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JPS6050931A - Vertical feed type wire bonder - Google Patents

Vertical feed type wire bonder

Info

Publication number
JPS6050931A
JPS6050931A JP58157822A JP15782283A JPS6050931A JP S6050931 A JPS6050931 A JP S6050931A JP 58157822 A JP58157822 A JP 58157822A JP 15782283 A JP15782283 A JP 15782283A JP S6050931 A JPS6050931 A JP S6050931A
Authority
JP
Japan
Prior art keywords
wire
tool
bonding
hole
arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58157822A
Other languages
Japanese (ja)
Inventor
Ken Okuya
謙 奥谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58157822A priority Critical patent/JPS6050931A/en
Publication of JPS6050931A publication Critical patent/JPS6050931A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H01L2224/78314—Shape
    • H01L2224/78317—Shape of other portions
    • H01L2224/78318—Shape of other portions inside the capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/788—Means for moving parts
    • H01L2224/78801—Lower part of the bonding apparatus, e.g. XY table
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 〔技術分野〕 本発明は、垂直フィード型のワイヤボンディング技術に
適用して有効な技術に関するもので、例えば、垂直フィ
ード型超音波ワイヤボンディング技術に利用して、特に
有効な技術に関するものである。Detailed Description of the Invention [Technical Field] The present invention relates to a technique that is effective when applied to vertical feed type wire bonding technology, and is particularly effective when applied to, for example, vertical feed type ultrasonic wire bonding technology. It is related to technology.

〔背景技術〕[Background technology]

半導体製雪の組立工程において、リードフレームのリー
ド部と、ベレット上のパッド部とを接続するためにワイ
ヤボンディングが行なわれており、たとえば、ＷＥＳＴ
　ＢＯＮＤ　Ｍｏｄｅｌ　４６００（ＷＥＳＴ　ＢＯＮ
Ｄ社）の垂直フィード型超音波ワイヤボンダが知られて
いる。In the assembly process of semiconductor snowmaking, wire bonding is performed to connect the lead part of the lead frame and the pad part on the pellet.
BOND Model 4600 (WEST BON
A vertical feed type ultrasonic wire bonder manufactured by Company D is known.

この種の装置では第１図に示すようにクランパをポンデ
ィング用ツール２（以下単にツール）の上方に配設でき
るので、ワイヤ１を垂直方向から送り出しができ斜方向
からワイヤ１を送り出す技術例えば特開昭５４−１５９
１７５公報に開示している技術に比べて、狭い範囲での
ボンディングが可能となっている。しかしながら、この
種の装置にワイヤ１としてＡ７線を使用した時、連続１
００ワイヤ程でボンディング不良が発生してし寸った。In this type of device, as shown in Fig. 1, the clamper can be placed above the pounding tool 2 (hereinafter simply referred to as the tool), so the wire 1 can be fed out from the vertical direction, and the technique of feeding out the wire 1 from the diagonal direction, for example, Japanese Patent Publication No. 54-159
Compared to the technology disclosed in Publication No. 175, bonding can be performed in a narrower range. However, when using A7 wire as wire 1 in this type of device, continuous 1
A bonding failure occurred with about 00 wire.

そのため、本発明者は、その原因を追求した結果、ツー
ル２のフィード角Ｘが従来のものＦｉ３０’　で形成さ
れているため、ワイヤの曲がりがきつく、Ａｌ線が送り
出された時などに、屈曲部３などでＡｌ線がけずられ、
そのけずられ、たＡｌ材等がツール２の孔４の壁に固着
して、孔４がつまる等の問題が生じてＡｌ線の迫り出し
に悪影響を与えている事を本発明者はつきとめた。Therefore, as a result of investigating the cause, the present inventor discovered that since the feed angle The Al wire is scratched in section 3, etc.
The inventor found that the scraped Al material, etc. adhered to the wall of the hole 4 of the tool 2, causing problems such as clogging of the hole 4, and adversely affecting the protrusion of the Al wire. .

〔発明の目的〕[Purpose of the invention]

本発明の目的は、ワイヤの迫り出しがスムースに行なう
ことができうるボンディング用ツールを有したワイヤポ
ンダを提供することである。SUMMARY OF THE INVENTION An object of the present invention is to provide a wire bonder having a bonding tool that can smoothly push out a wire.

