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JPS6039790A - Organic el - Google Patents

Organic el

Info

Publication number
JPS6039790A
JPS6039790A JP58147866A JP14786683A JPS6039790A JP S6039790 A JPS6039790 A JP S6039790A JP 58147866 A JP58147866 A JP 58147866A JP 14786683 A JP14786683 A JP 14786683A JP S6039790 A JPS6039790 A JP S6039790A
Authority
JP
Japan
Prior art keywords
organic
thermocompression
resin outer
terminal
internal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58147866A
Other languages
Japanese (ja)
Inventor
義信 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kansai Nippon Electric Co Ltd
Original Assignee
Kansai Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kansai Nippon Electric Co Ltd filed Critical Kansai Nippon Electric Co Ltd
Priority to JP58147866A priority Critical patent/JPS6039790A/en
Publication of JPS6039790A publication Critical patent/JPS6039790A/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 技術分野 この発明は有機型ELに関し、より詳しくはその端子構
造の改良に関する。
DETAILED DESCRIPTION OF THE INVENTION Technical Field The present invention relates to an organic EL, and more particularly to an improvement in its terminal structure.

背景技術 11CLは基本的には少なくとも一方が透明である一対
の電極間に、電界発光する発光層を挾持した構造を有す
る。このKLVcは従来大別して、無機型(またはホー
ロー型)と有機型(またはプラスチック型)とがある。
Background Art 11CL basically has a structure in which an electroluminescent layer that emits light is sandwiched between a pair of electrodes, at least one of which is transparent. This KLVc is conventionally broadly classified into inorganic type (or enamel type) and organic type (or plastic type).

後者は前者に比較して、薄型、軽量、高輝度の利点を有
し、最近では後者のものが賞用されている。
The latter has advantages over the former in that it is thinner, lighter, and has higher brightness, and the latter has been more popular recently.

第1図はこの種の有機型ELの一部を切り欠いた平面図
を示し、第2図は第1図のn−u線に沿う断面図を示す
。図において、1はKL素子で、このKL素子1は2枚
の透明樹脂外皮フィルム2゜3によって上下から挾持さ
れ、両外皮フィルム2゜3のEL素子1からはみ出す周
辺部が熱圧着によって封止されている。前記EL素子1
は、透明樹脂フィルム4と、透明導電膜5と、この透明
導電膜5上の周辺部に例えばL字状に形成された集電帯
6と、集電帯6に電気的に接続され外部に導出されたり
一部7と、発光層8と、反射絶縁層9と、背面電極層1
0と、この背面電極層10に電気的に接続されたり一部
11とで構成されている。
FIG. 1 shows a partially cutaway plan view of this type of organic EL, and FIG. 2 shows a sectional view taken along line nu in FIG. 1. In the figure, 1 is a KL element, this KL element 1 is sandwiched from above and below by two transparent resin outer films 2゜3, and the peripheral parts of both outer films 2゜3 that protrude from the EL element 1 are sealed by thermocompression bonding. has been done. Said EL element 1
consists of a transparent resin film 4, a transparent conductive film 5, a current collecting band 6 formed in, for example, an L-shape around the transparent conductive film 5, and a current collecting band 6 electrically connected to the current collecting band 6 and connected to the outside. a portion 7, a light emitting layer 8, a reflective insulating layer 9, and a back electrode layer 1.
0 and a portion 11 electrically connected to this back electrode layer 10.

上記のKLは例えば次のようにして製造されている。ま
ず、第3図に示すように、透明樹脂フィルム4上に透明
導電膜5を形成した透明導電フィルムを用意し、透明導
電膜5上にL字状に導電ペーストを塗布して集電帯6を
形成几、この集電帯6にリン青銅薄板よりなるリード7
を電気的機械的に接続固着する。一方、第4図に示すよ
うに、アルミニウム箔よりなる背面電極層10上に、有
機誘電体中に白色絶縁物粉末を混入した反射絶縁層9を
形成し、この反射絶縁層9上に、有機誘電体中に螢光体
を分散させた発光層8を形成し、前記背面電極層10に
リード11を電気的機械的に接続固着する。
The above KL is manufactured, for example, as follows. First, as shown in FIG. 3, a transparent conductive film in which a transparent conductive film 5 is formed on a transparent resin film 4 is prepared, and a conductive paste is applied on the transparent conductive film 5 in an L-shape to form a current collecting band 5. A lead 7 made of a thin phosphor bronze plate is attached to the current collecting band 6.
to be electrically and mechanically connected and fixed. On the other hand, as shown in FIG. 4, a reflective insulating layer 9 made of an organic dielectric mixed with white insulating powder is formed on the back electrode layer 10 made of aluminum foil. A light emitting layer 8 in which a fluorescent material is dispersed in a dielectric material is formed, and a lead 11 is electrically and mechanically connected and fixed to the back electrode layer 10.

