JPS6031636B2 - Flat type electronic component transfer and characteristic sorting device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an electronic component transfer device using a vacuum chuck.

Conventionally, when testing the characteristics of a dual-type IC package, which is a rectangular electronic component shown in Figure 5, the terminals of the dual-type IC package are used as guides to slide them under the ceramic layer or resin layer. The terminals of the IC package are transferred to the socket of the characteristic testing device, and a characteristic test is performed by inserting the terminals of the IC package into the socket of the characteristic testing device.Then, the IC package is removed from the socket, and the terminals are guided and strained based on the characteristic test results. Traditionally, the materials were slid under the resin layer and then sorted and stored in designated storage boxes.

However, since the IC package shown in Figure 5b is a flat type with terminals protruding on all sides, it was not possible to perform a characteristic test using the method described above, and the IC package was sucked into the socket of a characteristic testing device using a pair of tweezers. After carrying one by one by hand and setting the IC packages so that their terminals fit into the grooves of the sockets, I held the IC packages down with a clamp to test their characteristics, then removed the clamps, and sucked up the IC packages again with tweezers. In the past, materials were sorted and stored in predetermined storage boxes based on the results of characteristic tests. Therefore, there is a drawback that it takes time to set the IC package in the characteristic testing device. The present invention obviates the above-mentioned drawbacks, it comprises a set of tools with a V-shaped concave inner wall surface that bears against the outer surface of a rectangular shaped electronic component, and the tool is A chuck is provided with V-shaped inner wall surfaces facing each other and connected by an elastic member, and the chuck is provided with a cylinder that expands the tool against the elastic force of the elastic member, and the chuck is fixed to a handling arm. This can be achieved by providing an electronic component transfer device characterized by the following.

Examples of the present invention will be described in detail below.

FIG. 1 is a schematic diagram of an electronic component transfer device using the vacuum chuck of the present invention. When picking up the IC package 8 on the conveyor 18 using a vacuum chuck, a stage that can be moved and finely adjusted in the x, y, and z directions is used to remove the IC package 8 on the conveyor 18.
A microcomputer controls the vacuum chuck so that it is positioned directly above the C package. Move stage 16 to cylinder 13
The stage 17 is moved in the x direction by x, and the stage 17 is moved in the y direction by the air cylinder 13y. Next, the arm attached to the shaft 15
The arm 12 is moved in the z direction using a motion cylinder 13z.
Note that the IC package is always set at a predetermined position on the conveyor in a fixed direction. Next, the solenoid valve is turned on, high pressure air is sent from the tube z to the air cylinder 1, and the chuck 6 is opened by pushing the stopper 3 with the piston. Next, by turning on the solenoid valve and suctioning from the tube 11, the suction tube 7 sucks up the IC package 8. Then, when the solenoid valve is turned off and the air cylinder 1 is turned off, the chuck 6 is pulled back by the coil spring 4. , the IC is positioned inside the chuck 6. FIG. 2 is a schematic plan view of a stage for moving a vacuum chuck for transferring electronic components.

17 is an air cylinder 13y, a stage that moves in the y direction, and 16 is an air cylinder 13x, which moves on the stage 17 in the x direction.
It is a stage that moves in the direction.

9 is the head portion of the vacuum chuck.

First, stage 16 is moved to the A list. stage 16
When the vacuum chuck 9 attached to the shaft 15 on the stage 16 by the arm 12 moves to the A' position, the vacuum chuck 9 is moved to the A' position.
Get into position. There is an IC directly under the vacuum chuck 9 at position A'.
A package is placed on conveyor 18. Therefore, as shown in FIG. 1, the arm 12 attached to the shaft 16 of the vacuum chuck is moved downward by the gear cylinder 13z, and the IC package is positioned within the vacuum chuck by the above-described method of gripping the IC package. Next, after confirming that the IC package 8 is securely gripped in the chuck by a pressure sensor attached to the vacuum system, the arm 12 is lifted upward by the spring 14 by turning off the air cylinder 13z. Next, as shown in FIG. 2, the stage 16 is moved from the position A to the position B using the movement cylinder 13x. When the stage 16 is moved to the B position, the vacuum chuck 9 comes to the B' position. Since a characteristic testing device is placed directly below the vacuum chuck at position B', the arm 12 attached to the shaft 15 is moved downward by the gear cylinder 13z, and the terminal of the IC package is placed on the characteristic testing device terminal (socket). Perform a characteristic test with the product placed and pressed down. Air cylinder 13 after characteristic test
By turning off z, arm 12
4 lifts it upward. Next, based on the characteristic test results, the IC package is placed on the conveyor for good and defective products. If the IC package is good, the stage 16 is moved to position A using the moving cylinder 13x. Next, the vacuum chuck is lowered using the gear cylinder 13z, and the IC package is placed on the non-defective Kosobair 18 in the reverse process to the process of gripping the IC package described above. If the IC package is defective, as shown in FIG.
move to position. Next, the stage 16 is moved from the C position to the D position using the mover cylinder 13x. stage 16
When moved to position D, the vacuum chuck will come to position 〇.
There is a conveyor 19 for defective products directly below the vacuum chuck at position D', so lower the vacuum chuck with the air cylinder 13z and transfer the defective IC package to the conveyor 19 for defective products.
put on top. Next, after moving the vacuum chuck upward, the stage 17 is moved from the solid line F position to the dotted line E position using the mover cylinder 13y. Then the next characteristic test IC
Move the conveyor 18 so that the package is directly under A'.
Move by step. Then repeat the above process,
Perform the following IC package characteristic test. Although this embodiment deals with the case where there is only one vacuum chuck system, it is possible to use a plurality of vacuum chuck systems to shorten the time required to test the characteristics of an IC package or to improve efficiency. FIG. 3 is a sectional view of the vacuum chuck of the present invention, and FIG. 4 is a schematic diagram showing the operation of gripping an IC package with the chuck.