本発明の他の目的は、ワイヤとしてＡ７線を用いた時に
、連続したワイヤボンディングが可能な垂直フィード型
ワイヤポンダを提供することにある。Another object of the present invention is to provide a vertical feed type wire bonder capable of continuous wire bonding when A7 wire is used as the wire.

〔発明の概要〕 本願において開示される発明のうち、代表的なものの概
要を簡単に説明すれば下記のとおシである。[Summary of the Invention] Among the inventions disclosed in this application, a brief overview of typical inventions is as follows.

すなわち、ツールの構造を改良して、ワイヤと前記ツー
ルに設けたワイヤを溝面させる孔との接触を少なくした
ことにより、ワイヤの送り出しがスムースとなるので、
ワイヤが孔の壁にけずられて、その孔内にけずられたワ
イヤの材料等が固着し、孔がつ捷るという問題は生ずる
ことはなく、従来のものより回数多く連続してボンディ
ングを行なうことができる。That is, by improving the structure of the tool and reducing the contact between the wire and the hole provided in the tool that makes the wire groove surface, the wire can be fed out smoothly.
There is no problem of the wire being scraped against the wall of the hole and the material of the scraped wire sticking inside the hole, causing the hole to break, and bonding can be performed more times in succession than with conventional methods. be able to.

〔実施例〕〔Example〕

第２図は、本発明の一実施例である超音波ワイヤポンダ
の側面図である。５はワイヤで例えばアルミニウム（Ａ
Ａ）線、６は前記ｄｉをガイドするボンディング用ツー
ル（以下ツール）で、その中心部には、Ａ　ＩＪ　ｍ　
５よりやや大きｄ）の孔７が設けられている。このツー
ル６にボンディングブーム８に保持され、さらにボンデ
ィングアーム８は超音波ホーン９に接続されてボンディ
ングアーム８が超音波振動を起こすようになっている。FIG. 2 is a side view of an ultrasonic wireponder that is an embodiment of the present invention. 5 is a wire made of aluminum (A
A) Line 6 is a bonding tool (hereinafter referred to as tool) that guides the di, and in the center thereof, A IJ m
A hole 7 slightly larger than 5 is provided. This tool 6 is held by a bonding boom 8, and the bonding arm 8 is further connected to an ultrasonic horn 9 so that the bonding arm 8 generates ultrasonic vibrations.

ツール６の上方にはＡｌ線５を挾持するクランノ＜１０
が超音波ホーン９と同様にボンディングヘッド１１に配
設され、ツール６の移動に共なって開閉するようになっ
ている。ボンディングヘッド１１は駆動体例えばＸＹテ
ーブル１２上に載置されて、モータによりＸＹ方向に自
由に移動できるようになっている。２０は回転試料台で
あって、モータによりθ方向に自由に回転できるように
なっている。Above the tool 6 is a cranometer <10 that holds the Al wire 5.
is disposed on the bonding head 11 in the same way as the ultrasonic horn 9, and opens and closes as the tool 6 moves. The bonding head 11 is placed on a driving body, for example, an XY table 12, and can be freely moved in the XY directions by a motor. Reference numeral 20 denotes a rotating sample stage, which can be freely rotated in the θ direction by a motor.

なお、１３はパッケージ、１４はベレットである。Note that 13 is a package and 14 is a pellet.

