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JPS6069550A - Method and device for detecting grinding crack - Google Patents

Method and device for detecting grinding crack

Info

Publication number
JPS6069550A
JPS6069550A JP58178870A JP17887083A JPS6069550A JP S6069550 A JPS6069550 A JP S6069550A JP 58178870 A JP58178870 A JP 58178870A JP 17887083 A JP17887083 A JP 17887083A JP S6069550 A JPS6069550 A JP S6069550A
Authority
JP
Japan
Prior art keywords
grinding
amplifier
cracks
detected
band
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58178870A
Other languages
Japanese (ja)
Inventor
Hiroshi Eda
弘 江田
Yoshiaki Kakino
義昭 垣野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP58178870A priority Critical patent/JPS6069550A/en
Publication of JPS6069550A publication Critical patent/JPS6069550A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/14Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object using acoustic emission techniques

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)

Abstract

PURPOSE:To detect a grinding crack through a simple device and realize automatic, labor-saving grinding work by converting acoustic emission generated in grinding work into an electric signal, detecting its amplified signal after passing it through a band-pass filter, and generating a warning of the grinding crack when the detected value is larger than a set threshold value. CONSTITUTION:A grinding crack detector consists of a sensor 5 which is fitted to a chuck 3 and converts the acoustic emission into the electric signal, an amplifier 6 for the signal, a band-pass filter 7 connected to the amplifier 6, a detector 8, and an amplitude discriminator 9 which compares the amplitude of the output of the band-pass filter 7 with the set threshold value. Then, the AE generated in the grinding work is converted by the sensor 5 into the electric signal, which is amplified by the amplifier 6, passed through the band-pass filter 7 to remove the AE, mechanical noise, and electric noise generated in the normal grinding work, and detected by the detector 8. Then, a buzzer 10 sounds to warn a grinding crack when a value larger than the preset threshold value, e.g. 10mV is detected by the amplitude discriminator 9.

Description

【発明の詳細な説明】 本発明は、研削加工中及び研削加工の終了直後に発生す
る研削割れを検出し、これに基づいて砥石のドレッシン
グを行なうことにより、不良品の発生を防止するのに有
効な一研削割れ検出方法及び該検出方法を実施する装置
に関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention detects grinding cracks that occur during grinding and immediately after the end of grinding, and dresses the grindstone based on this, thereby preventing the production of defective products. The present invention relates to an effective grinding crack detection method and an apparatus for implementing the detection method.

近年、生産技術の進歩に伴い、研削加工の省力化、無人
化の要望が高まっているが、研削加工は切削加工より高
精度、高品位が要求されるため自動化ははるかに困難で
ある。その一つが研削割れによる不良品の発生である。
In recent years, with advances in production technology, there has been an increasing demand for labor-saving and unmanned grinding processes, but grinding processes require higher precision and quality than cutting processes, so automation is much more difficult. One of these is the occurrence of defective products due to grinding cracks.

これは従来から問題になっていたが、研削終了後の目視
観察による以外に適当な検出手段がなかった。
This has been a problem for some time, but there was no suitable means of detection other than visual observation after grinding.

本発明者等は、研削割れをインプロセス検出する手段と
して、研削加工中及び研削加工の終了直後に発生するア
コースティック、エミッション(以下、AEと略称する
)を利用する方法について種々実験と研究を重ねた結果
、研削加工中に研削割れが生じるに伴って前記AEのパ
ワーが特定周波数帯域で顕著になることを見出し、この
知見に基づいて本発明を完成するに至った。
The present inventors have conducted various experiments and research on methods that utilize acoustic emissions (hereinafter abbreviated as AE) that occur during and immediately after the grinding process as a means for in-process detection of grinding cracks. As a result, it was discovered that the power of the AE becomes noticeable in a specific frequency band as grinding cracks occur during grinding, and based on this knowledge, the present invention was completed.

研削加工中、砥粒の目詰シなどによって研削砥石の作業
面が劣化すると、研削面の温度が著しく高くなシ工作物
に研削割れ(熱き裂)を発生するが、この研削割れによ
って生じるAEのパワーは、工作物が鉄鋼材料の場合、
周波数が帆5肌ないし1石の帯域で顕著にあられれるこ
とが、実験の結果確認された。また、研削加工の終了直
後に、研削熱の降下に起因して工作物に微小な研削割れ
(熱き裂)が発生し、これに伴ってAEを生じることも
確認された。
During the grinding process, if the working surface of the grinding wheel deteriorates due to clogging of abrasive grains, etc., the temperature of the grinding surface is extremely high, and grinding cracks (thermal cracks) occur in the workpiece. When the workpiece is made of steel, the power of
As a result of experiments, it has been confirmed that the frequency is noticeable in the band of 5 skins or 1 stone. It was also confirmed that immediately after the grinding process was completed, minute grinding cracks (thermal cracks) were generated in the workpiece due to the drop in grinding heat, resulting in AE.