そして、上記第3図の構体と第4図の構体とを、透明導
電膜5と発光層8の面をもって第5図のように圧着一体
化し、図示一点鎖線12部分を切断すると、第6図のよ
うなFiL素子lが得られる。
Then, the structure shown in FIG. 3 and the structure shown in FIG. 4 are integrated by pressure bonding with the surfaces of the transparent conductive film 5 and the light emitting layer 8 as shown in FIG. A FiL element l is obtained.

次に、このEL素子lを、第7図に示すように、2枚の
樹脂外皮フィルム2,3によって所定間隔で挾持し、熱
圧着ローラ間全通すことにより、両外皮フィルム2,3
のEL素子1からはみ出す周辺部分を熱圧着して封止し
、図示一点鎖線13から切断すると、第8図のようなm
L14が得られる。このEL14のり一部7,11の引
出方向以外の3辺14a、14b、14cは切断によっ
て直線状にできるが、リード7.110引出方向の一辺
14dは切断できないため、蛇行状になりやすい。この
ため、寸法精度の高いELI7)製造が困難であった。
Next, as shown in FIG. 7, this EL element 1 is sandwiched between two resin outer films 2 and 3 at a predetermined interval, and passed through between the thermocompression rollers.
When the peripheral portion protruding from the EL element 1 is sealed by thermocompression bonding and cut along the dashed line 13 shown in the figure, it becomes m as shown in FIG.
L14 is obtained. The three sides 14a, 14b, 14c of the EL14 glue portions 7, 11 other than the direction in which they are drawn out can be cut into a straight line, but one side 14d in the direction in which the lead 7.110 is drawn out cannot be cut, so they tend to become meandering. For this reason, it was difficult to manufacture ELI7) with high dimensional accuracy.

また、」二記のようにリード7.11を引き出す構造で
は、第5図に示す圧着工程や、第7図に示す熱圧着封止
工程で、リード7.11のために大型の圧着ローラや熱
圧着ローラが必要で、設備費が嵩むのみならず、リード
7.11が移動したり、折れ曲ったすしやすいという欠
点があった。
In addition, in the structure for pulling out the lead 7.11 as shown in item 2, in the crimping process shown in FIG. 5 or the thermocompression sealing process shown in FIG. A thermocompression roller is required, which not only increases equipment costs, but also has the disadvantage that the leads 7 and 11 are easily moved or bent.

発明の開示 それゆえ、この発明は寸法精度の高いかつ製造容易な有
機型KLを提供−(多ことを目的とする。
DISCLOSURE OF THE INVENTION Therefore, the present invention provides an organic KL with high dimensional accuracy and ease of manufacture.

この発明は要約すると、樹脂外皮フィルム間のEL素子
よりI″iみ出す部分に内部端子を配設し、樹脂外皮フ
ィルムの外側からこの樹脂外皮フィルムを貫通して前記
内部端子に゛電気的機械的に擦耗1された外部端子を設
けたことを特徴とするものである0 すなわち、この発明の有機型KLは、EL素子に長いリ
ードを電気的機械的に接続固着しなl/)で、短小な内
部端子を接続固着するのみである力・ら、圧着ローラは
従来よりも格段に幅の小さし・ものでヨイ。また、樹脂
外皮フィルムによるKL素子の熱圧着封止時もリードが
突出しなし1ので、熱圧着ローラも従来より格段に幅の
小さし・ものでよく、設備費の低減が図れる。ざらに、
内部端子は樹脂外皮フィルムより突出しないので、従来
のようなリードの移動や折れ曲りも発生しにくし1゜し
力・も、樹脂外皮フィルムによりEL素子の熱圧着封止
後に、リードの引出方向の縁も切断整形できるので、寸
法精度の高い有機型KLが得られる。
In summary, the present invention provides an internal terminal in a portion of the EL element protruding from the EL element between the resin outer films, and penetrates the resin outer film from the outside of the resin outer film to connect the internal terminal with an electrical device. In other words, the organic type KL of the present invention is characterized in that it is provided with an external terminal that is subject to wear and tear.0 In other words, the organic type KL of the present invention does not require a long lead to be electrically and mechanically connected to the EL element. In addition, the pressure roller that only connects and secures short and small internal terminals requires a much smaller width than conventional ones.Also, when sealing the KL element with thermocompression with the resin outer film, the leads are Since there is no protrusion 1, the width of the thermo-compression roller can be much smaller than before, which reduces equipment costs.Roughly,
Since the internal terminals do not protrude beyond the resin outer film, the leads do not move or bend as in the conventional case. Since the edges of the KL can also be cut and shaped, an organic KL with high dimensional accuracy can be obtained.