次に第３図から第６図を用いてボンディング用ツール６
を詳細に説明する。第３図はツール６の上面図、第４図
及び第５図は側面図、第６図はツール６の主要部拡大断
面図である。図かられかるように、ツール６にはＡｌ線
５を導通する孔７が設けら力ている。この孔７はツール
６の上面１５からテーパ面］、６ｔで導通している導通
孔７ａとＡｌ線５を所定の角度で送シ出すためにツール
６の先端部に設けた孔１７から成っている。導通孔７ａ
により垂直に導びかれたＡ７線５は、テーパ面１６から
ツール６外に開放され、ＡＪｌｔ線５が屈曲する部分で
はツール６とＡｌ線５はほとんど非接触となるようにし
ている。さらに、非接触性を強めるためテーパ面１６に
凹部１８を設けている。また、Ａｌｊ線５の送り出しの
方向を一定にするため、つ壕りＡｌ線５のフィード角θ
を一定にするため、ツール６の先端部にθ＝６０°　の
フィード角を持った送出孔１７を設けている。このフィ
ード角θけ、６０°　と限定されるものではなく、４５
″　〜６０°　の範囲であれば良い。こｉｌは、フィー
ド角θが４５°　より小さくなると、Ａｌ線５が送り出
された時に、フィード角の曲がりがきついため、Ａｌ線
５の屈曲部でたるみを生じて、ｈｌａ５の送り出しがう
まくできない。また、ＡＩＪ線５が送出孔１７の壁に％
　＜接触して、ｈｌ線５かけずられて、そのけずられた
Ａ７材が送出孔１７内に固着して、送り出しに支障をき
だすこともある。′まだ、フィード角θが６０°　を越
えるとテール部５ａが垂直に近くなるので、ポンディノ
ブ時にテール部５ａが正しく固定部１９に固定さノ１な
いことが生じて、ボンディング不良の原因となりやすい
。そこで、本発明者はフィード角θは好ましくは４５゜
〜６０°　の範囲であることを見い出した。Next, use the bonding tool 6 using FIGS. 3 to 6.
will be explained in detail. 3 is a top view of the tool 6, FIGS. 4 and 5 are side views, and FIG. 6 is an enlarged sectional view of the main parts of the tool 6. As can be seen from the figure, the tool 6 is provided with a hole 7 through which the Al wire 5 is electrically connected. This hole 7 consists of a taper surface from the upper surface 15 of the tool 6, a conduction hole 7a that is electrically connected at 6t, and a hole 17 provided at the tip of the tool 6 to feed the Al wire 5 at a predetermined angle. There is. Conduction hole 7a
The A7 wire 5 guided perpendicularly is opened to the outside of the tool 6 from the tapered surface 16, so that the tool 6 and the Al wire 5 are almost not in contact with each other at the portion where the AJlt wire 5 bends. Furthermore, a recess 18 is provided in the tapered surface 16 to enhance the non-contact property. In addition, in order to keep the feeding direction of the Alj wire 5 constant, the feed angle θ of the trenched Al wire 5 is
In order to keep the feed angle constant, a delivery hole 17 with a feed angle of θ=60° is provided at the tip of the tool 6. This feed angle θ is not limited to 60°, but is 45°.
If the feed angle θ is smaller than 45°, the bending of the feed angle will be sharp when the Al wire 5 is sent out, so the Al wire 5 will slack at the bend. , and the hla5 cannot be delivered properly.Also, the AIJ wire 5 may be stuck to the wall of the delivery hole 17.
<If the A7 material comes in contact with the hl wire 5 and is displaced, the chipped A7 material may stick inside the delivery hole 17 and cause trouble in delivery. 'However, when the feed angle θ exceeds 60°, the tail portion 5a becomes nearly vertical, so that the tail portion 5a may not be properly fixed to the fixing portion 19 during pounding, which is likely to cause bonding failure. Therefore, the inventor has found that the feed angle θ is preferably in the range of 45° to 60°.

次に、図を用いて動作を説明する。Ａ点つまりベレット
１４上のパッド（図示せず）に、ツール６を移動させる
。この時、ツール６の先端部からＡｌ線５のテール部５
ａがフィード角６０６　の角度で突出している。この状
態でツール６ｆｆ下降させて、テール部５ａをパッドに
当接させると、テール部５ａＩ−ｉ正しく折れ曲がり、
例えば円弧状に形成された固定部１９で固定される。さ
らに、テール５ａを固定部１９で固定（、ながら、超音
波ホーン９を発振させて、ボンディングアーム８を介し
てツール６を超音波振動させて、テール５ａをパッドに
接続する。その後、クランプ１０ｆ開いてツール６を上
昇させ、第２のボンディング点であるＢ点、例えばリー
ド（図示せず）上にツール６を下向して当接し、Ａｌ線
５を固定部１９にて固定しながら、ツール６を超音波振
動させて、Ａｌ線をリードに接続する。次にクランパ１
０を閉じてツール６を上昇させ、Ａｌ５５をカットする
。Next, the operation will be explained using figures. The tool 6 is moved to point A, that is, to a pad (not shown) on the pellet 14. At this time, from the tip of the tool 6 to the tail 5 of the Al wire 5
a protrudes at an angle of feed angle 606. In this state, when the tool 6ff is lowered to bring the tail portion 5a into contact with the pad, the tail portion 5aI-i will be bent correctly.
For example, it is fixed by a fixing part 19 formed in an arc shape. Furthermore, the tail 5a is fixed with the fixing part 19 (while the ultrasonic horn 9 is oscillated and the tool 6 is ultrasonically vibrated via the bonding arm 8, the tail 5a is connected to the pad. Then, the tail 5a is connected to the pad. The tool 6 is opened and raised, and the tool 6 is brought downward into contact with a second bonding point, such as a lead (not shown), and while the Al wire 5 is fixed with the fixing part 19, Vibrate tool 6 ultrasonically to connect the Al wire to the lead. Next, clamper 1
0 is closed, the tool 6 is raised, and the Al55 is cut.

