JPS6040163A - Improved sealing method for electronic parts - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to the relatively quick and void-free construction of electronic components in which a preformed electronic component is placed in a mold cavity and then molding material is introduced by injection molding. The present invention relates to an improved molding material particularly suitable for transparent encapsulation, an encapsulation molding method using the same, and encapsulated products obtained thereby.

(Prior Art) Specific techniques for encapsulating and molding electronic components inside protective synthetic resin materials are well known to those skilled in the art and have been widely practiced (e.g., Plastics Design).
"Forum l5sue (April 1981)
).

Conventionally, encapsulation molding generally uses thermosetting resin materials,
1 of transfer molding and 4.1 extrusion molding which is generally called
It has been implemented depending on the form. For example, epoxy resins (e.g.
Novolak curable epoxy resin systems) have commonly been used for this purpose. It has also been proposed to use thermosetting resins such as unsaturated polyesters and bis-imide polymers as encapsulating molding materials (e.g., U.S. Pat. No. 4,327
, 369; 4,374°080; and 4,390,
596). Such thermosetting materials require cooling before use, tend to require relatively long cycle times when molded, and after molding are heated at high temperatures in a heater until the desired curing of the encapsulating resin is completed. They often have to be cured for long periods of time. The viscosity of an uncured thermoset resin increases as the resin is heated and cured, so once heating begins, the uncured material must be used relatively quickly. With such materials, can you re-scrap? i'i rings are impossible. Also, encapsulated molding materials with natural resin binders generally exhibit a tendency to form burrs and adhere to the mold cavity surface, thus potentially damaging the mold cavity and requiring unskilled work during the molding operation. Sufficient consideration will need to be given to repairs by personnel.

This prevents complete automation of the encapsulation molding process.

Although not used on an industrial scale, certain thermoplastic resins have also been proposed for encapsulation of electronic components. For example, in column 6, lines 18-23 of US Pat. No. 4,327,369, polyvinyl chloride; polyolefins such as low density polyethylene, high density polyethylene, and polypropylene; and polystyrene are exemplified.

Further, in U.S. Pat. No. 4,370,292, polyphenylene sulfide compositions containing phenoxy resins are proposed for encapsulation.

It has conventionally been common practice to include particulate fillers, such as silica or alumina, in encapsulated molding resins, which particularly increase the thermal conductivity of the encapsulated molding material after molding and reduce its coefficient of thermal expansion. It is being said. However, such particulate filler agglomerates, especially when present in high concentrations, greatly vary (ie, increase) the viscosity of the composition during molding.

If the viscosity becomes too high, it becomes difficult to cause the molding material f4 to flow and sufficiently fill the mold. If there are voids in the molded product, the encapsulation molding is considered a failure. If a viscous molding material is made to flow under high pressure, it may damage the precision electronic components that undergo encapsulation molding. Such damage is referred to as "wire sweep" in US Pat. No. 4,374,080. Such scratching or deflection can tear the bond joint or create a harmful short circuit, which can severely stress or destroy the electrical circuit. Furthermore, if an attempt is made to obtain the necessary viscosity as a molding material due to a decrease in the molecular weight of the thermoplastic encapsulant, the resulting molded product will have insufficient a-mechanical properties (eg, brittleness). If the polymeric material contains contaminants inherent in many polymerization processes (e.g., water-extractable halogens or water-extractable ionic substances),
This contaminant can lead to erosion of the encapsulated electronic component and/or adversely affect its operation. Additionally, the polymeric material may be damaged for any reason during the molding operation or during subsequent use of the encapsulated electronic component (e.g., due to a polycondensation reaction).
The tendency to generate substantial gaseous by-products leads to excessive voiding and damage to the encapsulated molding agent composition. In addition to the drawbacks mentioned above, many thermoplastics cannot function reliably for long periods of time at the high temperatures commonly encountered in electronic components, and/or burn out without exposure to flame.
Its security is reduced in this respect.

OBJECTS OF THE INVENTION It is an object of the present invention to provide improved molding materials which are particularly suitable for impermeable encapsulation molding of electronic components.

It is an object of the present invention to provide a method which is particularly suitable for the encapsulation of precision electronic components such as quad or dual in-line integrated circuits.
An object of the present invention is to provide an improved thermoplastic molding material.

It is an object of the present invention to provide an improved thermoplastic molding compound containing a substantial amount of particulate inorganic material that can be encapsulated without damaging precision electronic components, thereby significantly reducing slippage. The result is an encapsulated finished product that exhibits good mechanical, thermal, chemical, and electrical properties and can perform satisfactorily over long periods of time even in the face of adverse environmental conditions.

It is an object of the present invention to provide an improved method for encapsulation molding of electronic components that can be carried out without the need for the time-consuming polymer curing steps commonly practiced in the past.

Another object of the invention is to provide an improved encapsulated molded electronic component.

Furthermore, it is an object of the present invention that the filled resin for encapsulation molding is
Virtually impermeable to water and ultraviolet light, exhibits excellent mechanical properties (e.g., mechanical strength), coefficient of thermal expansion, and thermal conductivity; An improved encapsulated molded electronic component with an alkali metal content of less than 50 ppm, a water extractable halogen content of less than 100 ppm, a flammability rating of V-O in the UL-94 test, and long-term use. The goal is to provide the following.

These and other objects, as well as the scope, principle and applications of the invention, will become apparent to those skilled in the art from the following description.

(Structure of the Invention) The present invention provides: (a) a compound having a weight average molecular weight of about 4,000 to 25,000 and which is substantially unable to undergo further chain growth by heating;
a melt processable polymer capable of forming an anisotropic melt phase, and (b) component (based on the total weight of the molding material capable of reducing the body thermal expansion coefficient of Al and increasing its thermal conductivity); It is a molding material particularly suitable for the impermeable encapsulation of electronic components by injection molding, consisting of a particulate inorganic material substantially uniformly dispersed in the component (al) in an amount of about 40-80% by weight.

The present invention also provides 111 electronic components to be encapsulated in a mold cavity; (b) a molten melt processable polymer capable of forming an anisotropic melt phase in which chain growth is substantially impossible; injecting at an elevated temperature a molding material consisting of a particulate inorganic material substantially uniformly dispersed in component (81) in an amount of about 40 to 80% by weight, based on the total weight of the molding material, to completely filling the cavity; (3) cooling the contents of the mold cavity to solidify the molding material to form an impermeable pancage around the electronic component; and (4) forming the resulting encapsulated molded electronic component. An improved method for impermeable encapsulation molding of electronic components, comprising the steps of: removing the component from the mold cavity.

The present invention further provides (a1 weight average molecular weight of about 4,000 to 25,000
0 and which is capable of forming an anisotropic melt phase in which further chain growth by heating is virtually impossible; and fb) reducing the body thermal expansion coefficient of the acid molecule a); An encapsulant composition comprising: a particulate inorganic material substantially uniformly dispersed in the component al in an amount of about 40-80% by weight, based on the total weight of the composition, capable of increasing thermal conductivity. An improved encapsulation product formed by imperviously encapsulating electronic components inside an object.5 Various electronic components can be effectively encapsulated in an impermeable and substantially void-free pancage according to the present invention. Can be molded.

Such electronic components may be relatively simple electronic devices or relatively complex, and may be considered components for use in larger electronic devices. Typical examples of electronic components that can be encapsulated are transistors, capacitors, relays, diodes, resistors, resistor networks, integrated circuits, and the like. In preferred embodiments, the electronic component is a precision semiconductor device, which may be a bipolar, field effect device, or the like. Although there are many different forms of integrated circuits that can be encapsulated, the relatively small silicon or other semiconductor chips that support cholera typically contain at least two to one
It can have 00 or more points of contact with the outside world. As is well known in the art, a typical integrated circuit buff cage is mounted on a thin metal frame approximately 0.01 inch (0.25 mm) thick, made of copper or copper plated with other metals such as a soot alloy. Manufactured. It can also be a lead frame coated with solder. In this case, the step of soldering or dipping the protruding electrical contacts after encapsulation molding is no longer necessary. The integrated circuit dowel or chip is bonded to the paddle portion of the lead frame, and the electrical connection of the gou or chip to the lead frame is approximately 0.001 mm in diameter.
This is done with a thin wire, usually gold, less than an inch (0.025 mm) thick. The wire is attached by spot welding or other methods to a contact or bonding pad on an integrated circuit board or chip, which is usually a very thin aluminum film.
from the lead frame to the end of the cantilever arm on the lead frame. Accordingly, in a particularly preferred embodiment, the electronic device is a quad or dual in-line integrated circuit device assembled on a flat stamped lead frame having a number of leads projecting outside the encapsulation molding.

For example, the first essential component of the molding material of the present invention for encapsulation molding of a 40-bin lead frame has a relatively low weight average molecular weight of about 4,000 to 25,000 and can be heated at its melt processing temperature. is a melt-processable thermotropic liquid crystalline polymer that is virtually impossible to grow further.

As is known in the polymer art, thermodropink liquid crystalline polymers exhibit optical anisotropy in the molten state. The anisotropy of this polymer melt can be confirmed by conventional polarization techniques using crossed polarizers. More specifically, confirmation of the anisotropy or regularity of the melt phase is determined by the life (L
eitz) Conveniently, this is carried out by observing a sample placed on a Leitz photo stage under a nitrogen atmosphere at a magnification of 40 times using a polarizing microscope. When a sample is forced to flow, the amount of transmitted light changes, but this type of sample exhibits optical anisotropy even in a stationary state. In contrast, typical melt-processable polymers do not transmit light to any substantial degree when examined under static conditions and are essentially isotropic.

Representative types of thermotropic liquid crystalline polymers for use in the present invention include fully aromatic polyesters, aromatic-aliphatic polyesters, fully aromatic poly(ester-amides), aromatic-aliphatic poly( ester-amides), aromatic polyazomethines, aromatic polyester-carbonates, and mixtures thereof. In preferred embodiments, the thermotropic liquid crystalline polyester is a fully aromatic polyester or a fully aromatic poly(ester-amide). A polymer is considered fully aromatic if all components present in the polymer chain contribute at least one aromatic ring.

The thermodropink liquid crystalline polymer also contains naphthalene components, such as 6-oxy-2-naphthoyl components, 2
, 6-cyoxynaphthalene component, or 2,6-dicarboxynaphthalene component in an amount of about 10 mol % or more. A particularly suitable naphthalene component to be included in the thermotropic liquid crystalline polymer is a 6-oxy-2-naphthoyl component of about 10 mol % or more.

Representative fully aromatic polyesters exhibiting thermotropic liquid crystallinity include those disclosed in the following US patents:
3,991,013.3,991,014: 4,06
6.620°4.067.852i 4,075.26
2; 4,0B3,829.4,093,959°4.
118,372; 4,130,545; 4,146
,702.4,153,779°4.156,070;
4,156,365; 4,161,470.4,1
69,933; 4.18L792; 4,1B3,89
5; 4,184,996; 4,188,476°4
．． 201,856; 4,219,461; 4,22
4,433.4,226.970; 4.230.817
; 4,232,143;' 4,232,144.4
,238,598;4.238,599;4.238
,600; 4,242,496i 4,245,08
2゜4.245,084; 4,247,514; 4
,256,624; 4,265,802;4.267
．． 304; 4,269,965.4,279,803
; 4,294,955°4.299,756; 4,
318,841i! 1,335,232.4,337
,190;4.337,191;4,347,349
; 4; 355,134; 4,359,569°4.
360,658; 4,370,466; 4.374
,228; 4,374,261; 4.375,530
and 4,377.681° Typical aromatic-aliphatic polyesters exhibiting thermodropink liquid crystallinity include Jackson+ Jr, +H,F, Kuhf in IL.
USS and T, F., Gray, Jr. +r Self-Reinforced Thermoplastic Polyester X7G-Δ”, American Plastics Industry Association, Reinforced Plastics/Composites Subcommittee, No.
1975, Section 17-D, pages 1-4. Such copolymers are further disclosed in the following documents: IA, J, Jackson, Jr-+ and 11, F, Kuhfuss, rLiquid Crystal Polymers; 1.
Preparation and properties of p-hydroxybenzoic acid copolymers J,
Journalof Polymer 5cier+
ce+ Polymer Chemistry Edi
Ti.

n, Vol, 14. pI), 2043-58(
1976) and commonly assigned U.S. Pat. Nos. 4,318,842 and 4.355.133.

Representative wholly aromatic and aromatic-aliphatic poly(ester-amides) exhibiting thermotropic liquid crystal properties are described in U.S. Pat. No. 4,272,625; 4,330,457;
,339.375; 4,34L6B8; 4,35L
917: 4.351.918 and 4.355,13
It is disclosed in No. 2.

