heat dissipation method of the IC module. Conventionally, for example, an aluminum fin or the like was provided as a heat sink on the board, and this
The heat generated by the module was released into the atmosphere.

However, there is a natural limit to the heat dissipation capacity of such a method, and for example, in devices such as so-called super computers that require high-density packaging of ICs, such conventional techniques can no longer reach the heat dissipation capacity. It is expected that the limit will be reached. For this reason, there has been a desire for a heat sink with excellent heat dissipation characteristics that can accommodate high-density packaging.

[Purpose of the invention]

The present invention was made in consideration of such circumstances, and
The purpose is to provide a heat sink for IC modules that can effectively radiate heat from IC modules, enable high-density packaging of IC modules, and thereby contribute to the miniaturization of electronic devices. There is a particular thing.

[Summary of the invention]

The present invention is characterized in that a liquid refrigerant is sealed in a polygonal airtight container whose side surfaces have a plurality of flat surfaces, and an IC module is attached to the plurality of flat surfaces.

〔Effect of the invention〕

According to the present invention, the liquid refrigerant sealed in the hermetic container is
The C module can be thermally connected to the wall surface of the sealed container. Therefore, the heat generated from the IC module is absorbed as heat of vaporization of the refrigerant, and the vaporized refrigerant is condensed again as the pressure within the closed container increases. In this case, unlike heat dissipation to the atmosphere using conventional aluminum fins, heat dissipation from the IC module is performed by heat transfer in the thickness direction of the container, which greatly reduces thermal resistance and is extremely effective. heat dissipation.

Moreover, in the present invention, the side surface of the airtight container is configured with a plurality of planes, and the IC module is attached to this side surface, so that the outer surface of the container can be effectively used, and the IC module can be attached to the side surface of the airtight container.
The mounting density of modules can be significantly increased. As a result, it can greatly contribute to downsizing of electronic devices.

[Embodiments of the invention]

Hereinafter, details of the present invention will be explained based on illustrated embodiments.

In FIGS. 1 and 2, the container is a heat dissipating container whose interior is sealed, and is made of a good heat conductive material such as aluminum, for example. On this heat dissipation container, its side 2
It is made of a polyhedron made up of six planes, and has pleated hollow fins 3 formed on the upper part. A liquid refrigerant 4 such as Freon, for example, is sealed inside the heat radiation container.

Six IC modules i are adhered to each of the six sides of the airtight container.

Specifically, the IC module i is configured by mounting a plurality of IC chips 7 on a substrate 6 with good thermal conductivity, and the substrate 6 has, for example, an electronic device (not shown) mounted on the bottom end of a heat dissipation container. A connection terminal 8 is provided for electrical connection.

In the IC module heatsink according to this embodiment configured as described above, the IC chip 7 is thermally connected to the liquid coolant 4 via the substrate 6 and the side surface 2 on the heat radiation container. Therefore, the heat generated from the IC chip 7 is absorbed into the liquid refrigerant 4 as heat of vaporization via the substrate 6 and the side surface 2 on the heat dissipation container. The vaporized refrigerant vapor 9 moves along the inner surface of the heat dissipation container to the lower temperature upper part of the inner space of the fins 3. Then, in this upper part, the refrigerant vapor 9 is condensed again by the pressure increase in the upper space due to the vaporization, falls by gravity, and accumulates in the container 1.

By repeating this process, the heat dissipation container is always filled with a predetermined amount of liquid refrigerant 4 necessary to cool the IC module 1.

In this way, according to this embodiment, the IC chip 7 and the liquid coolant 4 are thermally connected via the substrate 6 and the side surface 2 on the heat dissipation container, so that the effect can be achieved with low thermal resistance. IC
The chip 7 can be cooled. Moreover, in this case,
Since the side surface 2 on the airtight container is composed of a plurality of planes and the IC module 1 can be attached to these planes, the outer surface of the heat dissipation container 1 can be effectively utilized.
High-density mounting of the IC module 1 becomes possible.

5- Note that the present invention is not limited in any way to the number of planes forming the side surface of the heat dissipation container, the presence or absence of fins, the type of liquid refrigerant, etc. In short, the present invention can be implemented with various modifications without departing from the gist thereof.

[Brief explanation of the drawing]

FIG. Y... Heat dissipation container, 2 Middle side, 3... Fin, 4...
-Liquid refrigerant, -5-...IC module, 6...board, 7...IC chip, 8...connection terminal, 9...
Refrigerant vapor. Applicant's agent Patent attorney Takehiko Suzue 6-

Claims (1)

[Claims] A radiator for an IC module, comprising: a polygonal sealed container whose side surfaces have a plurality of flat surfaces for adhering an IC module; and a liquid refrigerant sealed within the sealed container.