本発明はこのような知見に基づくもので、研削加工に際
して発生するアコースティック、エミッション(AE)
を電気信号に変換し、かつ増幅器によって増幅した信号
を工作物の研削割れ(熱き裂)によって生じる前記アコ
−ステイク、エミッション(AE)のパワーが顕画にな
る0、5&ないし1石の特定周波数帯域に対応したバン
ドパスフィルタに通しだのち検波し、この値が予め設定
した閾値よシ大きいとき、これを振幅弁別器によシ検出
して、研削割れの警報を発することを特徴とする研削割
れ検出方法に係るものである。
The present invention is based on this knowledge, and is based on the acoustic emission (AE) generated during grinding.
Converts the signal into an electrical signal, and converts the signal amplified by an amplifier into a specific frequency of 0, 5 & 1 stone, at which the power of the acoustic takeoff and emission (AE) caused by grinding cracks (thermal cracks) of the workpiece becomes apparent. Grinding characterized in that the wave is passed through a band pass filter corresponding to the band and then detected, and when this value is larger than a preset threshold value, this is detected by an amplitude discriminator and a warning of grinding cracks is issued. This relates to a crack detection method.

第2番目の発明は、上記検出方法を実施するために使用
する装置に関し、研削加工に際して発生スルアコーステ
ィックエミッションを電気信号に変換するl・ランスデ
ューサと、前記電気信号を増幅する増幅器と、該増幅器
出力に接続されたバンドパスフィルタと、該バンドパス
フィルタの出力の振幅を予め設定した閾値と比較する振
幅弁別器とから構成されることを特徴とする。
A second invention relates to a device used to carry out the above detection method, and includes: an L transducer that converts through acoustic emissions generated during grinding into an electrical signal; an amplifier that amplifies the electrical signal; and an amplifier that amplifies the electrical signal. It is characterized by comprising a bandpass filter connected to its output, and an amplitude discriminator that compares the amplitude of the output of the bandpass filter with a preset threshold.

本発明によれば、研削割れのインプロセス検出が可能と
なシ、研削加工中に研削割れが生じて不良な製品が生産
される恐れがおる場合、これを検出して、許容できない
研削割れになる以前に砥石のドレッシングを行なったシ
、研削条件の緩和をはかるなどして、不良品の発生を防
ぐことができる。また、本発明は、研削加工の省力化、
自動化に寄与しうるものである。
According to the present invention, in-process detection of grinding cracks is possible, and if grinding cracks occur during grinding and there is a risk of producing a defective product, this can be detected and the grinding cracks can be detected to be unacceptable. The occurrence of defective products can be prevented by dressing the grindstone before the grinding process occurs or by relaxing the grinding conditions. In addition, the present invention saves labor in grinding,
This can contribute to automation.

また、本発明の第2番目の発明によれば、上記検出方法
が比較的簡単な装置によって実施できる。
Further, according to the second aspect of the present invention, the above detection method can be implemented using a relatively simple device.

以下、本発明の実施の態様を図面に基づいて具体的に説
明する。
Embodiments of the present invention will be specifically described below based on the drawings.

第1図は本発明方法を実施する研削割れ検出装置の系統
図である。図において1は研削砥石、2は平面研削盤の
テーブル、3はテーブル2に設置したマグネットチャッ
ク、4.はマグネットチャック3に保持された工作物で
あシ、研削砥石1により、工作物4の上面を研削するよ
うになっている。
FIG. 1 is a system diagram of a grinding crack detection apparatus that implements the method of the present invention. In the figure, 1 is a grinding wheel, 2 is a table of a surface grinder, 3 is a magnetic chuck installed on the table 2, and 4. A workpiece 4 is held by a magnetic chuck 3, and the upper surface of the workpiece 4 is ground by a grinding wheel 1.