Representative aromatic polyazomethines exhibiting thermodropink liquid crystal properties are disclosed in U.S. Pat. Nos. 4,048,448 and 4.
No. 122.070. Specific examples of such polymers include polytrilo-2-methyl-1,
4-phenylenenitrilomethylidine-1,4-phenylenemethylidine);, polytrilo-2-methyl-1,4
-phenylenenitrilomethylidine-1,4-phenylenemethylidine); and poly trilo 2-10 rho 1
．． 4-phenylenenitrilomethylidine-1,4-phenylenemethylidine).

A typical aromatic polyester-carbonate exhibiting thermodropink liquid crystal properties is disclosed in U.S. Pat. No. 4,107.143.
．． No. 4,284.757; and No. 4,371,660.

The anisotropic melt-forming polymer used in the present invention may optionally be blended with one or more other melt-processable polymers that may or may not form an anisotropic melt phase.
However, the condition is that the resulting blend can form the required anisotropic melt phase exhibiting an appropriate melt viscosity. Representative polymer blends exhibiting thermotropic liquid crystal properties are described in commonly assigned U.S. Pat.
7, 289 and 4,276.397 and U.S. Patent Application Nos. 158,547 (filed June 11, 1980); 165,536 (filed July 3, 1980);
and 165. ．． 532 (filed on July 3, 1980)
has been disclosed.

In preferred embodiments, the melt-processable anisotropic melt-forming polymer exhibits a weight average molecular weight of about 4,000 to 10,000. This weight average molecular weight measurement can be performed by standard gel permeation chromatography.

For example, a typical test involves a 1:1 volume ratio of pentafluorophenol to hexafluoroisopropanol.
Approximately 150 μp of a 0.1% by weight polymer solution dissolved in a solvent consisting of a mixture of
201 type liquid chromatograph), porous silica particles (e.g., DuPont 5E4000.5IEIO00 and 5E100, and 1 star 60 Micr
.

porasi+), as well as a laser light scattering device (e.g. Chromatix I (M
X6) at room temperature into a gel permeation chromatography device. Typical melt-processable anisotropic melt-forming polymers generally exhibit a retention time distribution within the range of 20-50 minutes.

In order for the melt-processable polymer used to be such that further chain growth is virtually impossible upon heating at its melt-processing temperature, the ends of each polymer chain must undergo further polymerization reactions between adjacent polymer chains. It is essential that the functional group is virtually impossible to cause. Such polymers are prepared under an inert atmosphere (e.g. nitrogen or argon)
Even when heated to a temperature of 40° C. for 30 minutes, the weight average molecular weight increases preferably by no more than 15%, more preferably by no more than 10%. Therefore, the polymer does not generate substantially any gaseous by-products that create voids when heated, nor does its melt viscosity increase substantially over time of heating. Thermotropic liquid crystalline polymers produced by conventional conventional methods lack this important feature.

Conventional Thermo1 to Robic liquid crystalline polymers are prepared by carefully reacting the necessary reactive groups, such as those forming ester depletion along the polymer chain, to create a chemical astrological balance between the reactive groups. The traditional method is to form it using this method. When relatively volatile monomers, such as hydroquinone or hydrogynone diacetate, are used as reactants, the loss of this additional member through volatilization due to the polymerization conditions used is anticipated and the loss of one member is compensated for. Therefore, this monomer may be supplied in excess. When various ester-forming monomers are used and reacted with each other under stoichiometrically balanced conditions, a polymer is produced in which the necessary ester-forming groups are randomly present at the ends of the polymer chain. These end groups can be subsequently thermally processed (e.g., unless end-capped in another reaction step).
(injection molding, extrusion, kneading, etc.), the end groups tend to react with each other and grow the length of the polymer chain.

Such polymers can be thermally processed to increase their molecular weight in the solid state, e.g., US Pat. No. 3,975,487:
4,1B3,895; and 4,2117. '514
Disclosed in the issue. When polymerization by condensation reaction continues,
The production of relatively low molecular weight by-products, i.e., gas generation, may occur, and the melt viscosity of the resulting polymer may increase significantly when it is subsequently melt processed. In the present invention, it is essential that such gas generation does not substantially occur during encapsulation molding. This ensures the formation of an impermeable and substantially void-free product. Also,
A relatively constant melt viscosity is also ensured, thereby improving the uniformity and quality of the resulting encapsulated electronic device.

One viable synthetic method for producing such polymers is to end-cap the polymer chain once the melt-processable polymer that forms the anisotropic melt phase has reached a desired molecular weight during its formation by a polymerization reaction. There is a method of appropriately capping the terminal end of the agent to substantially prevent further chain elongation. For example, I-functional end cap reactants can be used.

According to a particularly preferred embodiment of the method of the invention, the formation of the melt-processable polymer capable of forming an anisotropic melt phase is carried out according to the method described in Japanese Patent Application No. 1983-1983.

More specifically, when the melt-processable polymer is a polyester that may optionally contain amide bonds,
This polyester has the following (al to (fl) (in each formula, the total means a divalent group consisting of at least one aromatic ring)
: j (al -o-A r -C-1 (b)-〇-Ar-〇-1 O 111 (C)-C-Ar-C-1 (d) -Y-A r-Z -1 ( In the formula, Y is 0, NH or NR, Z is NH or NR
(wherein, Z means NH or NR, R is an alkyl group or an aryl group having 1 to 6 carbon atoms), (el -z -A r -C-1 (wherein, Z means NH or NR, and R is a carbon number 1~
ester-forming and optionally amide-forming monomers such as to form a polymer having repeating components selected from the group consisting of: A polyester obtained by polymerization reaction and optionally having an amide bond, provided that about 1 to 5 mol%, preferably about 1 to 4 mol% excess aromatic dicarboxylic acid is added during the polymerization reaction. A monomer and/or an esterified derivative thereof is fed to the polymerization zone, and this excess monomer imparts dicarboxyaryl units to the interior of the polymer chains of the resulting polymer during the polymerization reaction, and also converts the ends of the polymer chains into carboxylic acid terminals. group and/or its esterified derivative, and the polymer chain has reached the required molecular weight by depletion of other polymers present in the polymerization zone, so that the resulting polymer product cannot be further heated by subsequent heating. Chain growth has become virtually impossible.

Any polyester-forming monomer capable of forming a polyester exhibiting an optically anisotropic melt phase can be used in the above-described method. Optionally, a 7-mid-forming monomer may also be used, in which case a poly(ester-amide) exhibiting an optically anisotropic melt phase is formed.

A small amount of carbonate-1/forming compound may also be included as long as it does not adversely affect the ability of the resulting polyester to exhibit an optically anisotropic melt phase. In a preferred embodiment, the resulting polymer is fully aromatic in the sense that the gold component present within the polymer provides at least one aromatic ring.

As previously mentioned, one of the monomers that can be used to form polyesters in the aforementioned manner is a repeating component of the formula %, where Ar is a divalent group consisting of at least one aromatic ring. It is a monomer that contributes to the polymer chain. In preferred embodiments, Ar is 1,4-phenylene or 2,6-naphthalene. Thus, in this case the repeating component will be a 4-oxyhendiyl component or a 6-oxy-2-naphthoyl component. This polyester may contain two or more different repeating components (for example, a combination of 1,4-phenylene and 2°6-naphthalene) each having a different Ar and each component satisfying the above-mentioned format. .

Such monomers are naturally stoichiometrically balanced because they contain two types of ester-forming reactive groups in exactly the same order. The aromatic ring present in Ar may have at least a portion of the hydrogen atoms bonded to the ring substituted. This optional substituent can be selected from C1-C4 alkyl groups, C1-4 alkoxy groups, halogens (eg, Cβ, Br, I), phenyl, and combinations thereof. Particularly preferred ingredients are:
4-Hydroxybenzoic acid and 6-hydroxybenzoic acid 2-
It can be derived from naph-1-technical acid. Typical ring-substituted components include 2-diol:l-4-hydroxybenzoic acid, 2,3-dichloro-4-hydroxybenzoic acid, 3,5-dichloro-4-hydroxybenzoic acid, 2, 5
-dichloro-4-hydroxybenzoic acid, 3-bromo-4
-Hydroxybenzoic acid, 3-methyl-4-hydroxybenzoic acid, 3.5-dimethyl-4-hydroxybenzoic acid,
2,6-dimethyl-4-hydroxybenzoic acid, 3-methoxy-4-hydroxybenzoic acid, 3,5-dimethyl-4
-Hydroxybenzoic acid, 3-phenyl-4-hydroxybenzoic acid, 2-phenyl-4-hydroxybenzoic acid, 6
-Hydroxy-5-chloro-2-naphthoic acid, 6-hydroxy-5-methyl-2-naphthoic acid, 6-hydroxy-5-meth1.;1-cy2-naphthoic acid, 6-hydroxy-4,7 -dichloro-2-chloro-naphthoic acid, etc. Other non-ring substituted components include 1fFb4 from 3-hydroxybenzoic acid and 4-hydroxybiphenyl-4'-carboxylic acid.

As mentioned above, another monomer that can be used to form the polyester used in the present invention is a repeating group represented by the formula % (where Ar is a divalent group consisting of at least one aromatic ring). It is a monomer that imparts to the polymer chain. Representative components include: In preferred embodiments, Ar is 1,4-phenylene, 2,6-naphthalene or 4,4'-biphenyl. This polyester may contain two or more different repeating components each having a different Ar and each component satisfying the above general formula. As explained with respect to the first mentioned component, the aromatic ring in Ar may optionally have at least some of the hydrogen atoms bonded thereto substituted. Examples of ring-substituted repeating moieties are moieties derived from phenylhydroquinone, methylhydroquinone, and chlorohydroquinone. Particularly preferred components are simply hydroquinone, 2,6-cyhydrokidinaphthalene, and 4,
It can be derived from 4'-biphenol.

As mentioned above, other monomers that can be used to form the polyesters used in the present invention include the formula % (where Ar is composed of at least one aromatic ring).
It is. Typical components include: In a preferred embodiment, Ar is 1,4-phenylene or 2°6
- It is naphthalene. This polyester is each
It may contain two or more different repeating components, each of which has a different value and each component satisfies the above general formula. As explained with respect to the first mentioned component, the aromatic ring in Ar may optionally have at least some of the hydrogen atoms bonded thereto substituted. An example of a component containing ring substitution is one derived from phenyl-substituted terephthalic acid. Particularly preferred components can be derived solely from terephthalic acid and 2,6-naphthalene dicarboxylic acid.

As already mentioned, other monomers that can be used to form the polyester used in the present invention are those having the formula % (wherein Ar is a divalent group consisting of at least one aromatic ring, Y is 0, NH or NR, Z means NH or NR, and R is an alkyl group having 1 to 6 carbon atoms or aryl W) A repeating component represented by the following formula is added to the polymer chain. R is preferably a straight alkyl group having 1 to G carbon atoms, and more preferably a methyl group. This addition will provide an amide bond to the polymer chain. In a preferred embodiment, Ar is 1,4-phenylene. This polyester may contain two or more different repeating components each having a different Ar and each component satisfying the above general formula. As explained with respect to the first mentioned component, the aromatic ring in Ar may optionally have at least some of the hydrogen atoms attached to it substituted. Examples of derivatives of this component include p-aminophenol, p-N-methylaminophenol, p-phenylenediamine, N-methyl-p-phenylenediamine, N,
N'-dimethyl-p-phenylenediamine, m-aminophenol, 3-methyl-4-aminephenol, 2-
Chloro-4-aminophenol, 4-amino-1-naphthol, 4-amino-4'-hydroxybiphenyl, 4
-amino-4''-hydroxydiphenyl ether, 4-
Amino-4''-hydroxydiphenylmethane, 4-amino-4''-hydroxydiphenylethane, 4-amino-
4′-Hydroxydiphenylsulfone, 4-amino-4
”-Hydroxydiphenylsulfide and 4,4゛-diaminophenylsulfide (thiodianiline), 4.4
Examples include "-diaminodiphenylsulfone, 2,5-diaminotoluene, 4,4'-ethylene dianiline, 4,4'-diaminodiphenoxyecone, etc. Particularly preferred components are those derived from p-aminophenol. I can do it.