発明を実施するための最良の形態 以下に、この発明の実施例を図面を参照して説明する。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

第9図はこの発明の有機型ELの一部を切り欠いた平面
図を示し、第10図は第9図のX−X線に沿う分解断面
図を示し、第11図は第9図のX−X線に沿う要部拡大
断I−図を示す。
FIG. 9 shows a partially cutaway plan view of the organic EL of the present invention, FIG. 10 shows an exploded cross-sectional view taken along the line X-X in FIG. 9, and FIG. An enlarged sectional I-view of the main part along the line XX is shown.

図において、次の点を除いては、第1図および第2図と
同様であり、同一部分または対応部分には同一参照符号
を何している。第1図および第2図と相違する点は、透
明導電膜5および背面N極層lOから直接外部にリード
を導出しないで、短小な内部端子15.16全電気的機
械的に接続固着し、面内部端子15.16全体がかくれ
るように樹脂外皮フィルム2.3の周辺部分を熱圧着封
止し、これら内部端子15.16に対して、樹脂外皮フ
ィルム2,3の上から、第12図に示すような、外部端
子1’7 、18の爪部17a、17a、18a、18
aを貫通させて裏面で折り曲げることにより、内部端子
15.16と外部端子1’7.18を電気的機械的に接
続固着したものである。
The figure is similar to FIGS. 1 and 2 except for the following points, and the same or corresponding parts are designated by the same reference numerals. The difference from FIGS. 1 and 2 is that the leads are not led out directly from the transparent conductive film 5 and the back N-pole layer 10, but the short internal terminals 15 and 16 are all electrically and mechanically connected and fixed. The periphery of the resin outer film 2.3 is sealed by thermocompression so that the entire internal terminals 15.16 are hidden, and the 12th As shown in the figure, the claw portions 17a, 17a, 18a, 18 of the external terminals 1'7, 18
The internal terminal 15.16 and the external terminal 1'7.18 are electrically and mechanically connected and fixed by penetrating the terminal a and bending it on the back surface.

上記有機型ELは次のようにして製造される。The above organic EL is manufactured as follows.

まず、第13図に示すように、透明樹脂フィルム4上に
透明導電膜5全形成した透明導電フイルム牙用意し、透
明導電膜5上に所定間隔でL字状に導電ペーストを塗布
して集電帯6を形成し、各集電帯6の所定位置に、内部
端子15を電気的機械的に接続固着する。
First, as shown in FIG. 13, a transparent conductive film 5 in which a transparent conductive film 5 is entirely formed on a transparent resin film 4 is prepared, and a conductive paste is applied on the transparent conductive film 5 in an L-shape at predetermined intervals. Electrical bands 6 are formed, and internal terminals 15 are electrically and mechanically connected and fixed at predetermined positions on each current collecting band 6.

次に、第14図に示すように、アルミニウム箔よりなる
背面電極層10上に、反射絶縁層9′および発光層8を
積層形成し、背面電極層10の下面に所定間隔で内部端
子16を電気的機械的に接続固着する。
Next, as shown in FIG. 14, a reflective insulating layer 9' and a light emitting layer 8 are laminated on the back electrode layer 10 made of aluminum foil, and internal terminals 16 are formed at predetermined intervals on the lower surface of the back electrode layer 10. Fix the connection electrically and mechanically.

こののち、第15図に示すように、第13図に示す構体
と第14図に示す構体と全、透明導電膜5と発光層8の
面全もって重ね合せて、圧着ローラを通して両者を圧着
一体化する。続いて、図示一点鎖線19から切断すると
、第16図のようなEL素子1が得られる。なお、内部
端子15.16は前記第15図の圧着工程で接続固着し
てもよいし、特に内部端子16については、圧着一体化
後または切断後に接続固着してもよい。
After this, as shown in FIG. 15, the structure shown in FIG. 13 and the structure shown in FIG. become Then, by cutting along the dashed line 19 shown in the figure, the EL element 1 as shown in FIG. 16 is obtained. Note that the internal terminals 15 and 16 may be connected and fixed in the crimping process shown in FIG. 15, and the internal terminals 16 in particular may be connected and fixed after being crimped and integrated or after being cut.