研削割れ検出装置は、チャック3に取シ付けたアコース
ティック、エミッション(AE)を電気信号に変換する
センサ5、前記信号を増幅する増幅器G、該増咥器6に
接続されたバンドパスフィルタ7、検波器8、及びバン
ドパスフィルタ7の出力の振幅を予め設定した閾値と比
較する振幅弁別器9によって’+’t’J成されている
。バンドパスフィルタ了の周波数帯域は、研削加工中に
研削割れが生じるに伴ってAE倍信号パワーが顕著にな
るし5用ないし1融の特定周波数帯域に対応し、かつ電
気ノイズなどを含まないようにするため、本実施例では
、0.6&ないし0−8Lfi&とした。
The grinding crack detection device includes a sensor 5 attached to the chuck 3 that converts acoustic emission (AE) into an electrical signal, an amplifier G that amplifies the signal, a bandpass filter 7 connected to the booster 6, '+'t'J is formed by a detector 8 and an amplitude discriminator 9 that compares the amplitude of the output of the bandpass filter 7 with a preset threshold. The frequency band of the band-pass filter corresponds to a specific frequency band of 5 to 1, since the AE multiplied signal power becomes noticeable as grinding cracks occur during grinding, and it is designed to not include electrical noise. In order to achieve this, in this embodiment, it is set to 0.6& to 0-8Lfi&.

次に作用を説明する。研削加工中に発生するAEはセン
サ5によって電気信号に変換されたのち、増幅器6によ
って増幅され、バンドパスフィルタ7を通すことにより
、正常な研削加工によって発生するAE、機械的ノ1°
ズ、および電気的ノイズを除去した後、検波器8によっ
て検波する。しかる後、あらかじめ設定されている閾値
、例えば10mVよシ大きな値を振幅弁別器9に上り検
出したとき、これに応答するブザー10によって研削割
れの警報を発する。
Next, the effect will be explained. AE generated during grinding is converted into an electrical signal by a sensor 5, amplified by an amplifier 6, and passed through a bandpass filter 7.
After removing noise and electrical noise, the wave is detected by a wave detector 8. Thereafter, when the amplitude discriminator 9 detects a value larger than a preset threshold value, for example 10 mV, a buzzer 10 in response issues a warning of grinding cracks.

第2図は、上記検出装置によって、下記の加工条件で平
面研削を行なって研削割れを検出した一例を示し、第3
図は同研削中において研削割れが生じていない場合と、
生じている場合に測定されたAEのパワースペクトルの
比較を示す。
Figure 2 shows an example in which grinding cracks were detected by the above-mentioned detection device during surface grinding under the following processing conditions.
The figure shows the case where no grinding cracks occur during the same grinding, and
A comparison of the power spectra of AE measured when it occurs is shown.

工作物:sk3鋼 、 切込み:3Q7zm研削砥石;
WA60 LmV 、砥石周速度:1800’77’m
xテーブル速度: 10y>t/、 、乾研削第2図に
おいて、研削開始0.17秒後に設定した閾値10mV
 を越えるAEが測定され、研削割れの発生が検出され
た。
Workpiece: SK3 steel, Depth of cut: 3Q7zm grinding wheel;
WA60 LmV, grinding wheel peripheral speed: 1800'77'm
x table speed: 10y>t/, , in dry grinding Figure 2, threshold value 10mV set 0.17 seconds after the start of grinding
The AE exceeding

また、第3図によれば、研削割れが生じていない場合に
は帆6 t+ffh以上の成分は非常に小さいのに対し
、研削割れが生じている場合には帆6 &ihから0 
、81.Ifh の成分が増加している。このととから
、研削割れが生じているときに発生するAEは0.6石
ないし帆81.肚の特定周波数帯域において顕著になる
ことが判る。
Furthermore, according to Fig. 3, when no grinding cracks occur, the components above sail 6 t + ffh are very small, whereas when grinding cracks occur, the components from sail 6 &ih to 0
, 81. Ifh component is increasing. From this, the AE that occurs when grinding cracks occur is 0.6 stone or 81. It can be seen that this is noticeable in a specific frequency band of the abdomen.