As already mentioned, further monomers that can be used to form the polyester used in the present invention are of the formula % (where Ar is a divalent group consisting of at least one aromatic ring, and Z is NH or NR, where R has 1 to 6 carbon atoms
A monomer that imparts a repeating component (which is an alkyl or aryl group) to a polymer chain. R is preferably a straight chain alkyl group having 1 to 6 carbon atoms, more preferably a methyl group. This monomer provides an amide linkage to the polymer chain. Monomers of this type are inherently stoichiometrically balanced because they contain exactly the same amount of ester-forming and amide-forming reactive groups. In a preferred embodiment, Ar is 1,4-phenylene. This polyester may contain two or more different repeating components each having a different Ar and each component satisfying the above general formula. As explained with respect to the first mentioned component, the aromatic ring in Ar may optionally have at least some of the hydrogen atoms bonded thereto substituted. Examples of hexamers from which this component is derived include p-aminobenzoic acid, p-N-methylaminobenzoic acid, m-aminobenzoic acid, 3-medy-4-aminobenzoic acid, 2-chloro-4-aminobenzoic acid, Benzoic acid, 4-
Amino-1-naphthoic acid, 4--N-methylamino-1
-naphthoic acid, 4-amino-4'-carboxydiphenyl, 4-amino-4'-carboxydiphenyl ether, 4-amino-4'-carboxydiphenyl sulfone, 4-amino-4'-carboxydiphenyl sulfide, Examples include p-aminocinnamic acid. A particularly preferred component is p
- can be derived from aminobenzoic acid.

The conventionally known sheath-tropic liquid crystalline polyesters as listed above can be produced in a thermally stable modified form by the method described above.

The very superior polyesters which can be produced by modified transformation according to the method described above are disclosed in commonly assigned U.S. Pat.
16L470; 4,184,996; 4,219,
461; 4,256.624; 4.330.451
and No. 4,351,917 and commonly assigned U.S. Patent Application No. 485,820, filed April 18, 1983. U.S. Patent No. 4.3
30. ．． The thermotropinoc liquid crystalline polyesters of No. 157 and No. 4,351,917 further contain an amide bond.

According to the above-described method utilized in the present invention, all ester-forming and amide-forming monomers are removed during polymerization from about 1 to 5 mole % of aromatic dicarboxylic acid monomers and/or esterified derivatives thereof, preferably about A 1-4 mole % excess is carefully weighed and added to the reaction zone.

In a preferred embodiment, the aromatic dicarboxylic acid is added during polymerization to about 2.
It is present in an amount of 0 to 4.2 mole percent excess. This molar excess of aromatic dicarboxylic acid monomer (and/or its esterified derivative) is combined with the total amount of the carboxylic acid reactive monomer (and/or its esterified derivative) and the hydroxyl reactive group (and/or its esterified derivative). If present in the polymerization reaction, the monomer is present in excess compared to the amount of the remaining monomer, which is in stoichiometric balance with the total amount of the added amine-reactive group (and/or its amine-F derivative). This is essential.

Preferred aromatic dicarboxylic acid monomers present in molar excess as described above include terphucuric acid, isophthalic acid, 2,
These include 6-naphthalene dicarboxylic acid, 2,7-naphthalene dicarboxylic acid, 1,4-naphthalene dicarboxylic acid, 2-phenylterephthalic acid, and 4,4'-bibenzoic acid.

According to the aforementioned method, during the polymerization reaction, due to the dicarboxylic acid units derived from the aromatic dicarboxylic acid monomers and/or their esterified derivatives present in said molar excess, this unit is present within the polymer chain of the resulting polymer. At the same time, a carboxylic acid group and/or its esterified derivative comes to the end of the polymer chain. As the polymerization reaction progresses, other monomers present in the polymerization zone are completely consumed. The average polymer chain length obtained is directly controlled by the molar excess of aromatic dicarboxylic acid monomer and/or esterified derivative thereof fed to the polymerization zone during the polymerization reaction.

The larger the molar excess of the dicarboxylic acid monomer and/or its esterified derivative within the above range, the shorter the average polymer chain length. Conversely, the smaller the molar excess of the dicarboxylic acid monomer and/or its esterified derivative within the above range, the longer the average polymer chain length. Thus, by providing a constant molar excess by the method described above, a polymer product of a given average chain length is formed. In many cases, it is convenient to ascertain such average chain length by the logarithmic viscosity number of the resulting polymer as well as its weight average molecular weight. In any case, the thermotro pink liquid crystalline polyester polymer produced! At the end of the chain there is a carboxylic acid end group and/or its esterified derivative. This is because even when heated to melt processing temperatures, further polymer i!I! chain growth due to polymerization reactions between adjacent molecules is virtually impossible.

Such polyesters can be produced by a variety of ester-forming methods that involve reacting organic monomer compounds with functional groups that form the necessary repeating components by condensation reactions. For example, the functional group of an organic monomer compound may be a carboxylic acid group, a hydro-dosyl group, an ester group (eg, an acyloxy group), an acid halide, or the like. The organic monomer compounds can be reacted without the presence of a heat exchange fluid by melt acidolysis. In this method, an organic monomer compound is first heated to form a solution in which most of the reactants are molten. At this time, some reactants, such as terephthalic acid, initially remain somewhat solid. Small amounts of terephthalic acid can be dissolved under these conditions. The polymer product is optionally suspended in solution as solid polymer particles. In the final stage of the condensation reaction, a vacuum may be applied to remove by-produced volatile substances (eg, acetic acid or water) or to accelerate the polymerization reaction.

Commonly assigned U.S. Pat. No. 4,067.852 describes a slurry polymerization process that can be utilized to produce the polyesters used in the present invention, in which the solid product is Obtained in suspension in a medium.

Melt Acidolysis Method or U.S. Patent No. 4,067.85
Whichever slurry method No. 2 is used, it is preferable to esterify in advance those which would contain hydroxyl groups and/or amine groups if not protected, among the 1,000-year-old reactants from which the polymer components are derived. For example, these are subjected to the reaction as lower acyl esters having about 2 to 4 carbon atoms.

More preferably, acetate esters of such unprotected monomers containing hydroxyl and/or amine groups are used. Examples of such protected reactants are 6
-aceto-2-naphthoic acid, 4-acetoxobenzoic acid, hydroquinone diacetate, 4,4°-biphenol diacetate, and the like.

Furthermore, a monomer that imparts carboxyaryl units to the resulting polymer chain, such as an aromatic dicarboxylic acid monomer used in molar excess, may also be subjected to the reaction in an esterified form at the start of the reaction. See, for example, U.S. Pat. No. 4,333.
No. 907, such monomers are reacted with aromatic monohydroxy compounds such as phenol, m-cresol, p-cresol, and the like. Examples of such esterification reactants are p-hydroxyan, phenyl fragrant, and diphenyl terephthalate. In preferred embodiments, the carboxylic acid groups of the reactants are not esterified.

Melt Acidolysis Method or U.S. Patent No. 4,067.85
Representative catalysts that may optionally be used in any of the No. 2 slurry processes include dialkyltin oxides (e.g., dibutyltin oxide), diaryltin oxides, titanium dioxide, alkoxytitanium silicates, titanium alkoxides,
These include alkali and alkaline earth metal salts of carboxylic acids, Lewis acids (eg, BF3), gaseous acid catalysts such as hydrogen halides (eg, HCl), and the like. The amount of catalyst used is generally about 0.001 to 1 weight percent, based on the total weight of the monomers, and about 0.01 to 0.2 weight percent.

U.S. Pat. No. 4,393,191, assigned to the present applicant;
The polymerization methods of U.S. Pat.

In a particularly preferred embodiment, when the melt-processable polymer is a modified wholly aromatic polyester of U.S. Pat. No. 4,161,470, the modified polyester has the following woody components ■about 20
It is obtained by polymerizing an ester-forming monomer in a polymerization zone to produce a polyester containing ~45 mol% and component (2) in an amount of about 55 to 85 mol%,
During the polymerization reaction, about 1 to 5 mol% excess of aromatic dicarboxylic acid monomer is present in the polymerization zone, and this excess monomer creates a dicarboxyaryl potential within the polymer chain of the formed polymer during the polymerization reaction. is added, and the end of the polymer chain becomes a carboxylic acid terminal group,
Because the polymer chains have reached the required molecular weight by depletion of other monomers present in the polymerization zone, the resulting wholly aromatic polyester product is virtually incapable of further chain growth upon subsequent heating. It has become.

In another particularly preferred embodiment, when the melt-processable polymer is a modified fully aromatic polyester further having an amide bond of U.S. Pat. No. 4,330,457,
This modified polyester has the following wood components: ■, ■, ■
and optionally ■ (wherein each symbol Ar is at least 1
divalent group consisting of two aromatic rings): m: -Y-Ar-Z - (wherein Y is O, NH or NR, Z is NH or NR
(where R is an alkyl group having 1 to 6 carbon atoms or an aryl group), IV: -0-Ar-0-, where component I is about 40 to 80 mol% and component (II) is about 5% by mole.
~30 mol%, 5 to 30 mol% of component (I), and component I
Vl]O to 25 mol% of poly(ester-
In the polymerization zone, ester-forming and amide-forming reactive monomers such as amide) can be polymerized, with an excess of about 1 to 5 mol % of aromatic dicarboxylic acid monomers being added during the polymerization reaction. is present in the polymerization zone,
This excess monomer imparts dicarboxyaryl units within the polymer chains of the resulting polymer during the polymerization reaction, and also provides carboxylic acid end groups at the ends of the polymer chains, allowing the polymer chains to absorb other monomers present in the polymerization zone. Having reached the required molecular weight through attrition, the resulting wholly aromatic poly(ester-amide) product is virtually incapable of further chain growth upon subsequent heating.

When a melt-processable polymer capable of forming an anisotropic melt phase is formed by the method of the aforementioned U.S. patent application Ser. No. 517,865, the polymer has a 3.0 dl18 or less, especially about 0.8-3.0 d
17g of logarithmic viscosity (0.0% for pentafluorophenol).
It is preferable to show a value measured at 60° C. after melting at a concentration of 1% by weight. However, not all polymer products are sufficiently soluble in pentafluorophenol to perform this logarithmic viscosity measurement.

Other representative methods for forming melt processable polymers capable of forming an anisotropic melt phase that can be used in the method of the present invention, in which further chain growth by heating is substantially impossible, include the present method. US Patent Application Box 595,000 assigned to applicant
No. 4 (filed March 29, 1984) and U.S. Patent Application No. 61L299 (filed May 17, 1984).

The melt-processable polymers used in the present invention are prepared at melt-processing temperatures (e.g., 300°C, 310°C,
°C, 320 °C or 330 °C) and shear rate 1005
Preferably, it exhibits a melt viscosity of about 30 to 300 poise in ec-'. Melt viscosity measurements can be performed using standard measurement techniques using an Instron capillary rheometer equipped with a 4 inch (10 ports) long, 30 mil (762 micron) internal diameter capillary tube. Alternatively, the melt viscosity may be measured using a rheometric mass spectrometer in a steady shear mode using parallel plates at a shear rate of 10 sec-'. The melt-processable polymer is in a completely molten state at the time of melt viscosity measurement. When measuring melt viscosity at 300°C, a more homogeneous melt can be obtained by first heating the polymer to about 320°C and then cooling it to 300°C, which is the melt viscosity measurement temperature.

Regardless of the route of synthesis, the melt-processable polymers used in the present invention may be subjected to the necessary transformation at a temperature within the range of about 200-480°C, particularly about 200-350°C, prior to mixing with the particulate inorganic material. Preferably, it is capable of forming an orthotropic melt phase. The melt-processable polymer should be free of harmful contaminants, preferably essentially non-flammable, and sensitive to light (particularly ultraviolet light), solvents, chemicals, and the formation and assembly of encapsulated electronic components. and resistance to the environments encountered during long-term use.

The second essential component of the molding material of the present invention is a particulate inorganic material (ie, an inorganic filler). The particulate inorganic material 1 is substantially uniformly dispersed in the melt-processable polymer and reduces the coefficient of body thermal expansion of the melt-processable polymer (i.e., a composition that does not include the particulate inorganic material). It is possible to increase the thermal conductivity. The presence of particulate inorganic material also serves to make the coefficient of thermal expansion of the final product more isotropic in nature. The particulate material may be selected from a variety of solid inorganic materials such as silicon dioxide, talc, wollastonite, alumina, cordierite, etc., although certain forms of silicon dioxide are preferred. Preferably, the particulate inorganic material has a weight average particle size of about 1 to 50 microns, with at least 99% by weight of the particles having 100 micron ends. A suitable particle size analyzer for this particle size measurement is available from Micrometrics In, Norcross, Georgia, USA.
(formerly known as the crotrac particle size analyzer). Moreover, it is preferable that the particulate inorganic material has substantially the same size in all directions so that there is no possibility that anisotropy in the coefficient of thermal expansion will occur due to particles aligned in the same direction after molding. Therefore, it is preferable that the average aspect ratio of the particulate inorganic material is 2:1 or less as measured by an optical microscope.

It is essential that the particulate inorganic material does not contain harmful amounts of contaminants that may be harmful to or interfere with the operation of electronic components, and preferably has a coefficient of thermal expansion as low as possible.