As shown in the figure, the chuck 6 includes a set of tools 6c and 6d having inner wall surfaces 6a and 6b that support the outer surface of the electronic component, which is a V-shaped recess.

When high pressure air is introduced into the air cylinder from the tube 2, the piston 1' pushes against the stopper 3, causing the chuck 6 to open against the elastic force of the spring 4, as shown in FIG. 4b. Also, when the air cylinder 1 is turned off, the
The chuck 6 is closed by the spring 4 as shown in FIG. The chuck 6 is opened and closed by the bolt 5' moving the guide structure 5'' from side to side.The IC package 8 is sucked into the vacuum chuck by suctioning from the tube 11 as shown in FIG. , the IC package 8 is sucked up by the suction tube 7 inside the chuck.The IC package 8 is sucked up by the suction tube 7 using a pressure-sensitive sensor attached to the vacuum system.
After confirming that the air is being sucked up into the air cylinder,
1 is turned off, the IC package is held between chucks 6 and aligned with an accuracy of about 0.1 to 0.2. Note that the suction tube 7 has a structure that allows it to be moved up and down slightly. All of the above-mentioned operations, such as controlling the position of the vacuum chuck, turning on and off the solenoid valve for opening and closing the chuck, and turning on and off the solenoid valve of the vacuum system for suctioning the IC package, are controlled by Combu-I. As is clear from the above description, by using the electronic component transfer device using the vacuum chuck of the present invention, it has become possible to perform characteristic tests on IC packages in a shorter time than in the past.

In other words, conventionally it took about 10-odd seconds to sandwich an IC package with tweezers and set it in a testing device, but with the present invention it can be done in about 0.5 seconds. It became so. Furthermore, the electronic component transfer device using the vacuum chuck of the present invention can be applied to IC packages of different shapes or other electronic components, etc. by processing the shape of the chuck part to match the IC package. . In addition, the electronic component transfer device of the present invention can be used for IC package replacement work, auto handler,
Most other objects that can be handled by humans can be handled and can be used in a wide range of ways. In this embodiment, an example is given in which the chuck is opened and closed using two air cylinders, but a structure in which the chuck is opened and closed using one air cylinder may also be used.

[Brief explanation of drawings]

FIG. 1 is a schematic diagram of an electronic component transfer device using the vacuum chuck of the present invention, FIG. 2 is a schematic plan view of a stage for moving the vacuum chuck, FIG. 3 is a sectional view of the vacuum chuck of the present invention, and FIG. The figure is a schematic diagram showing the operation of gripping an IC package with a chuck, and FIG. 5 is a schematic diagram of the IC package. 1: Air cylinder, 3: Stopper, 4: Spring, 5,
5': Bolt, 5'': Guide groove for bolt 5', 6: Chuck, 7: Suction tube, 8: IC package, 9
: Head of vacuum chuck, 12: Arm, 13×, 1
3y, 13z: air cylinder, 14: spring, 15: shaft, 16: x direction stage, 17: y direction stage, 18: conveyor, 19: defective product conveyor. Figure 4, Figure 2, Figure 3, Figure 5

Claims (1)

[Claims] 1. A set of tool parts having a V-shaped concave inner wall surface that comes into contact with the outer surface of a flat electronic component, an elastic member that elastically clamps the tool parts, and A chucking mechanism that includes an air cylinder that slides as a guide in a guide groove and expands against the elastic force of the elastic member, and a suction system that includes a vertically movable suction tube that sucks and holds the flat electronic component. A flat electronic component comprising: a vacuum chuck; a drive mechanism for moving the vacuum chuck in a three-dimensional direction; a control system for controlling the suction system; the chucking mechanism; and the drive mechanism. Transfer device. 2. A first transfer system for placing and transferring a flat type electronic component, a suction system for suctioning and holding the flat type electronic component, and a chuck for aligning the flat type electronic component suctioned and held by the suction system with a predetermined accuracy. a vacuum chuck having a mechanism, and an x, y mechanism for moving the vacuum chuck in three-dimensional directions.
, a z stage system, a drive mechanism for the stage system, a characteristic testing device system for placing the terminal of the flat type electronic component suctioned and held by the vacuum chuck on the terminal and performing a characteristic test in a pressed state; a second transfer system that performs selective transfer based on the characteristic test results; a control system that controls the transfer system; the suction system; the chucking mechanism; the drive mechanism of the stage system; and the characteristic testing device system. What is claimed is: 1. A characteristic sorting device for flat type electronic components, characterized by having the following characteristics.