次に、このKL素子lを、第17図に示すように、長尺
の2枚の樹脂外皮フィルム2,3間に所定間隔で配置し
、熱圧着ローラを通して、樹脂外皮フィルム2,3のE
’L素子1からはみ出す周辺部分を熱圧着封止する。
Next, as shown in FIG. 17, this KL element l is placed between two long resin outer films 2 and 3 at a predetermined interval, and passed through a thermocompression roller to form an E of the resin outer films 2 and 3.
'The peripheral portion protruding from the L element 1 is sealed by thermocompression.

上記第15図の圧着工程および第17図に示す熱圧着封
止工程に1いて、赫来のように長。・・ノードを導出し
ておらず、短小な内部端子15.16を有するのみであ
るから圧着ローラおよび熱圧着ローラは、従来に比し格
段に幅の小さいものでよい。
The crimping process shown in FIG. 15 and the thermocompression sealing process shown in FIG. Since no nodes are led out and only short internal terminals 15 and 16 are provided, the pressure roller and thermocompression roller need be much smaller in width than conventional ones.

しかも、内部端子15.16の移動や折れ曲りも起らな
い。続いて、樹脂外皮フィルム2,3の内部端子15.
16側の周縁を所定寸法だけ切断除去し、樹脂外皮フィ
ルム2の上から、外部端子1’7.18の爪部1’7a
、18aを内部端子15.16に貫通させて樹脂外皮フ
ィルム3の裏面で折り曲げることによって、外部端子1
7.18を内部端子15.16に接続固着する。
Furthermore, the internal terminals 15 and 16 do not move or bend. Next, the internal terminals 15 of the resin outer films 2 and 3 are connected.
The peripheral edge on the 16 side is cut and removed by a predetermined dimension, and the claw portion 1'7a of the external terminal 1'7.
, 18a are passed through the internal terminals 15 and 16 and bent on the back side of the resin outer film 3, thereby forming the external terminal 1.
Connect and secure 7.18 to internal terminal 15.16.

最後に、図示一点鎖線20から切断すると、第18図に
示すEL14が得られる。
Finally, by cutting along the dashed line 20 shown in the figure, the EL 14 shown in FIG. 18 is obtained.

なお、一点鎖線20から切断後に外部端子17゜18を
接続固着するようにしてもよい。
Note that the external terminals 17 and 18 may be connected and fixed after cutting from the dashed line 20.

上記のようにして製造した・この発明の有機型ETJは
、長いリードを接続固着した状態で圧着一体化ないL熱
圧着封止しないので、量産性が向上し、また熱圧着封止
の信頼性も向上する。さらに、外部端子は熱圧着封止後
に取り付けるので、板厚の制限がなくなり、従来よりも
板厚を大きくてきるので強度が向上し、リード曲りが発
生しなくなるのみならず、例えば外部端子17.18を
直接ソケットに挿入して外部回路と接続することもでき
る。
The organic ETJ of the present invention manufactured as described above does not require integral crimping or thermocompression sealing with long leads connected and fixed, so mass production is improved and the reliability of thermocompression sealing is improved. It also improves. Furthermore, since the external terminals are attached after thermocompression sealing, there is no limit to the board thickness, and the board thickness can be made larger than before, which not only improves the strength and prevents lead bending, but also prevents the external terminals 17. 18 can also be directly inserted into a socket and connected to an external circuit.

なお、外部端子17.18の板厚に比較して内部端子1
5.16の板厚を十分小さくしておけば、外部端子17
.18の爪部17a、18aを直接内部端子15.16
に貫通できるが、もし必要ならばあらかじめ内部端子1
5.16に爪部17a、18a挿通用の切れ目等を形成
しておいてもよい。
Note that the thickness of the internal terminal 1 is smaller than that of the external terminals 17 and 18.
5. If the plate thickness of 16 is made sufficiently small, the external terminal 17
.. The claws 17a and 18a of 18 are directly connected to the internal terminals 15 and 16.
However, if necessary, please connect internal terminal 1 in advance.
Cuts or the like for insertion of the claw portions 17a and 18a may be formed in 5.16.