Therefore, quartz glass is a particularly preferred particulate inorganic material for use in the present invention. As is well known, fused silica consists of relatively pure silicon dioxide which has been converted from its normal crystalline state to an amorphous state using the very high temperatures of electric arc melting. This particulate inorganic material is also called fused silica or fused quartz. The resulting molten particles are crushed to a desired particle size after their formation. This material has virtually zero body thermal expansion and does not develop internal stresses even when subjected to rapid and extreme temperature changes. Such fused silica glass is commercially available and manufactured by IIarbison-Walker Ref, Pisoppag, Pennsylvania, USA.
It is available under the trade name GP71 from Ractories, Inc. If desired, to further increase thermal conductivity,
Small amounts of crystalline silica may be incorporated into the fused silica. However, the addition of crystalline silica tends to increase the body thermal expansion coefficient of the entire composition to some extent. If the electronic component to be encapsulated is not particularly fragile, a fibrous reinforcing material such as discontinuous glass fiber may be blended with the particulate inorganic material. Furthermore, colorants, additives, fixing agents, mold release agents, etc. may be added as long as they do not have a harmful effect on the molding material.

In a preferred embodiment, the surface of the particulate inorganic material is further provided with a coating that increases its miscibility with the melt-processable polymer capable of forming an anisotropic melt phase. The coating used must not be capable of damaging the electronic components or interfering with their operation during use. Typical cladding materials are 8187 and 811, respectively, from Union Carbide.
These are silanes such as T-glycidoxypropyltrimethoxysilane and T-aminopropyltriethoxysilane, which are commercially available as 00. This silane compound is
Standard coating techniques for inorganic fillers allow approximately 0.5 to 1.
An amount of 5% by weight can be applied to particulate inorganic material as a surface coating. Organic diternate-based surface coatings may similarly be coated on inorganic particles prior to mixing with melt-processable polymeric materials capable of forming an anisotropic melt phase.

According to the invention, the particulate inorganic material is present in an amount of about 40 to 80% by weight, in particular about 50 to 75% by weight (e.g. about 55 to 70% by weight), based on the total weight of the molding material. It is incorporated into a melt-processable polymer capable of forming an anisotropic melt phase and is distributed substantially uniformly therein. This substantially uniform dispersion can be achieved by known techniques of forcing particulate material within a moving molten polymeric material. - Known melt compounding techniques using a screw extruder, a co-rotating twin-screw extruder, a counter-rotating twin-screw extruder, a kneader, etc. can be employed. for example,
Herner & Co., Umsee, New Chassis, USA
A co-rotating twin screw extruder from Pfleiderer can be used.

When using such equipment, the preformed polymer pellets and particulate inorganic material need only be fed to the extruder as a dry blend and heated above the melting temperature of the polymeric material. To facilitate compounding, it is advantageous to arrange the kneading block within the screw. When introducing particulate inorganic materials at a high blending ratio, multiple passes (e.g. 2
A blending process (more than one pass) may be employed, with only a portion of the particulate inorganic material being introduced in the first pass.

Alternatively, the preparation of blends of anisotropic melt-forming polymers and particulate inorganic materials can be carried out using Buss-C, manufactured by Buss-Condux, Inc., Elk Grove, Billenoge, IL, USA.
Using a compounding extruder such as an ondux kneader or other extruder that allows downstream addition of particles, the total amount of inorganic material can be obtained by feeding the particles to one or more downstream feed ports. It can also be carried out by adding it to the molten polymer. In this method, the polymer is fed to the back of the extruder, melted, and then blended with the particles. In either type of compounding method, the resulting molding material can be pelletized using either the strand method or the Guyface method. In the strand method, a strand of the obtained molding material is extruded and pelletized after passing through an air cooling section. The melt extruded strand may be conveyed between the extruder and the pelletizing operation on a conveyor. When using a gou face cutter, the molding material may be cut into pellets at the front of the gou, and the pellets may then be dropped into water and cooled.

The resulting molding material can be injection molded at temperatures generally within the range of about 250-390<0>C. In addition, the water-extractable alkali metals (e.g., Na and K) of the obtained molding material
content of less than 50 ppm, water extractable halogens (e.g.
Cj! , Br, F) is preferably less than 100 ppm. Therefore, there are no charged impurities that would interfere with the precise electrical balance often required during the operation of certain encapsulated electronic components. Determination of water-extractable alkali metal and halogen content 1 is carried out by SIE Old Standards, Volume 4, Packaging Committee, published by Semiconductor Equipment and Materials Institute (SEMI), “Recommended Water Extraction Methods for Ionic Species J. G5.3) (1983).

To carry out encapsulation molding of electronic components in accordance with the present invention, preformed electronic components are placed into a mold cavity in exactly the same manner as conventional injection packaging techniques (including transfer molding) for electronic components. Place (i.e., fix). If desired, a large number of electronic components can be placed at once in a multi-cavity mold in which electronic components are individually encapsulated and molded one by one.

Next, the hot molding material of the present invention is injected with the melt-processable polymer in a molten state and the particulate inorganic material dispersed therein to completely fill the inside of the mold cavity containing the electronic component. Fulfill. However, certain parts of electronic components,
For example, electrical contacts or the like may protrude outside the part surrounded by the molding compound.

When the liquid crystalline polymer of the molding material is injected into the mold cavity, its molecules, despite their relatively low molecular weight, are localized to give ultimate strength and stiffness to the encapsulant. It is believed that the molten polymer exhibits an inherent tendency to orient itself. This orientation readily occurs as a result of the flow of the molten polymer. This local orientation is caused by the very long relaxation times of such polymers, which hinder solidification. Therefore, the mechanical properties of the final product are advantageously influenced by the thermodynamic nature of the molten polymer in the molding compound.

The molding material of the present invention has a shear rate of 10 at the injection molding temperature.
It is preferred to exhibit a melt viscosity within the range of about 300 to 2500 poise at
Preferably it exhibits a melt viscosity within the range of -1500 poise.

Another method for evaluating the moldability of molding materials is the ASTM
03123-72, except that the test method is modified as follows:
A conventional injection molding machine and a semicircular spiral flow mold with a diameter of 1/4 inch (6°41) and a flow length of 50 inches (127c+n) were used, the mold temperature was 100℃, and the injection pressure was 8000rsi (560kg). /ctA),
Typical flow lengths of molten polymer obtained under these conditions are usually about 10 to 45 inches (25 to 114 (J)
is within the range of Polymers with long flow lengths are suitable for encapsulation molding of precision electronic components.

The rate at which the remaining space in the mold cavity is filled with molding compound depends on the dimensions and structural characteristics of the electronic component. Mold fill times of about 2-15 seconds are generally employed within a range of total molding cycle times of less than 1 minute (eg, about 15-50 seconds). Relatively sensitive electronic components, such as integrated circuit devices, often require substantially slower fill rates than more rugged electronic components, such as single-function one-way disks. Be careful not to deform any part of the electronic component that is exposed to the encapsulated acid to the extent that it causes harm. In either case, it is preferable to select the minimum mold cavity filling time within a known range that will not damage the electronic component.

In order to facilitate the complete filling of the mold cavity with the molding material and thus the performance of the impermeable encapsulation, the mold itself is preferably also at a high temperature during filling. As a result, excessive cooling of the molding material before it completely fills the mold cavity is prevented. The selection of the mold temperature and the temperature of the molding material in the mold filling process depends on the melting temperature of the melt-processable polymer that can form an anisotropic melt phase and the melt viscosity that can easily achieve complete filling of the mold cavity. depends on the temperature required to obtain . However, this melt viscosity depends on the particle size distribution of the particulate inorganic material dispersed in the molding material and the weight average molecular weight of the melt-processable polymer. Determination of optimal conditions within the above parameters for a specific encapsulation molding operation can be performed by routine experimentation and is dependent on geometric factors related to the design of the mold used (e.g. gate dimensions, runner length and dimensions, etc.) Depends on. Generally, the mold cavity is at a temperature of about 1'00 to 250°C, and the introduction of molding material into the mold cavity is carried out at a temperature of about 25°C.
0-390℃ and pressure about 100-1000psi
(7°0 to 70 kB/c self).

Typical equipment for performing encapsulation molding includes (11 mold clamping force 35 or 40 US tons (31,8 or 36.3 t)
) of 1 or 2 ounces (56 g) of 8 rbu
rB 220 screw injection molding machine, and (2) 5 oz (142 g) with 80 US tons (73 kg) clamping force.
We have a Windson II5I80 type screw injection molding machine. Advantageously, a process controller is used to provide positive feedback positioning control of the injection molding ram, thereby controlling the filling rate to account for the relatively low pressure injections commonly employed.

Shorter runners and larger gates may be used to reduce inlet pressure and ease the molding process.

After the mold is completely filled with the molding material, the molding material solidifies within the mold and forms an impermeable package around the predetermined portion of the electronic component. The polymer used is thermally stable and free of a substantial degree of generation of volatile void-forming components during the molding operation, as would be observed if substantial further polymerization or decomposition reactions occurred. There isn't. The melt viscosity of the molding material remains essentially constant. As a result, an impermeable encapsulation is ensured. Therefore, there is no need for a polymer curing step following polymer assimilation within the mold cavity.

The molding material of the present invention after injection molding preferably has a molecular weight of 60 to 1
150 xto-6cm3/cm3- at 10°C
℃ or less, most preferably 90×10 −bcm′/cm″−”C or less under the same conditions.

Most electronic devices generate a lot of heat during use, and if the stress generated by the generated heat is severe, cracks may occur in the encapsulated molded product, which was originally impermeable.
Therefore, it is important that the molding material of the present invention has a low coefficient of thermal expansion. The stress may also cause bonding wires to pull out of the integrated circuit band, wire pounds to fail from fatigue, or circuit conductors to become loose and detach from the surface of the integrated circuit chip. The value of the body thermal expansion coefficient decreases as the amount of particulate inorganic material blended in the molding material increases.

The particulate inorganic material also serves to make the coefficient of thermal expansion of the polymer material more isotropic in nature. The measurement of the body thermal expansion coefficient is carried out by the above-mentioned US SEMI Standard, Volume 4, Packaging Committee, [Standard J (G5.
Section 4) (1983).

The molding material of the present invention after injection molding exhibits good thermal expansion over a relatively wide temperature range (eg -40°C to +150°C). These properties are substantially superior to those exhibited by epoxy resins, which exhibit large thermal expansion above their glass transition temperature.

The molding material after injection molding is 10XIO-' cal-a
m/sec-cm2-'C or more, especially 13X10-'
It is preferable to exhibit a thermal conductivity of cal-cm/sec-cm"-"C or higher. High temperatures can have a negative effect on the performance of some electronic components, so words with such a high heat transfer coefficient are important. For example, heat is known to slow down the operation of integrated circuits. Therefore, the generated heat must be effectively dissipated. The larger the amount of particulate inorganic material blended in the molding material, the higher the thermal conductivity value obtained. Thermal conductivity measurements can be performed using standard methods that are rarely used in industry.

It is also preferred that the molding material of the invention exhibits a V-O flammability rating according to the UL-94 test after injection molding. When performing this UL-94 test, the molded article must be at least 30
It must be mil (0.76 mm) thick. The molding material after molding also preferably exhibits good hydrolytic stability as confirmed by retaining at least 75% of its flexural strength after 200 hours of immersion in water at 110°C. Further, it is preferable that the electrical properties of the encapsulated electronic component do not change after being heated at 85° C. for 1000 hours in air with a relative humidity of 85%.

The encapsulation molding made possible by the present invention is substantially void-free and impermeable in the sense that the electronic component can be completely protected from liquids and gases encountered during use. .

Moisture cannot penetrate into the device body or migrate into the interior of the device due to capillary action along the leads outside the encapsulation molding. Electronic components according to the invention are also well protected from UV radiation.

Mechanical properties of molding material after injection molding (including bending strength)
is sufficient to withstand the mechanical stresses experienced during trimming and forming, as well as during assembly of the device into the finished assembly. The encapsulation molded product can be formed into a highly consistent geometry, allowing it to be automatically inserted into a socket or printed circuit board without damage.

The mechanical properties of the molding material of the present invention after injection molding are further improved by removing unnecessary metal trimming from the lead frame and/or
Alternatively, it can withstand the right angle flange of the lead protruding outward from the encapsulation molding part.

Therefore, even if stress is applied to the end of the encapsulation molded part of the electronic component, it effectively withstands the stress without creating micro-cranks that impair the useful life of the electronic component. Encapsulation with the encapsulating compound of the present invention ensures reliable long-term performance of electronic components.

The following examples are given as specific examples of the present invention.

However, it is clear that the invention is not limited to the details shown in the examples.