第1図の検出装置によシ研削中に生じる研削割れを検出
することができるが、研削中には工作物の塑性変形や破
壊に伴うAEが発生し、この中にはある程度0.6+、
lIkから0 、8 hub の周波数帯域の成分も含
笠れている。したがって研削割れのみを確実に検出する
ためには設定する閾値をこれよりも大きくしておかなけ
ればならない。逆に言えば比較的小さな研削割れは見逃
す可能性がある。このような微小な研削割れは、ノイズ
の少ない研削加工の終了直後にも発生し、特有なAEを
生じるので、上記検出装置を利用して微小な研削割れを
検出することもできる。
The detection device shown in Fig. 1 can detect grinding cracks that occur during grinding, but during grinding, AE occurs due to plastic deformation and destruction of the workpiece, and this includes a certain amount of 0.6+,
Components in the frequency band from lIk to 0 and 8 hub are also included. Therefore, in order to reliably detect only grinding cracks, the threshold value must be set larger than this. Conversely, relatively small grinding cracks may be overlooked. Such minute grinding cracks occur even immediately after the end of the grinding process with little noise, and cause a unique AE, so the detection device described above can also be used to detect minute grinding cracks.

第4図は、研削加工後の研削割れを検出する装置の一例
を示す。該装置は、第1図に示した研削割れ検出装置に
、研削加工の開始及び終了時刻を検出するマイクロスイ
ッチ11及び12と、該マイクロスイッチ11及び12
からの信号により研削加工の終了時刻を知り、これ以後
設定した時間だけ監視せよという信号を出すタイマー弁
別器13と、該タイマー弁別器13と振幅弁別器9の2
つの信号のアンドをとるアンドゲート14を付加するこ
とによって構成されている。
FIG. 4 shows an example of a device for detecting grinding cracks after grinding. This device includes the grinding crack detection device shown in FIG.
A timer discriminator 13 that detects the end time of the grinding process based on a signal from the machine and sends a signal to monitor for a set period of time thereafter;
It is constructed by adding an AND gate 14 that ANDs two signals.

こノ場合、バンドパスフィルタ7の周波数帯域は必ずし
も第1図の装置のように研削割れが生じるに伴ってAE
倍信号パワーが顕著になる0 、 61.1&ないし0
.8LTh付近に限定する必要はなく、それよシ広い周
波数帯域たとえば0.1ないし1−でも良い。
In this case, the frequency band of the bandpass filter 7 is not necessarily limited to AE due to the occurrence of grinding cracks as in the device shown in FIG.
0, 61.1 & or 0 where signal power becomes noticeable
.. It is not necessary to limit it to around 8LTh, and a wider frequency band, for example 0.1 to 1-, may be used.

タイマー弁別器13は、マイクロスイッチ11及び12
からの信号をもとに研削加工の終了時刻を検出し、安全
のために少し時間遅れをおいてから、研削割れを検出す
べく予め設定された時間だけ信号を出し、それ以外、た
とえば研削加工によって発生するAEによシ菅報が発せ
られるのを防いでいる。アンドゲート14は、タイマー
弁別器13から信号が出力されている時間、すなわち監
視時間内に振幅弁別器9から出力があったとき、これを
検出してブザー1oによシ研削割れの発生を知らせるG
報を発する。
The timer discriminator 13 includes microswitches 11 and 12.
The end time of the grinding process is detected based on the signal from This prevents alarms from being issued due to AEs caused by this. The AND gate 14 detects an output from the amplitude discriminator 9 during the time when the signal is output from the timer discriminator 13, that is, within the monitoring time, and notifies the buzzer 1o of the occurrence of grinding cracks. G
issue a report.

第5図は、上記検出装置によって研削加工の終了直後に
発生する微小な研削割れを検出した一例を示す。第54
図によれば、研削終了後0.1”see経過してから監
視を開始し、監視開始後0.221nstxだった時、
設定された0、07Vの閾値を越える信号が検出され、
微小割れの発生を知ることができた。
FIG. 5 shows an example in which the detection device detects minute grinding cracks that occur immediately after the grinding process is completed. 54th
According to the figure, monitoring was started after 0.1" had passed after the end of grinding, and when it was 0.221nstx after the start of monitoring,
A signal exceeding the set threshold of 0.07V is detected,
We were able to detect the occurrence of microcracks.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明方法を実施する検出装置の系統図、第2
図は同検出装置によシ測定した出力信号を示す線図、第
3図は同検出装置によシ測定したAEのパワースペクト
ルの比較線図、第4図は別の実施例を示す系統図、第5
図は同検出装置によシ測定した出力信号を示す茄!図で
ある。 1・・・・・・・・研削砥石 4・・・・・・・・工作
物5・・・・・・・・センサ 6・・・・・・・・増幅
器7・・・・・・・・バンドパスフィルタ8・・・・・
・・・検波器 9・・・・・・・・振幅弁別器10・・
・・・・ブザ − 11 .12・・・・・・マイクロスイッチ13・・・
−・・タイマー弁別器14・・・・・・アンドゲート特
許出願人 江 1) 弘 同 上 垣 野 義 昭 代理人 弁理士 高 良 英 通
Figure 1 is a system diagram of a detection device that implements the method of the present invention;
The figure is a diagram showing the output signal measured by the same detector, Figure 3 is a comparison diagram of the power spectrum of AE measured by the same detector, and Figure 4 is a system diagram showing another example. , 5th
The figure shows the output signal measured by the same detection device. It is a diagram. 1...Grinding wheel 4...Workpiece 5...Sensor 6...Amplifier 7...・Band pass filter 8...
...Detector 9...Amplitude discriminator 10...
...buzzer - 11. 12...Micro switch 13...
- Timer discriminator 14... ANDGATE patent applicant Jiang 1) Hirodo Kami Yoshiaki Kakino Agent Patent attorney Yoshihide Ko