【図面の簡単な説明】[Brief explanation of drawings]

第1図お°よび第2図は従来の有機型KLを示し、第1
図は一部を切り欠いた平面図、第2図は第1図の]−■
線に沿う断面図である。 第3図ないし第8図は上記ELの製造方法について説明
するための各段階の平面図である。 第9図ないし第11図はこの発明の有機型KLを示し、
第9図は一部を切り欠いた平面図、第10図は第9図の
X −X線に沿う分解断面図、第11図は第9図のM−
XI線に沿う要部拡大断面図である。 第12図はこの発明の有機型KLに用いる外部端子の一
例の拡大斜視図である。 第13図ないし第18図はこの発明のELの製造方法に
ついて説明するための各段階の平面図である。 l・・・・・・KL素子、 2.3・・・ 樹脂外皮フィルム、 15.16 ・・・内部端子、 17.18・・・・・・外部端子。 第3図 ]o 9 8 第5図 第7図 第6図 第8図 第9図 第10図 ]7 第]]図 17(18) 17a(18a) 第13図 ]5 第14図 ]6 第15図 第17図 ]5 116 図 第11 図 0 寸
Figures 1 and 2 show conventional organic type KL;
The figure is a partially cutaway plan view, Figure 2 is the same as Figure 1] -■
It is a sectional view along a line. FIGS. 3 to 8 are plan views of each stage for explaining the method for manufacturing the EL. 9 to 11 show organic type KL of the present invention,
Fig. 9 is a partially cutaway plan view, Fig. 10 is an exploded cross-sectional view taken along the line X-X in Fig. 9, and Fig. 11 is an M--
FIG. 3 is an enlarged cross-sectional view of the main part taken along line XI. FIG. 12 is an enlarged perspective view of an example of an external terminal used in the organic type KL of the present invention. FIGS. 13 to 18 are plan views of each step for explaining the EL manufacturing method of the present invention. l... KL element, 2.3... resin outer film, 15.16... internal terminal, 17.18... external terminal. Figure 3] o 9 8 Figure 5 Figure 7 Figure 6 Figure 8 Figure 9 Figure 10] 7 ]] Figure 17 (18) 17a (18a) Figure 13] 5 Figure 14] 6 Figure 15 Figure 17] 5 116 Figure 11 Figure 0 Dimensions

Claims (1)

【特許請求の範囲】 EL素子を上下より樹脂外皮フィルムで挾んでE、 L
素子よりはみ出す周辺部分を熱圧着封止してなる有機型
ELvcおいて、 前記KL素子よりはみ出す周辺部分に内部端子を配設し
、樹脂外皮フィルムの外側からこの樹脂外皮フィルムを
貫通して前記内部端子に電気的機械的に接続固着された
外部端子を設けたことを特徴とする有機型EL0
[Claims] E and L are made by sandwiching an EL element between upper and lower resin outer films.
In an organic type ELvc in which the peripheral part protruding from the element is sealed by thermocompression, an internal terminal is arranged in the peripheral part protruding from the KL element, and the internal terminal is penetrated from the outside of the resin outer film to the inside. Organic type EL0 characterized by having an external terminal electrically and mechanically connected and fixed to the terminal.
JP58147866A 1983-08-11 1983-08-11 Organic el Pending JPS6039790A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58147866A JPS6039790A (en) 1983-08-11 1983-08-11 Organic el

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58147866A JPS6039790A (en) 1983-08-11 1983-08-11 Organic el

Publications (1)

Publication Number Publication Date
JPS6039790A true JPS6039790A (en) 1985-03-01

Family

ID=15440008

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58147866A Pending JPS6039790A (en) 1983-08-11 1983-08-11 Organic el

Country Status (1)

Country Link
JP (1) JPS6039790A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6240798U (en) * 1985-08-30 1987-03-11
JPS62118397U (en) * 1986-01-18 1987-07-27
JPS62157096U (en) * 1986-03-27 1987-10-06
JP2007537576A (en) * 2004-05-11 2007-12-20 ワールド・プロパティーズ・インコーポレイテッド Flexible EL lamp with reinforced leads
JP2016024949A (en) * 2014-07-18 2016-02-08 株式会社デンソー Organic semiconductor device and manufacturing method for the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57204694A (en) * 1981-06-12 1982-12-15 Hitachi Ltd Multi-frequency signal receiver

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57204694A (en) * 1981-06-12 1982-12-15 Hitachi Ltd Multi-frequency signal receiver

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6240798U (en) * 1985-08-30 1987-03-11
JPS62118397U (en) * 1986-01-18 1987-07-27
JPS62157096U (en) * 1986-03-27 1987-10-06
JP2007537576A (en) * 2004-05-11 2007-12-20 ワールド・プロパティーズ・インコーポレイテッド Flexible EL lamp with reinforced leads
JP2016024949A (en) * 2014-07-18 2016-02-08 株式会社デンソー Organic semiconductor device and manufacturing method for the same

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