The melt-processable polymer capable of forming an anisotropic melt phase used in this example was prepared according to Example 2 of Japanese Patent Application No. 1982-1.

More specifically, a 50 gallon (1891) stainless steel reactor equipped with a sealed horseshoe stirrer, gas inlet tube, and distillation column with condenser was charged with the following materials at room temperature (i.e., approximately 25°C): (a) 115 Bond (52,2 kg> 6-acetoxy-2-naphthoic acid (0,50 Bond mole 227 moles), (bl 130.2 Bond (59,97 kg)
of 4-acetoxybenzoic acid (0,745 bond moles = 3
38 moles), (C14,46 bond (2,02 kg) of terephthalic acid (0,0268 lb moles = 12.2 moles), and +d16.98 grams of potassium acetate catalyst.

By calculation, the terephthalic acid monomer was introduced into the reactor in a molar excess of 2.15%. 6-acetoxy-2-
Both reactants, naphthoic acid and 4-acetoxybenzoic acid, supply the same number of carboxylic acid groups and acetoxy convexes, which are the required ester-forming reactive groups, so they are inherently stoichiometrically balanced within their molecules. ing. therefore,
The terephthalic acid monomer is the only aromatic dicarboxylic acid monomer, and this monomer allows the ester-forming carboxylic acid groups to reach a stoichiometric equilibrium beyond the stoichiometric balance established with respect to the remaining 1,000 nomers present in the polymerization system. This means that they were supplied in excess quantity.

The reactor and its contents were completely purged of oxygen by vacuuming and refilling with nitrogen three times, then hot oil flow to the reactor jacket was started to melt the reactants. . The contents of the reactor were heated to 208°C and held at this temperature for 118 minutes.

The contents of the reactor were then further heated to temperatures of 8213°C, 220°C with measurements every 15 minutes.
C1234℃, 246℃, 259℃, 273℃, 290
℃ and 303°C0 further temperature to 325℃ in 47 minutes
I raised it to

When the temperature of the reactant reached 325° C. according to the above heating schedule, the reactant was reduced in pressure to 8 mm 1 lH and heating was continued. This vacuum heating lasted for 90 minutes. Nitrogen is then introduced to break the vacuum and the molten polymer product is expelled through a 178-inch (3.2 mm) three-hole gouge submerged in water to form solidified strands that are pelletized. did. As a result, approximately 150 bonds (68,0 kg) of fully aromatic polyester product was obtained.

The resulting polymer chain contained 1,4-dicarboxyphenylene units located internally in the length direction of the polymer chain, and the chain terminals were also carboxylic acid terminal groups. Substantially no further polymerization, ie, chain growth, was observed when this polymer was heated in either the molten or solid state.

The logarithmic viscosity (1, V, concentration (O51% by weight), ηrllll
- relative viscosity], it was found to be 1.6 dlh. The weight average molecular weight was approximately 9,700. 4 by differential scanning calorimetry (heating rate 20°C/min)
At one stage, this polymer exhibited a melting endotherm δ1 peak at 236°C. This polymer was optically anisotropic and exhibited a melt viscosity of about 50 poise at a temperature of 300 DEG C. and a shear rate of 100 sec-'.

The particulate inorganic material used in this example was purchased from 1larbison-Walke, Vinotsburg, Pennsylvania, USA.
It was fused silica commercially available from rRefractories under the name JP71. The aspect ratio of this material is substantially 1:1, the weight average particle size is approximately 12 microns, and more than 99% by weight of the particles are 100 microns.
The particles were of sub-micron particle size. This quartz glass was coated with 1% by weight of inorganic filler using standard coating techniques for
The surface was treated with a γ-glycidoxypropyltrimethoxysilane coating material. This silane coating material is
It was commercially available from Carbide Corporation under the name 8187.

This quartz glass was manufactured in Elk Greg, Illinois, USA.
Using a MDK 46 type kneader, a compounding extruder manufactured by Buss-Condux, Viresogy, a portion of the above-mentioned wholly aromatic polyester capable of forming a heterocalytic melt phase was added to 70% by weight as follows. % blending amount and was substantially uniformly dispersed. First, polymer pellets were fed into the back of the extruder. The quartz glass was metered and fed into the second feed port on the downstream side of the extruder.

Barrel temperature was maintained at 250°C and a screw rotation speed of 300 rpm was employed. The blended material is passed through a 3-hole gouie with a hole diameter of 4.5 mm at approximately 22' I bs/h.
r (10 Kg/hr) and shredded into pellets using a single blade eccentric Guiface pelletizer.

The resulting pellets were then sprayed with water and the material was cooled to room temperature.

The resulting molding material exhibited a melt viscosity of 900 poise at 330° C. (i.e. approximately the same as the encapsulation molding temperature used later) at a shear rate of 100 sec-'. This molding material also contains 50 ppm of water-extractable alkali metals.
The water extractable amount and halogen content were less than 100 ppm.

Precision wire-wound resistors may be selected as the electronic components for encapsulation. The winding portion of this resistor is formed into a coil that can withstand deformation at 350°C.

For each resistor, a pair of axially arranged leads are each connected to a 24 gauge (i.e. 0°020 inch - 0.05 cm diameter) tin 1.1 lead wire in a conventional manner using a 350mm wire. Connected by reliable bonding that maintains sufficient adhesion at ℃. For ease of handling, a large number of resistors to be encapsulated may be fixed in parallel rows at appropriate intervals on adhesive tape and wound on a suitable supply reel.

The injection mold used is large enough to allow complete encapsulation of the entire wire wound resistor, including the leads and the connections that secure the copper leads to the leads. The internal dimensions of the mold are approximately 0.060 inch (0.15 cm) larger than the actual size of the electronic component to be encapsulated on any side.

Two copper leads exit through a heat resistant, slightly deformable seal that forms part of the mold wall. Each mold cavity has a draft angle of approximately 5° to facilitate removal of the electronic component after encapsulation. In order to enable simultaneous encapsulation molding of a large number of the above-mentioned electronic components, a large number of mold cavities are arranged horizontally and in parallel.

The four-person application of the molding material to the mold cavity may use an Arburg model 200S screw injection molding machine available from Polymer Machinery, Berlin, Conn., USA. This injection molding machine is 40 US tons (3
6T) clamp and 2oz (56g) injection capacity. The encapsulation molding resin is 174 inches (0.6c
0.125 inch wide (
0,318 cm), height 0,020 inch (0,05
1 cm) into the mold cavity through a single substantially land-free gate. The molding material is applied at a temperature of about 300° C. and a pressure of about 500 psi (35 kg/cJ) to fill the mold cavity held at about 125° C. in about 1 second. The molding material within each mold cavity solidifies within seconds. Encapsulated electronic parts are 0.1
It is extruded from each mold cavity with a 25 inch (0.318 cm) ejector pin and then deburred.

The resulting injection molded molding material exhibits a flammability rating of V-O when tested in the UL-94 test and a body thermal expansion coefficient of 150 Xl0-'cm3/c at 60-110°C.
m3-" C or less, the thermal conductivity is 1ox1o-' cal-
Cm/sec-Cm2-''C or more, and the residual flexural strength is at least 75% after being immersed in water at 110°C for 200 hours, indicating hydrolytic stability.

Trip ±1 A 50 gallon (189#) stainless steel reactor equipped with a sealed horseshoe stirrer, gas inlet tube, and distillation column with condenser was charged with the following materials at room temperature (i.e., approximately 25°C): : 6-acetoxy-2-naphthoic acid (0.50 bond mole - 227 mole) of tal 115 bond (52.2 kg), (b) 4-acetoxybenzoic acid ('0.70 pound mole - of 126 bond (57.2 kg) 318 moles), (C1B, 29 bonds (3,76 kg) of terephthalic acid (0,050 bonds moles - 22.7 moles), and fdl 5.65 grams of potassium acetate catalyst.

By calculation, the terephthalic acid monomer was introduced into the reactor in a molar excess of 4.17%. 6-acetoxy-2-
Both reactants, naphthoic acid and 4-acetoxybenzoic acid, supply the same number of carboxylic acid groups and acetoxy groups, which are the required ester-forming reactive groups, so they are inherently stoichiometrically balanced within their molecules. ing. therefore,
The terephthalic acid monomer is the only aromatic dicarboxylic acid monomer, and this monomer allows the ester-forming carboxylic acid groups to reach a stoichiometric balance beyond the stoichiometric balance established with respect to the remaining monomers present in the polymerization system. This means that it was supplied in excess.

The reactor and its contents were completely purged of oxygen by vacuuming and refilling with nitrogen three times, then hot oil flow to the reactor jacket was started to melt the reactants. . The contents of the reactor were heated to 200°C and held at this temperature for 100 minutes.

The contents of the reactor were then further heated to the following temperatures with measurements every 15 minutes: 231°C, 244°C.
, 262℃, 273℃, 292℃, 306℃, 311℃
and 320°C. The temperature was then held at 320°C for 35 minutes.

After maintaining the reactant temperature at 320° C. according to the above heating schedule, the reactant was reduced to 8 mm and 11 g and heating was continued. This heating under reduced pressure was continued for 60 minutes.

The vacuum was then broken and the molten polymer product was discharged through a 1/8 inch (3.2 nun) single-hole gouge immersed in water to form a solidified strand that was pelletized. The result was approximately 138 pounds (62.6 kg) of fully aromatic polyester product.

The resulting polymer chain contained 1,4-dicarboxyphenylene units located internally in the length direction of the polymer chain, and the chain terminals were also carboxylic acid terminal groups. Substantially no further polymerization, ie, chain growth, was observed when this polymer was heated in either the molten or solid state.

The logarithmic viscosity number (1, V) of this polymer product was determined as described above for a pentafluorophenol solution with a concentration of 0.1% by weight at 60°C and was found to be 0.99 d.
It was l/g. The weight average molecule ■ was approximately 6,100. As measured by differential scanning calorimetry (heating rate 20°C/min), this polymer exhibited a melting endotherm peak at 221°C. The mel 1- of this polymer is optically anisotropic, and at a temperature of 300°C and a shear rate of 100 sec-1,
Poise melt viscosity is shown.

This polymer was then compounded with quartz glass as described in Example 1 to form a molding material according to the invention. The obtained molding material was heated at a temperature of 330°C and a shear rate of 100 sec.
-' indicates a melt viscosity of 420 poise.

The water-extractable alkali metal content of this molding material is 50 pp.
The water-extractable halogen content was less than 1100 pp.

Pre-soldered with dual in-line integrated circuit devices as electronic components for encapsulation molding
A 16-pin lead frame may be selected. This lead frame piece is plated with a tin-lead eutectic alloy with a tin/lead ratio of 63/37 and has 10 integrated circuits mounted in a row.
x7.5 xO,006 (thickness) inches (2,5X
It has a size of 19 X O,015 (Jl+). Each die of this integrated circuit is approximately 1/4 XI/4 inch (
0.6 x Q, 5 cm), and is bonded to the paddle part of each of the 10 devices using epoxy resin adhesive. Each of the 16 pins of each device is connected to an aluminum pad on the integrated circuit die with a fine gold wire approximately 0.001 inch (0.025 mm) in diameter.

The intended encapsulation process was carried out by Higlingel Canada, located in Guelph, Ontario, Canada.
A Hngel ES50 Vt1AS type 85-ton vertical opening press made by Company A is used, and an integral process controller is used in conjunction with this. The injection mold used is
It has multiple cavities connected to a central 1/4 inch (0.64 cm) circular runner, which is fed from a horizontal injection molding cylinder at a split plane location. The dimensions of each mold cavity are approximately 0.75 x O, 25 x O, 11 finches (1,9 x 0.64 x 0.30 c + n) T:.

The lead frame is positioned in the mold by guide pins so that each integrated circuit die is centered in the mold cavity. Each mold cavity has a draft angle of approximately 5° to facilitate removal of the electrical components after encapsulation.

Molding material is prevented from leaking from the mold between the outwardly protruding leads by a "U-stopping rod" or web placed between each lead.

Molding conditions are selected to suit the soldering lead frame. Melt temperature of about 315 °C and about 300 p
A pressure of si (21 kc/cJ) completely fills the mold cavity containing the electronic components in about 3.8 seconds. During the introduction of the molding material, the mold cavity is maintained at a temperature of approximately 145°C. Once injected into each mold cavity, the molding material solidifies within seconds. The encapsulated electronic components are extruded from each mold cavity by a 0.150 inch (0.381 cm) diameter ejector pin.

After encapsulation, the "dam bar" or web is removed in a trimming step, which involves die cutting to remove any excess metal from the lead frame that extends outside the encapsulation. The leads that protrude outside the encapsulation molding are bent into their final shape for easy insertion into a socket or printed circuit board. The electronic component is thus encapsulated in an impermeable manner.