その後、クランパ１０を動作させて、Ａ７線５をツール
６の先端より突出させる作業、つまりテール部５ａ出し
を行なった後に、次のボンディング点に移動する。Thereafter, the clamper 10 is operated to project the A7 wire 5 from the tip of the tool 6, that is, to expose the tail portion 5a, and then the tool moves to the next bonding point.

〔効果〕〔effect〕

（１）　ワイヤが屈曲する部分に対応するボンディング
用ツールの一部を除去し、送出孔の角度をワイヤかたる
１ない程度の角度にすることにより、ワイヤがボンディ
ング用ツールと接触する面をより少なくなるので、ワイ
ヤがポンディグ用ツールにけずられることはなく、その
けずられたワイヤ材が孔内に固着するという問題も生じ
なくなるという効果が得られる。(1) By removing the part of the bonding tool that corresponds to the part where the wire bends and making the angle of the delivery hole just as small as the wire, the surface where the wire comes into contact with the bonding tool is reduced. Therefore, the wire will not be damaged by the pounding tool, and the problem of the damaged wire material becoming stuck in the hole can be achieved.

（２）そのため、ワイヤ材が孔内に固着することにより
生じるワイヤ送り出し、不良が発生することはなく、連
続したワイヤポンディングが可能となるという効果が得
られる。(2) Therefore, there is no wire feeding failure caused by the wire material being stuck in the hole, and continuous wire bonding is possible.

（３）　さらに、ボンディング用ツールのテーパ面に凹
部を設けることにより、ツールとワイヤの接触面はさら
に小さくなるので、従来の装置ではｈｌ線を使用した時
連続２００ワイヤ程度のポンディングしかできなかった
が、２０００ワイヤ以上の連続ボンディングが可能にな
るという効果が得られる。(3) Furthermore, by providing a recess in the tapered surface of the bonding tool, the contact surface between the tool and the wire becomes even smaller, so conventional equipment can only bond about 200 wires continuously when using HL wire. However, the effect that continuous bonding of 2000 wires or more is possible can be obtained.

以上本発明者によってなされた発明を実施例にもとすき
一体的に説明したが、本発明は、上記実施例に限定され
るものではなく、その要旨を逸脱しない範囲で種々変更
可能であることけいうまでもない。たとえば、ワイヤは
ｋｌ線以外のものも使用することができる。また、固定
部１９は円弧状に形成する以外に、シラットにあるいは
それ以外の形状であっても良い。Although the invention made by the present inventor has been comprehensively explained above using examples, the present invention is not limited to the above-mentioned examples, and can be modified in various ways without departing from the gist thereof. Needless to say. For example, wires other than kl wires can be used. Further, the fixing portion 19 may be formed into a silat shape or other shapes instead of being formed into an arc shape.