Claims (1)

【特許請求の範囲】 1、研削加工に際して発生するアコースティック、エミ
ッションを電気信号に変換し、かつ増幅器によって増幅
した信号を工作物の研削割れ(熱き裂)によって生じる
前記アコースティック、エミッションのパワーが顕著に
なる0、5+、hないし1ム詣の特定周波数帯域に対応
したバンドパスフィルタに通したのち検波し、この値が
予め設定した閾値よシ大きいとき、これを振幅弁別器に
ょシ検出して、研削割れの菅報を発することを特徴とす
る研削割れ検出方法。 2、前記バンドパスフィルタの通過帯域が0.61、肚
ないし0.811′ibである特許請求の範囲第1項記
載の研削割れ検出方法。 3、研削加工に際して発生するアコースティック、エミ
ッションを電気信号に変換するトシンスデューサと、前
記電気信号を増幅する増幅器と、該増幅器出力に接続さ
れたバンドパスフィルタと、該バンドパスフィルタの出
力の振幅を予め設定した閾値と比較する振幅弁別器とか
ら構成されることを特徴とする研削割れ検出装置。
[Claims] 1. Acoustic emissions generated during grinding are converted into electrical signals, and the signals amplified by an amplifier are used to significantly increase the power of the acoustic emissions generated by grinding cracks (thermal cracks) on the workpiece. It is detected after passing through a band pass filter corresponding to a specific frequency band of 0, 5+, h or 1 m, and when this value is larger than a preset threshold, this is detected by an amplitude discriminator, A grinding crack detection method characterized by issuing a notification of grinding cracks. 2. The grinding crack detection method according to claim 1, wherein the passband of the bandpass filter is 0.61 to 0.811'ib. 3. A transducer that converts acoustic emissions generated during grinding into an electrical signal, an amplifier that amplifies the electrical signal, a bandpass filter connected to the output of the amplifier, and the amplitude of the output of the bandpass filter. A grinding crack detection device comprising an amplitude discriminator that compares the amplitude with a preset threshold.
JP58178870A 1983-09-26 1983-09-26 Method and device for detecting grinding crack Pending JPS6069550A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58178870A JPS6069550A (en) 1983-09-26 1983-09-26 Method and device for detecting grinding crack

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58178870A JPS6069550A (en) 1983-09-26 1983-09-26 Method and device for detecting grinding crack

Publications (1)

Publication Number Publication Date
JPS6069550A true JPS6069550A (en) 1985-04-20

Family

ID=16056126

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58178870A Pending JPS6069550A (en) 1983-09-26 1983-09-26 Method and device for detecting grinding crack

Country Status (1)

Country Link
JP (1) JPS6069550A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63278762A (en) * 1987-05-11 1988-11-16 Hiroshi Eda Method for detecting grinding crack of fine ceramics and device therefor
WO2006009222A1 (en) * 2004-07-23 2006-01-26 Asahi Glass Company, Limited Plate glass crack detection method and detector, and plate glass polishing method and device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63278762A (en) * 1987-05-11 1988-11-16 Hiroshi Eda Method for detecting grinding crack of fine ceramics and device therefor
WO2006009222A1 (en) * 2004-07-23 2006-01-26 Asahi Glass Company, Limited Plate glass crack detection method and detector, and plate glass polishing method and device
JP2006035343A (en) * 2004-07-23 2006-02-09 Asahi Glass Fine Techno Co Ltd Method for detecting cracking of glass plate and device therefor, and method for polishing glass plate and device therefor

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