JPS6032393A - Method of producing multilayer circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] Engineering, [Contact field] 13 The present invention is applicable to mechanical instruments, electronic devices, communication devices, calculations 1
1. Regarding the manufacturing method of multilayer circuit boards used in 4 devices, etc.
It is something that

16 [Background technology] 1□ Conventionally, multilayer circuit boards have a metal foil with adhesive on the inner layer material,
8 or 19 on the inner layer material via a resin-impregnated base material.
It is obtained by stacking single-sided metal-clad laminates and then laminating them to form a 2O unit, but it has the drawback that the adhesive strength between the inner layer material and the outer layer material is relatively weak, especially when the adhesive strength is extremely reduced when heated. Ta.

[Object of the Invention] An object of the present invention is to improve the adhesive force between the inner layer material and the outer layer material.

[Disclosure of the invention]

The present invention relates to a method for producing a multilayer circuit board, which is characterized in that the surface of the inner layer material is roughened in advance and then laminated and molded with the outer layer material via an adhesive material to be integrated.Details of the present invention are as follows. Explain. The inner layer material used in the present invention is based on an electrical laminate that can form an electric circuit on its surface, such as a metal-clad laminate, an additive laminate, a flexible laminate, a metal-based laminate, etc., and has a circuit on its surface. Although the material in general is not particularly limited, it is necessary to roughen the surface of the oral material in advance. Although the degree of surface roughening is not particularly limited, it is preferable that the roughness is 1 to 15 microns. That is, if the temperature exceeds 1 micron, the adhesive force with the outer layer material tends to decrease, and if it exceeds b micron, the circuit tends to be damaged. The surface roughening method may include mechanical polishing methods such as puff polishing, sandblasting polishing, and sander polishing, or chemical polishing methods such as chemically etching with a potassium dichromate solution. It is not particularly limited, and may be used in combination with target polishing. In the case of the outer layer material or metal foil, adhesive applied to the metal foil is mainly used as the adhesive material, and in the case of the outer layer material being a single-sided metal-clad laminate, a resin-impregnated base material is mainly used. Since the adhesive material and the outer layer material can be used in combination with an adhesive, commonly used adhesive materials and outer layer materials can be used as they are, and are not particularly limited. Furthermore, the inner layer material can be applied not only to those with circuits on one side but also to those with circuits on both sides, and in addition, the inner layer material can be multilayered by using multiple layers instead of one layer. Lamination molding involves laminating and integrating using a hydraulic press, multi-roll, narrow-end belt, drum, etc. The present invention will be described in detail below using examples.

Example 1 A double-sided copper-clad epoxy resin laminate with a thickness of 1.2 wx was used as an inner layer material by forming circuits on both sides, and then the surface of the inner layer material was sandblasted to form irregularities with a depth of 7 to 13 a. After that, two sheets of epoxy resin-impregnated glass cloth with a thickness of 0.1 mm were interposed on the lower surface, and then two sheets of glass cloth with a thickness of 1.2 mm were interposed on each layer.
Single-sided copper-clad laminates of gourd were stacked and heated and pressed at 170° C. and 40% for 60 minutes to obtain a four-layer circuit board.

Example 2 A single-sided copper-clad aluminum plate with a thickness of 1.2 mm was used as the base, and a circuit was formed on the copper foil side to form an inner layer material.The surface of the inner layer material was then treated with a potassium dichromate solution to a depth of 2~ After creating 6 unevennesses, a piece of epoxy resin-impregnated glass cloth with a thickness of 0.1 mm was interposed on the surface, and then a thickness of 0.035 trm was created.
The copper foils were stacked and heated and pressed at 170 Cs 40 yen for 60 minutes to obtain a two-layer circuit board.

Conventional Example 2 A 4-layer circuit board was obtained by processing the same as in Example 1 except that the inner layer material surface of Example 1 was used without roughening.Conventional Example 2 The inner layer material surface of Example 2 was roughened. A two-layer circuit board was obtained by processing in the same manner as in Example 2, except that no liquid was used. As shown in Table 1, it was confirmed that the performance of the multilayer circuit board of the present invention was well achieved by the method of manufacturing the multilayer circuit board of the present invention.

Pour rice onto molten solder at 260°C and observe the time until delamination occurs.

Claims (1)

[Scope of Claims] 5(1) A multilayer circuit characterized in that the surface of the inner layer material is roughened in advance and then laminated with the outer layer material via an adhesive abrasive material 7 to be integrated. Method of manufacturing the board. 8(2) The polyurethane according to claim 1, wherein the surface roughening is unevenness with a depth of 1-ls microns.
A method for manufacturing an o-layer circuit board.