The resulting injection molded molding material exhibits a flammability rating of v-0 when tested in the UL-94 test and a body thermal expansion coefficient of 150 Xl0-6 cm''/c at 60-110°C.
m"-℃ or less, thermal conductivity is 1oxto-' cal-c
m/sec-cm2-C or more, and the residual flexural strength is at least 75% after being immersed in water at 110C for 200 hours, indicating hydrolytic stability.

A 50 gallon (189p) stainless steel reactor equipped with a main-sealed horseshoe stirrer, gas inlet tube, and distillation column with condenser was charged with the following materials at room temperature (i.e., approximately 25°C): fa) 5-z of 59.0 bond (26,8kB)
i" t) xy-2-naphthoic acid (0,31 bond moles - 140 moles) (bl 137.4 bonds (69,32
kg) of 4-hydro:)-cybenzoic acid (1,00 lb mol - 453 mol), tel 9.04 bond (4,
10 kg) of terephthalic acid (0,054 lb mole = 2
4.5 moles), fdl 142 lbs (64,4 kg) of acetic anhydride (1
, 39 bond moles 631 moles), and tel 5.6 g of potassium acetate catalyst.

Calculations show that the terephucric acid monomer was added to the reactor in a molar excess of 4.1%. Both reactants, 6-hydroxy-2-naphthoic acid and 4-hydroxybenzoic acid, supply the same number of carboxylic M groups and hydroxyl groups, which are the required ester-forming reactive groups, in their molecules. Originally, they were stoichiometrically balanced. therefore,
The terephucric acid monomer is the only aromatic dicarboxylic acid monomer, and this monomer allows the ester-forming carboxylic acid groups to exceed the stoichiometric balance established with respect to the remaining dicarboxylic acids present in the polymerization system. This means that it was supplied in stoichiometric excess.

The reactor and its powdered contents were depressurized and refilled with nitrogen.
Completely purge the oxygen by repeating the cycle, then charge the acetic anhydride, and then begin flowing hot oil into the reactor jacket to form a homogeneous liquid solution from the reactants.
Ta. The contents of the reactor were heated to 140°C, held at this 6M degree for 30 minutes, and then raised to 200°C in about 40 minutes,
It was held at 200°C for an additional 30 minutes. The contents of the reactor were then further heated to the following temperatures with measurements every 15 minutes: 219°C, 246°C, 262°C, 28°C.
1°C, 300°C, 310°C, 316°C and 320°C.

The temperature was then held at 320°C for 30 minutes.

After maintaining the reaction mixture at 320° C. according to the heating schedule described above, the reaction mixture was reduced to a vacuum of 10 mm/1 g and heating was continued. This heating under reduced pressure was continued for 120 minutes.

Nitrogen was then introduced to break the vacuum and the molten polymer product was transferred to a 178 inch (3.2 mm) tube immersed in water.
It was discharged from the hole to form a solidified strand, which was made into a pellet. As a result, approximately 150 bonds (68
,0 kg) of a wholly aromatic polyester product was obtained.

The resulting polymer chain contained 1,4-dicarboxyphenylene units located internally in the length direction of the polymer chain, and the chain terminals were also carboxylic acid terminal groups. Substantially no further polymerization, ie, chain growth, was observed when this polymer was heated either in the molten or solid state.

The logarithmic viscosity number (1, V,) of this polymer product was determined as described above for a pentafluorophenol solution with a concentration of 0.1% by weight at 60°C and was found to be 0.9 d.
It was 17g. The weight average molecular weight was approximately 6,000. The polymer exhibited a melting range of approximately 250-305°C as determined by differential scanning calorimetry (heating rate 20'C/min). The melt of this polymer is optically anisotropic and the melt viscosity varies from Rheo
Metrics were measured between parallel plates of a mass spectrometer at a temperature of 320° C. and a shear rate of 10 se (') of about 7 poise.

This polymer was then compounded with quartz glass as described in Example 1 to form a molding material according to the invention. ASTM 031 with the resulting molding material modified as described above.
It was evaluated by the spiral flow test of No. 23-722.

A spiral flow length of 24 inches (61 clN>) at 330°C and 28 inches (71 am) at 340°C was obtained. The molding material had a water-extractable alkali metal content of less than 50 ppm and a water-extractable halogen content. is 1100
It was less than pp.

A dual in-line integrated circuit device with a 40 pin lead frame may be selected for encapsulation. This lead frame is 1-8/1 inch (2,9cm)
0.010 inch (0,
It consists of a number of segments made of stamped copper sheets of 025C). This integrated circuit die measures approximately 174 inches (0.
, 6c+n) xi/4 inch (0.6 cm) and is bonded to the paddle portion of each segment of the lead frame by epoxy resin. Each of the 40 pins of the lead frame is connected to a pad of the integrated circuit die by a fine gold wire approximately 0,000 inches (0,0254 mm) in diameter.

The single-out mold used shall be sized to completely enclose the integrated circuit die, connecting wires, and associated cantilevered arms of the lead frame. The mold size for each half of the mold cavity is 2.03 inches long (5
,17c+n), width 0.54 inch (0,419 CI
m). The total thickness of the two mold cavity halves combined is 0.165 inches (0.42 cm), which is equal to or smaller than the 0.006 inch (0.42 cm) thickness of the lead frame on which each mold cavity half rests. 015 cm). The mold design incorporates a sufficient draft angle of approximately 5 degrees to facilitate removal of the encapsulated electronic components. The lead frame is fixed in the mold by means of guide pins that fit into holes punched in the lead frame so that the lead frame is centered in the die cavity. A "dam bar" or 'web placed between each lead prevents the molding material from coming out of the mold between the outwardly protruding leads.

The molding material is put into the above-mentioned multi-piece mold in Canada.
Ludwig Engel C of Guelph, Ontario
Made by anada [! It can be carried out using an integral process controller in combination with an 851-n vertical press. This injection molding machine has a mold clamping force of 8
5 tons, injection force s oz (0,14 kg). The encapsulant is introduced into each mold cavity by split-face injection into a 174 inch (0,635 mold material) launch leading to a single gate into each mold cavity. The gate is approximately 0.125 inches (0.318c+a) xo,
A substantially landless piece measuring 0.085 mm (0.089 mm) is located on one side of the center of each mold cavity. Melt temperature of approximately 330°C and approximately 1000 psi
With an injection pressure of (70 kg/c+J), all mold cavities are filled from the gate in about 2.5 seconds. During the introduction of the molding material, the mold cavity is maintained at a temperature of approximately 175°C.

Once injected into each mold cavity, the molding material solidifies within seconds. The encapsulated electrical component has a diameter of approximately 5732 mm.
Extrude from each mold cavity with an inch (0.40 cm) ejector pin.

After encapsulation, the ``.I-holding rod'' or web is removed in a trimming process to cut and remove any excess metal of the lead frame that extends outside of the encapsulation. The leads that protrude outside the encapsulation molding are bent into their final shape for easy insertion into a socket or printed circuit board. In this way, the electronic component is encapsulated in an impermeable manner.

The resulting injection molded molding material exhibits a combustion value of V-O when tested in the LIL-94 test and a body thermal expansion coefficient of 150 x 10-'cm' at 60-110°C.
/ca+"-c or less, the heat transfer ratio is l0XIO-'ca
l-cm/sec-cal-”c or more, 110°C
After being immersed in water for 200 hours, the residual flexural strength was 75% or more, indicating hydrolytic stability.

Although the present invention has been described above with reference to its preferred embodiments, it goes without saying that the present invention is not limited to these specific details and that various changes can be made within the scope of the present invention. do not have.

Applicant: Celanese Corporation Representative Patent Attorney: Akira Hirose - (1 other person) Continued from page 1 ■Int, CI,' Identification code Office docket number priority claim 01J4H June 18IO United States (US) [Phase] 61
96 names 0 Inventor Gary E. Lai United States of America II; Liams Claremont de; @Inventor Hiangnan Yun United States of America II;-
Avenue 5 1 - Short Hills, Chassis, Live 2 Akji l - Summit, Chassis, Mondreau Hatachi

Claims (1)