〔利用分野〕[Application field]

以上の説明では、主として本発明者によってなされた発
明をその背景となった利用分野である垂直フィード型超
音波ボンワイヤポンディング技術に適用した場合につい
て説明したが、それに限定されるものではなく、たとえ
ば、熱圧着ワイヤボンダや超音波振動を付加した熱圧着
方式のボンダ等にも適用することができる。In the above explanation, the invention made by the present inventor was mainly applied to the vertical feed type ultrasonic bond wire bonding technology, which is the field of application that formed the background of the invention, but the invention is not limited thereto. For example, it can be applied to a thermocompression wire bonder, a thermocompression type bonder with added ultrasonic vibration, and the like.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来のワイヤボンダに装着されていたボンディ
ング用ツールの断面図、 第２図は、本発明の一実施例であるワイヤボンダの概略
側面図、 第３図〜第６図は、本発明の一実施例であるワイヤボン
ダに装着されたボンディング用ツールを示す図である。 １・・・ワイヤ、２・・・ボンディング用ツール、３・
・・屈曲部、４・・・孔、５・・・、ｌ線、５ａ・・・
テール部、６・・・ボンディング用ツール、７・・・孔
、７ａ・・・導通孔、８・・ポンディングアーム、９・
・・超音波ホーン、１０・・・クランパ、１１・・・ポ
ンチづングヘッド、１２・・・ＸＹテーブル、１３・・
・パッケージ、１４・・・ペレット、１５・・・上面、
１６・・・テーパ面、１７・・・送出孔、１８・・・凹
部、１９・・・固定部、２０・・・回転試料台。 第　３．　図 第　４　図　第　５　図 第　６　図FIG. 1 is a sectional view of a bonding tool installed in a conventional wire bonder, FIG. 2 is a schematic side view of a wire bonder that is an embodiment of the present invention, and FIGS. 3 to 6 are It is a figure showing the bonding tool attached to the wire bonder which is one example. 1... Wire, 2... Bonding tool, 3...
...Bent part, 4... Hole, 5..., L line, 5a...
Tail part, 6... Bonding tool, 7... Hole, 7a... Conduction hole, 8... Bonding arm, 9...
...Ultrasonic horn, 10... Clamper, 11... Punching head, 12... XY table, 13...
・Package, 14... Pellet, 15... Top surface,
16... Tapered surface, 17... Delivery hole, 18... Concave portion, 19... Fixing portion, 20... Rotating sample stage. 3rd. Figure 4 Figure 5 Figure 6

Claims (1)

【特許請求の範囲】[Claims] １、先端にワイヤをガイドするボンディング用ツールを
備えたアームと、前記アームに連接して超音波振動を供
給するための超音波ホーンと、前記アームの上方に配置
してワイヤを挾持できるクランパと、前記アーム及びク
ランパを上下動させるボンディングヘッドと、前記ボン
ディングヘッドをＸＹ方向に移動するＸＹ駆動体と、被
ボンデイング体を載置する載置台を回転できる機構を有
するワイヤボンダにおいて、ワイヤが屈曲する部分の曲
がり方向のポンディング用ツールの側壁一部を除去し、
かつ前記ポンディング用ツールの先端部に設けた送出孔
のフィード角をワイヤの送り出し時に、ワイヤがたるま
ない角度としたことを特徴とする垂直フィード型ワイヤ
ボンダ。1. An arm equipped with a bonding tool for guiding the wire at its tip, an ultrasonic horn connected to the arm to supply ultrasonic vibrations, and a clamper placed above the arm to clamp the wire. , a wire bonder having a bonding head that moves the arm and the clamper up and down, an XY drive body that moves the bonding head in the XY direction, and a mechanism that can rotate a mounting table on which a bonded object is placed, the part where the wire bends. Remove part of the side wall of the pounding tool in the bending direction,
A vertical feed type wire bonder, characterized in that the feed angle of the feed hole provided at the tip of the bonding tool is set to an angle that prevents the wire from slacking when feeding the wire.
JP58157822A 1983-08-31 1983-08-31 Vertical feed type wire bonder Pending JPS6050931A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58157822A JPS6050931A (en) 1983-08-31 1983-08-31 Vertical feed type wire bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58157822A JPS6050931A (en) 1983-08-31 1983-08-31 Vertical feed type wire bonder

Publications (1)

Publication Number Publication Date
JPS6050931A true JPS6050931A (en) 1985-03-22

Family

ID=15658061

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58157822A Pending JPS6050931A (en) 1983-08-31 1983-08-31 Vertical feed type wire bonder

Country Status (1)

Country Link
JP (1) JPS6050931A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63195730U (en) * 1987-06-05 1988-12-16

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63195730U (en) * 1987-06-05 1988-12-16

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