Claims: (1) (a1 weight average intermolecularity is about 4,000 to 25.
000, which is capable of forming an anisotropic melt phase in which further chain growth by heating is substantially impossible, and reducing the coefficient of thermal expansion of the fbl component (a). ,
About 40-80% by weight based on the total weight of the molding material, which can increase its thermal conductivity;
A molding material particularly suitable for the impermeable encapsulation of electronic components by injection molding, comprising a particulate inorganic material substantially uniformly dispersed therein. (2) The melt-processable polymer capable of forming the anisotropic melt phase is a wholly aromatic polyester, an aromatic-aliphatic polyester, a wholly aromatic poly(ester-amide), an aromatic-aliphatic poly(ester-amide), or an aromatic-aliphatic poly(ester-amide). amide), aromatic polyazomethines, aromatic polyester-carbonates, and mixtures thereof, which are particularly suitable for impermeable encapsulation of electronic components by injection molding according to claim 1. material. (3) The injection molding according to claim 1, wherein the melt-processable polymer is fully aromatic in that all components contained in the polymer provide at least one aromatic ring. A molding material particularly suitable for impermeable encapsulation molding of electronic components. (4) A molding material particularly suitable for impermeable encapsulation of electronic components by injection molding according to claim 1, wherein the melt-processable polymer is a wholly aromatic polyester. (5) A molding material particularly suitable for impervious encapsulation of electronic components by injection molding according to claim 1, wherein the melt-processable polymer is a wholly aromatic poly(ester-amide). (6) Impermeability of an electronic component by injection molding according to claim 1, wherein the melt-processable polymer contains a repeating unit containing a naphthalene component in an amount of about 10 mol% or more. Molding material particularly suitable for encapsulation molding. (7) an iteration in which the melt processable polymer comprises a naphthalene-based component selected from the group consisting of a 6-oxy-2-naphthoyl component, a 2,6-cyoxynaphthalene component, and a 2,6-dicarboxynaphthalene component; Claim 1, which contains the unit in an amount of about 10 mol% or more
A molding material particularly suitable for impermeable encapsulation molding of electronic components by injection molding as described in 1. (8) The melt-processable polymer has the following (al to (f)
(In each formula, Ar is small (both mean a divalent group consisting of one aromatic ring): 1 (al -0-A r -C-, fbl -0-A r -0-, O0 11i fcl - C-A r -C-, (dl -Y -A r -7,-, (wherein, Y is 0, NH or NR, Z is NH or NR
(wherein, Z means NH or NR, R is an alkyl group or aryl group having 1 to 6 carbon atoms), 1 tel -Z -A r -C-, (wherein, Z means NH or NR, and R is an alkyl group or an aryl group having 1 to 6 carbon atoms) ~
ester-forming and optionally amide-forming monomers to form a polyester polymer having a repeating component selected from the group consisting of , a polyester which may optionally contain an amide bond, obtained by polymerization reaction in a polymerization zone, provided that about 1 to 5 mol% excess of aromatic dicarboxylic acid monomer and/or its aromatic dicarboxylic acid monomer and/or its The esterified derivative is present in the polymerization zone, and this excess monomer creates 4 radicals, +5 = 1-diaryl units, within the polymer chain of the resulting polymer during the polymerization reaction.
1, the polymer chains end with carboxylic acid end groups and/or their esterified derivatives, and the desired molecular weight of the polymer chains is achieved by the depletion of other monomers present in the polymerization zone. Impermeable encapsulation of electronic components by injection molding according to claim 1, wherein the polyester product obtained is substantially unable to undergo further chain growth even if it is subsequently heated. Molding material especially suitable for molding. (9) A molding material particularly suitable for impermeable encapsulation molding of electronic parts by injection molding according to claim 8, wherein the polymerization reaction is carried out in a molten state. (10) The monomers originally having hydroxyl groups and/or amine groups present in the polymerization zone are all subjected to the reaction in the form of lower acyl esters having about 2 to 4 carbon atoms. A molding material particularly suitable for impermeable encapsulation of electronic components by injection molding. (11) Impermeable encapsulation of electronic components by injection molding according to claim 8, wherein all monomers originally having hydroxyl groups and/or amine groups present in the polymerization zone are subjected to the reaction as acetate esters. Molding material especially suitable for molding. (12) When the polyester product is dissolved in pentafluorophenol at 60° C. at a concentration of 0.1% by weight before mixing with the particulate inorganic material, about 0.8-3. O
A molding material particularly suitable for impermeable encapsulation molding of electronic parts by creative molding according to claim 8, which exhibits a logarithmic viscosity number of d17H. (13) An aromatic dicarboxylic acid monomer and/or an esterified derivative thereof in an excess of about 2.0 to 4.2 mol % is present in the polymerization zone during the polymerization reaction. A molding material particularly suitable for impermeable encapsulation of electronic components by injection molding. (14) The above) melt-processable polymer essentially consists of the following components (1) and (2): A polyester polymer containing component I in an amount of about 20 to 45 mol% and component n in an amount of about 55 to 80 mol%. It is a wholly aromatic polyester obtained by subjecting an ester-forming monomer that produces the following to a polymerization reaction in a polymerization zone,
However, during the polymerization reaction, an excess of about 2.0 to 4.2 mol% of aromatic dicarboxylic acid monomer is present in the polymerization zone.
This excess monomer creates dicarboxyaryl units within the polymer chain of the resulting polymer during the polymerization reaction.
The resulting fully aromatic polyester The product is particularly suitable for impermeable encapsulation molding of electronic components by injection molding as claimed in claim 1, wherein the product is substantially unable to undergo further chain growth even if it is subsequently heated. Suitable molding material. (15) The melt-processable polymer has the following components III, ■, and optionally ■ (in each formula, Ar means a divalent group consisting of at least one aromatic ring): 11I II: -C- Ar-C- 111: -Y-A r-Z - (wherein, Y is ○, NH or NRXZ is NH or NR
(R is an alkyl group or aryl group having 1 to 6 carbon atoms), rV : -0-A r -〇 -, component I is about 40 to 80 mol%, component (II) is about 5 mol%
ester-forming and amide-forming reactions to produce poly(ester-amide) polymers containing component (1) in an amount of ~30 mole%, component (1) in an amount of about 5-30 mole%, and component (2) in an amount of about 0-25 mole%. A wholly aromatic poly(ester-amide) obtained by polymerizing monomers in a polymerization zone,
However, during the polymerization reaction, an aromatic dicarboxylic acid monomer of approximately 1 to 5 mol% excess is present in the polymerization zone, and this excess monomer imparts dicarboxyaryl units to the interior of the polymer chain of the resulting polymer during the polymerization reaction. At the same time, the end of the polymer chain becomes a carboxylic acid end group,
Since reaching the required molecular weight of the polymer chains was achieved by depletion of the other monomers present in the polymerization zone, the resulting wholly aromatic poly(ester-amide) product does not support further chains even after subsequent heating. A molding material particularly suitable for impermeable encapsulation of electronic components by injection molding according to claim 1, in which growth is substantially impossible. (16) The weight average molecular weight of the melt-processable polymer capable of forming the anisotropic melt phase is about 4,000 to 10,000.
A molding material particularly suitable for impermeable encapsulation molding of electronic components by injection molding according to claim 1. (17) The particulate inorganic material is present in the molding material in an amount of about 50 to 75% by weight based on the total weight of the molding material. Molding material particularly suitable for transparent encapsulation molding. (18) The particulate inorganic material has a weight average molecular weight of 1 to 5.
0μ, 99% by weight or more of the particles are less than 100μ,
A molding material particularly suitable for impermeable encapsulation of electronic components by injection molding according to claim 1, having an average aspect ratio of 2:1 or less. (19) A molding material particularly suitable for impermeable encapsulation of electronic components by injection molding according to claim 18, wherein the particulate inorganic material is particulate silicon dioxide. (20) the particulate silicon dioxide is quartz glass;
A molding material particularly suitable for impermeable encapsulation of electronic components by injection molding according to claim 19. (21) Injection molding according to claim 1, wherein the particulate inorganic material is quartz glass provided with a surface coating that helps achieve substantially uniform dispersion of the particulate inorganic material into its component +a). A molding material particularly suitable for impermeable encapsulation molding of electronic components. (22) The particulate inorganic material is quartz glass provided with a silane-based surface coating that helps achieve substantially uniform dispersion in its component (al). A molding material particularly suitable for the impermeable encapsulation of electronic components by injection molding. (23) Claims in which the molding material can be injection molded at a temperature within the range of about 250 to 390"C. A molding material particularly suitable for impermeable encapsulation molding of electronic components by injection molding according to paragraph 1. (24) The molding material can be injection molded at a temperature within the range of about 250 to 390°C, and the molding temperature The molding material has a shear rate of about 300 to 1500 at a shear rate of 100 sec-'.
A molding material particularly suitable for impermeable encapsulation of electronic components by injection molding according to claim 1, which exhibits a melt viscosity within the Poise range. (25) Impermeable encapsulation of electronic components by the injection molding method according to claim 1, wherein the water-extractable alkali metal content and water-extractable halogen content of the molding material are less than 50 ppm and less than 1100 ppm, respectively. Molding material especially suitable for molding. (26) A molding material particularly suitable for impermeable encapsulation molding of electronic components by injection molding according to claim 1, wherein the molding material after molding exhibits a combustion evaluation of C in the FIL-94 test. (27) The molding material after molding is 60-110'c Te1
A molding material particularly suitable for impermeable encapsulation of electronic components by injection molding according to claim 1, which exhibits a body thermal expansion coefficient of 50 x lO-6 cm"7 cm"-C or less. (28) The molding material after molding is toxio-' cal
-cm/sec-cm2-'C or higher thermal conductivity;
A molding material particularly suitable for impermeable encapsulation molding of electronic parts by injection molding according to claim 1. (29) The molding material after molding was placed in water at 110°C for 200°C.
The impermeable encapsulation molding of electronic parts by injection molding according to claim 1, which exhibits hydrolytic stability as evidenced by a residual rate of bending strength of 75% or more after being immersed for a time. Molding material suitable for long-term use. (30) +11 Place the electronic components to be sealed into the mold cavity, (2) Place ta+al into the mold cavity containing the electronic components.
a melt-processable polymer in a molten state capable of forming an anisotropic melt phase having an average molecular weight of about 4,000 to 25,000 and substantially unable to undergo further chain growth by heating, and (bl component ( In an amount of about 40 to 80% by weight, based on the total weight of the molding material, the elemental Al contains substantially A molding material consisting of a uniformly dispersed particulate inorganic material is injected at high temperature to completely fill the cavity; (3) the contents of the mold cavity are cooled to solidify the molding material and the electronic component is molded; An impermeable encapsulation molding method for an electronic component comprising the steps of forming an impermeable package around the periphery, and (4) taking out the obtained encapsulation molded electronic component from the mold cavity. (31) The electronic component is An impervious encapsulation molding method for an electronic component according to claim 30, which is a semiconductor device. (32) The electronic component is punched into a flat plate having a plurality of leads protruding outward from the encapsulation molded portion. A method for impermeable encapsulation molding of an electronic component according to claim 30, which is an integrated circuit device assembled on a processed reed frame. (33) In step (2), the mold is
℃, and the molding material is heated at approximately 100 to 1000 ps+ (
Claim 30: injection into the mold cavity at a temperature of about 250-390°C under a pressure of 7-70 kg/d).
Impermeable encapsulation molding method for electronic components as described in Section 2. (34) The impermeable encapsulation molding method for electronic components according to claim 33, wherein in step (2), the entire molding cycle is performed in less than 1 minute. (35) The impermeable electronic component according to claim 30, wherein the molding material exhibits a melt viscosity within the range of about 300 to 2,500 poise at a shear rate of 100 sec-' and an injection molding temperature. Sex encapsulation molding method. (36) The melt-processable polymer capable of forming the anisotropic melt phase is a wholly aromatic polyester, an aromatic-aliphatic polyester, a wholly aromatic poly(ester-amide), an aromatic-
Claim 3 selected from the group consisting of aliphatic poly(ester-amide), aromatic polyazomethine, aromatic polyester-carbonate, and mixtures thereof.
The impermeable encapsulation molding method for electronic components according to item 0. (37) The electronic component according to claim 30, wherein the melt-processable polymer is wholly aromatic in that all components contained in the polymer provide at least one aromatic ring. Impermeable encapsulation molding method. (38) The method for impervious encapsulation molding of electronic components according to claim 30, wherein the melt-processable polymer is a wholly aromatic polyester. (39) The impermeable encapsulation molding method for electronic components according to claim 30, wherein the melt-processable polymer is a wholly aromatic poly(ester-amide). (40) The method for impermeable encapsulation molding of an electronic component according to claim 30, wherein the melt-processable polymer contains about 10 mol% or more of repeating units containing a naphthalene-based component. . (41) The melt-processable polymer is 6-oxy-2-
Contains about 10 mol% or more of repeating units containing a naphthalene-based component selected from the group consisting of a naphthoyl component, a 2,6-cyoxynaphculene component, and a 2,6-dicarboxynaphthalene component. , a method for impermeable encapsulation molding of an electronic component according to claim 30. (42) The melt-processable polymer has the following (al to (f)
) (In each formula, Ar is 2 consisting of at least one aromatic ring.
1 fal -0-A r -C-, (bl -0-A r -0-, 00 111 (cl -C-A r -C-, (dl -Y -A r - Z −, (where Y is 0, NH or NR, Z is NH or N
R is an alkyl group or an aryl group having 1 to 6 carbon atoms), (e) -Z -A r -C-, (wherein, Z means NH or NR, and R is a carbon Number 1~
ester-forming and optionally amide-forming monomers such as to form a polymer having repeating components selected from the group consisting of alkyl or aryl groups of G); A polyester obtained by polymerization reaction and optionally having an amide bond, provided that about 1 to 5 mol% excess of aromatic dicarboxylic acid monomer and/or its esterified derivative is added during the polymerization reaction. This excess monomer is present in the polymerization zone, and during the polymerization reaction, the internal dicarboxyaryl units of the polymer chain of the resulting polymer are converted to 1y, and the ends of the polymer chain are converted to carboxylic acid terminal groups and/or their esterified derivatives. , since reaching the required molecular weight of the polymer chains was achieved by depletion of other monomers present in the polymerization zone, the resulting polyester product is virtually incapable of further chain growth upon subsequent heating. (43) The electronic component according to claim 42, wherein the polymerization reaction is carried out in a molten state. Impermeability t, = one-person molding method. (44) Hydroxyl 4B originally present in the polymerization zone
43. The impermeable encapsulation molding method for an electronic component according to claim 42, wherein the hexamer having an amine group and/or an amine group is all subjected to the reaction in the form of a lower acyl ester having about 2 to 4 carbon atoms. (45) Claim 4, in which all monomers originally having hydroxyl groups and/or amine groups that are present in the polymerization zone are subjected to the reaction as acetic esters.
The impermeable encapsulation molding method for electronic components according to item 2. (46) When the polyester product is dissolved in pentafluorophenol at 60° C. at a concentration of 0.1% by weight before mixing with the particulate inorganic material, about 0.8-3. O
43. The impermeable encapsulation molding method for electronic components according to claim 42, which exhibits a logarithmic viscosity of dl/g. (47) Claim 42, wherein an aromatic dicarboxylic acid monomer and/or its esterified derivative is present in an excess of about 2.0 to 4.2 mol % in the polymerization zone Q during the polymerization reaction. Impermeable encapsulation molding method for electronic parts. (48) The melt-processable polymer consists of the following components (1) and (2) in terms of wood, with component I being about 20 to 45 mol% and component (2) being about 55 to 80 moles. %(7)(i) containing such ester-forming monomers as to form the polyester polymer,
It is a wholly aromatic polyester obtained by a polymerization reaction in a polymerization zone, provided that an aromatic dicarboxylic acid monomer in an excess of about 2.0 to 4.2 mol % is present in the polymerization zone during the polymerization reaction, and this excess monomer is During the polymerization reaction, a dicarboxyaryl unit is added to the inside of the polymer chain of the produced polymer, and the terminal of the polymer chain becomes a carboxylic acid terminal group, and the required molecular weight of the polymer chain is reached at polymerization step 11. This was achieved by depletion of other monomers, and the resulting wholly aromatic polyester product was then subjected to subsequent heating, b) rendering further chain growth virtually impossible. A method for impermeable encapsulation molding of an electronic component according to claim 30. (49) The melt-processable Borimani essentially contains the following components I, ■, ■, and optionally ■ (in each formula, Ar means a divalent group consisting of at least one aromatic ring): 11I II: - C-A r-C- 111: -Y-A r-Z - (wherein, Y is O, NH or NR, Z is NH or NR
(wherein R is an alkyl group or aryl group having 1 to 6 carbon atoms), IV: -0-A r -〇 -, where component (1) is about 40 to 80 mol% and component (2) is about 5% by mole.
ester-forming and amide-forming reactions to produce poly(esterylamide) polymers containing component ■ in an amount of ~30 mole %, component ■ in an amount of about 5 to 30 mole percent, and component ■ in an amount of about 0 to 25 mole percent. It is a wholly aromatic poly(ester-amide) obtained by polymerizing a child's twig in a polymerization zone,
However, during the polymerization reaction, an aromatic dicarboxylic acid monomer of about 1 to 5 mol% excess is present in the polymerization zone, and this excess monomer causes dicarboxyaryl units i The resulting fully aromatic Impermeable encapsulation of an electronic component according to claim 30, wherein the poly(ester-amide) product is substantially incapable of further chain growth even after subsequent heating. Molding method. (50) Impermeable encapsulation molding of an electronic component according to claim 30, wherein the melt-processable polymer capable of forming an anisotropic melt phase has a weight average molecular weight of about 4.000 to 10,000. Method. (51) Impermeable encapsulation of electronic components according to claim 30, wherein the particulate inorganic material is present in the molding material in an amount of about 50 to 75% by weight based on the total weight of the molding material. Molding method. (52) The particle state n-monthly charge has an average particle size of about 1 to 5
0μ, 99% by weight or more of the particles are less than 100μ,
31. The method of impermeable encapsulation molding of an electronic component according to claim 30, wherein the average aspect ratio is 2:1 or less. (53) The impervious encapsulation molding method for electronic components according to claim 30, wherein the particulate inorganic material is particulate silicon dioxide. (54) The particulate silicon dioxide is quartz glass.
A method for impermeable encapsulation molding of an electronic component according to claim 53. (55) The electronic component according to claim 30, wherein the particulate inorganic material is quartz glass provided with a surface coating that helps achieve substantially uniform dispersion of the particulate inorganic material into the component ta+. Impermeable encapsulation molding method. (56) Claim 30, wherein said particulate state a) is quartz glass provided with a silane-based surface coating that facilitates achieving substantially uniform dispersion of said component a). The method for impermeable encapsulation molding of electronic components as described. (57) The method for impervious encapsulation molding of electronic components according to claim 30, wherein the water-extractable alkali metal content (1) and the water-extractable halogen content (2) of the molding material are less than 50 ppm and less than 1100 ppm, respectively. (58) The solidified molding material after encapsulation molding is 60 to 11
31. The impermeable encapsulation molding method for an electronic component according to claim 30, which exhibits a body thermal expansion coefficient of 150 x 10-6 cm''/cm'-''c or less at 0°C. (59) The solidified molding material after encapsulation molding is l0XIO
-'cal-cm/sec-cm''-'cc or less impermeable encapsulation molding method for an electronic component according to claim 30, which exhibits a thermal conductivity of less than or equal to ``cal-cm/sec-cm''-'cc. (60) Solidified molding material after encapsulation molding But 110°C
After being immersed in water for 200 hours, the remaining bending strength was 75.
% or more,
A method for impermeable encapsulation molding of an electronic component according to claim 30. (61) (a1 weight average molecular weight is about 4,000 to 25
,000, which is capable of forming an anisotropic melt phase in which further chain growth by heating is virtually impossible; ,
Component a in an amount of about 40 to 80% by weight, based on the total weight of the composition, capable of adding j1 g to its thermal conductivity.
1. An encapsulated product in which an electronic component is imperviously encapsulated within an encapsulating agent composition made of a particulate inorganic material substantially uniformly dispersed in a liquid. (62) The encapsulated product according to claim 61, wherein the electronic component is a semiconductor device. (63) The encapsulated product according to claim 61, wherein the electronic component is an integrated circuit device assembled on a flat punched lead frame having a plurality of leads protruding outward from the encapsulated molded portion. (64) The melt-processable polymer capable of forming an anisotropic melt phase is a wholly aromatic polyester, an aromatic-aliphatic polyester, a wholly aromatic poly(ester-amide), an aromatic-
The electronic component according to claim 61 is encapsulated in an encapsulant composition selected from the group consisting of aliphatic poly(ester-amide), aromatic polyazomethine, aromatic polyester-carbo-1, and mixtures thereof. Encapsulated products that are impermeably molded into objects. (65) The electronic component according to claim 61, wherein the melt-processable polymer is wholly aromatic in that all components contained in the polymer provide at least one aromatic ring. An encapsulated product obtained by imperviously encapsulating and molding the encapsulating agent in an encapsulating agent composition. (66) An encapsulated product obtained by impermeably encapsulating the electronic component according to claim 61 in an encapsulating agent composition, wherein the melt-processable polymer is a wholly aromatic polyester. (67) Claim 6, wherein the melt processability 1; +) mer is a wholly aromatic poly(ester-amide).
An encapsulated product obtained by imperviously encapsulating the electronic component according to item 1 in an encapsulating agent composition. (68) The electronic component according to claim 61 is placed in an encapsulant composition, wherein the melt-processable polymer contains repeating units containing a naphthalene component in an amount of about 10 mol% or more. An encapsulated product made by opaque encapsulation molding. (69) The melt processable polymer is 6-oxy-2-
A patent containing repeating units containing a naphthalene component selected from the group consisting of a naphthoyl component, a 2,6-cyoxynaphthalene component, and a 236-dicarpoxynaphthalene component in an amount of about 10 mol% or more Encapsulated product obtained by impermeably encapsulating the electronic component according to claim 61 in an encapsulant composition.
) (In each formula, Ar is 2 consisting of at least one aromatic ring.
meaning a valence group): 1 (at -0-A r -C-, (bl -0-Ar -'O-, 0 111 (c) -C-A r -C-, fdl -Y -A r -Z -, (wherein, Y is O, NH or NR, Z is NH or NR
, R is an alkyl group or aryl group having 1 to 6 carbon atoms), I (el -Z-A r -C-, (wherein, Z means NH or NR, and R is a carbon number 1~
ester-forming and optionally amide-forming monomers such as to form a polymer having repeating components selected from the group consisting of: A polyester obtained by polymerization reaction and optionally having an amide bond, provided that about 1 to 5 mol% excess of aromatic dicarboxylic acid monomer and/or its esterified derivative is added during the polymerization reaction. This excess monomer, present in the polymerization zone, imparts dicarboxyaryl units to the interior of the polymer chain of the resulting polymer during the polymerization reaction, and also terminates the polymer chain with carboxylic acid end groups and/or esterified derivatives thereof. Since the required molecular weight of the polymer chains is reached by the depletion of other monomers present in the polymerization zone, the resulting polyester product is virtually free from further chain growth upon subsequent heating. Claim 6, which has become impossible due to
An encapsulated product obtained by imperviously encapsulating the electronic component according to item 1 in an encapsulating agent composition. (71) An encapsulated product obtained by impermeably encapsulating the electronic component according to claim 70 in an encapsulating agent composition, in which the polymerization reaction was performed in a molten state. (72) The method according to claim 70, wherein the monomers originally having hydroxyl groups and/or amine groups present in the polymerization zone are all subjected to the reaction in the form of lower acyl esters having about 2 to 4 carbon atoms. Encapsulated products made by impermeably encapsulating electronic components in an encapsulant composition. (73) The electronic component according to claim 70, in which monomers originally having hydroxyl groups and/or amine groups present in the polymerization zone are subjected to the reaction as acetate esters, is placed in an encapsulant composition. An encapsulated product made by opaque encapsulation molding. (74) When the polyester product is dissolved in pentafluorophenol at 60"C at a concentration of 0.1% by weight before mixing with the particulate inorganic material, about 0.8-3.
The electronic component according to claim 70, which exhibits a logarithmic viscosity of 0 a/, is incorporated into an encapsulant composition.
Enclosed product made by enclosing and molding three times. (75) The electronic according to claim 70, wherein an aromatic dicarboxylic acid monomer and/or its esterified derivative in an excess of about 2.0 to 4.2 mol % is present in the polymerization zone during the polymerization reaction. An encapsulated product made by imperviously encapsulating a component in an encapsulating agent composition. (76) The melt-processable polymer essentially consists of the following components (1) and (2): to produce a polyester polymer containing component I in an amount of about 20 to 45 mol% and component (2) in an amount of about 55 to 80 mol%. It is a wholly aromatic polyester obtained by polymerizing an ester-forming polymer in a polymerization zone,
However, during the polymerization reaction, about 2.0 to 4.2 mol% excess aromatic dicarboxylic acid monomer is present in the polymerization zone,
Due to this excess weight, a dicarboxyaryl unit is added to the inside of the polymer chain of the produced polymer during the polymerization reaction, and the terminal of the polymer chain becomes a carboxylic acid terminal group, so that the required molecular weight of the polymer chain is achieved. is achieved by depletion of other monomers present in the polymerization zone, so that the resulting wholly aromatic polyester product is virtually incapable of further chain growth even upon subsequent heating. , An encapsulated product obtained by permanently encapsulating the electronic component according to claim 61 in an encapsulating agent composition. (77) The melt-processable polymer essentially comprises the following components I, ■, ■, and optionally IV (in each formula, Ar means a divalent group consisting of at least one aromatic ring): 111 1I: - C-Ar--C- m: -Y-A r-Z- (wherein, Y means O, NH or NR, Z means NH or NR, and R is an alkyl group having 1 to 6 carbon atoms or an aryol group), IV: -0-A r --0-, containing about 40 to 80 mol% of component I and about 5% of component (2)
ester-forming and amide-forming reactions to produce poly(ester-amide) polymers containing component (1) in an amount of ~30 mole%, component (1) in an amount of about 5-30 mole%, and component (2) in an amount of about 0-25 mole%. A wholly aromatic poly(ester-amide) obtained by polymerizing monomers in a polymerization zone,
However, during the polymerization reaction, an aromatic dicarboxylic acid monomer of about 1 to 5 mol% excess is present in the polymerization zone, and this excess monomer causes the dicarn jζ xyaryl jrL position to be present in the polymer chain of the produced polymer during the polymerization reaction. stomach;
The resulting wholly aromatic poly(ester) is highly aromatic, since the end of the polymer chain becomes a carboxylic acid end group and the required molecular weight of the polymer chain is achieved by depletion of other monomers present in the polymerization zone. -amide) product is such that further chain growth is substantially impossible even after subsequent heating.
An encapsulated product obtained by imperviously encapsulating the electronic component according to item 1 in an encapsulating agent composition. (78) The electronic component according to claim 61, wherein the melt-processable polymer capable of forming an anisotropic melt phase has a weight average molecular weight of about 4,000 to 10,000, is placed in an encapsulant composition. (79) The particulate inorganic material is present in the composition in an amount of about 0 to 25 mol% based on the total weight of the encapsulating agent composition. An encapsulated product obtained by imperviously encapsulating the electronic component according to claim 61 in an encapsulating agent composition. (80) The particulate inorganic material has a weight average molecular weight of 1 to 5
0μ, the particle weight is less than 100μ, and the electronic component of claim 61 is impermeably encapsulated in an encapsulant composition, wherein the average aspect ratio is 2:1 or less. Enclosed product made by molding. (81) An encapsulated product obtained by imperviously encapsulating the electronic component according to claim 80 in an encapsulating agent composition, wherein the particulate inorganic material is particulate silicon dioxide. (82) the particulate silicon dioxide is quartz glass,
the encapsulated product is formed by injection molding;
An encapsulated product obtained by imperviously encapsulating the electronic component according to claim 81 in an encapsulating agent composition. (83) The electronic component according to claim 82, wherein the particulate inorganic material is quartz glass provided with a surface coating that helps achieve substantially uniform dispersion of the particulate inorganic material into the component (81). (84) A silane-based surface coating that facilitates achieving substantially uniform dispersion of the particulate inorganic material into its components a+. An encapsulated product obtained by imperviously encapsulating the electronic component according to claim 82 in an encapsulating agent composition, which is quartz glass coated with quartz glass. (85) Water extractability of the composition An encapsulated product obtained by imperviously encapsulating the electronic component according to claim 61 in an encapsulating agent composition, the electronic component having an alkali metal content and a water-extractable halogen content of less than 50 ppm and less than 1100 ppm, respectively. (86) The composition is formed by impermeably encapsulating the electronic component according to claim 61 in an encapsulant composition, which exhibits a V-O combustion rating in the UL-94 test. Encapsulated product. (87) The composition is heated to 150× at 60 to 110°C.
exhibiting a body thermal expansion coefficient of 10-6 cm'/cm3-°C or less,
An encapsulated product obtained by imperviously encapsulating the electronic component according to claim 61 in an encapsulating agent composition. (88) The composition has a concentration of 10xlO-' cal-cm
An encapsulated product obtained by impermeably encapsulating the electronic component according to claim 61 in an encapsulating agent composition, which exhibits a thermal conductivity of /sec-cm"-°C or more. (89) The composition Claim 61, wherein the product exhibits hydrolytic stability as evidenced by a residual flexural strength of 75% or more after being immersed in water at 110°C for 200 hours.
An encapsulated product obtained by encapsulating and molding the electronic component described in 1. in an encapsulating agent composition.