JPS6029650A - multifunctional sensor - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Detailed Description of the Invention [Field of Application of the Invention] The present invention relates to a sensor that detects atmospheres such as temperature and humidity in order to improve living comfort, and particularly relates to a sensor that can detect two or more atmospheres. Regarding functional sensors.

- [Background of the Invention] Multifunctional sensors are currently being developed in order to obtain comfortable living by detecting the temperature and humidity in living spaces, the radiation temperature from walls, etc.

On the other hand, with the pursuit of comfortable living conditions, there has been a movement toward improving safety in addition to the above-mentioned temperature and humidity.
There is an increasing demand for the development of multifunctional sensors.

For example, in addition to livability, there is a growing movement toward safety, such as gas leak alarms such as city gas and LPG gas, and various security alarms.

Among these, for example, a humidity sensor that detects the humidity in the atmosphere or a gas sensor that detects gas leakage requires a heating mechanism.

To explain the humidity sensor first, the humidity sensor is made using a metal oxide as a main raw material, and detects relative temperature by utilizing changes in the electrical resistance value of this metal oxide semiconductor.

This humidity sensor is used by being directly exposed to the atmosphere. Therefore, dust in the atmosphere adheres to the surface of the sensor element, causing errors in detection accuracy and detection sensitivity, resulting in negative effects such as false alarms.

In order to eliminate this adverse effect, a heater is integrally molded into this type of sensor, and the attached dust is burned off and removed. A so-called heating cleaning method is employed.

Furthermore, in order to improve detection sensitivity, a heater is integrally molded in the gas sensor, and the gas sensor is always maintained at an elevated temperature.

These sensors that require heating need to be mounted with insulation in mind from the viewpoint of reducing power supplied to the heater and improving thermal efficiency.

In order to realize this heat-insulating mounting, the inventors devised a method of heat-insulating mounting as shown in FIG.

In the figure, a sensor 1 in which a heater 3 is integrally molded on an insulating substrate 2 is suspended and heat-insulated mounted on a pin 6 erected on a stem 5 using a thin lead wire 4 made of Pt or the like.

However, when this adiabatic mounting is applied and mounted on a multifunctional sensor board, as shown in Fig. 2, the sensor 7 that requires heating and the various sensors 8 that do not require heating will be separated.
．． The stem 10 is necessary to thermally isolate the sensor 8-8# and various circuit components 9 that dislike heat, and to heat-insulate the sensor 7 that requires heating.

Therefore, when installing a large number of sensors that require heating, such as humidity sensors and gas sensors, a stem is required for each sensor, which requires a large amount of space, and there is a tendency for devices to become more multifunctional. The drawback is that it cannot satisfy the actual situation.

Furthermore, since it is necessary to take earthquake resistance into consideration when connecting the sensor section and the insulating substrate, the connection terminals must necessarily be made larger, and especially when a large number of sensors are mounted, heat is dissipated from the connection terminals. The disadvantage is that the heat resistance increases, and the power required for heating increases accordingly.

As described above, it is difficult to put a multi-functional sensor into practical use due to the problem of space for heat-insulating mounting and power for heating. The reality is that the development of

[Purpose of the invention]

The present invention has been made in view of the above circumstances, and aims to provide a multifunctional sensor that satisfies the requirements of miniaturization, earthquake resistance, heat insulation, and power saving.

[Summary of the invention]

That is, the present invention does not use a stem as in the past,
A sensor with a heating mechanism is integrally formed with other sensors and peripheral circuits on an insulating substrate, and an opening is provided in the insulating substrate, and the sensor with a heating mechanism is mounted inside the opening in adiabatic manner. , other sensors are mounted on the insulating substrate other than the above opening, and a power supply circuit for driving these multiple sensors, a detection circuit for detecting the sensor output, an arithmetic circuit for calculating the output from each sensor, etc. Peripheral circuits are integrally formed on the same insulating substrate.

[Embodiments of the invention]

An embodiment of the present invention will be described in detail below. FIG. 3 shows a multifunctional seven-piece device equipped with various sensors such as a thick film humidity sensor 11, a temperature sensor 13, and a radiation temperature sensor 14, 14'. 15 is a peripheral circuit.

The insulating substrate 16 is provided with an opening 12, and the thick film humidity sensor 11 is mounted in adiabatic manner within the opening 12.

In this way, various sensors 11.13.14.14'
and a peripheral circuit 15 are integrally formed on an insulating substrate 16.

FIG. 4 shows the adiabatic mounting of the thick film humidity sensor 11 in more detail.

In the figure, a heater 20 is integrally molded on the back surface of the thick film humidity sensor 11. This thick film humidity sensor 1
1 is mounted in an adiabatic manner in the opening 12 in a suspended state by a lead arm 22 of PT tape.

I will explain in more detail. First, thick film IM degree 7sen 11
We will explain the structure of

In FIG. 4, a lower electrode 24 is formed on the upper surface of an insulating substrate 19 made of alumina or the like using a thick film layer mainly composed of a conductive material such as platinum. A sensor section 25 is formed using a sensing material layer on the upper surface of this lower electrode 24, and an upper electrode 26 having the same name as the lower electrode 24 is further formed on the upper surface of this sensor section 25. Further, a heater 20 for heating the sensor section 25 is formed on the back surface of the insulating substrate 19.

The thick film moisture sensor 11 is constructed of the upper and lower electrodes 26 and 24 provided on both sides of the sensor section 25 and the heater 20 provided on the back surface of the insulating substrate 19.

The thick film humidity sensor 11 configured as described above is inserted into the opening 12.
The upper and lower electrodes 2624 and the terminals 27 and 28 of the heater 20 were welded with lead wires 22 mainly composed of PT, and the thick film humidity sensor 11 was mounted in the opening 12 in a suspended manner. .

In this embodiment configured as above, the seismic resistance and separation of the thick film humidity sensor 11 will be explained using FIG. 4. First, the seismic resistance will be explained. Insert the lead wire 22 into the opening 12.
It is suspended in the air by fixing it in four places. Therefore, the vibration of the thick film humidity cell 11 in the X direction is restrained by the tension and compressive force of the lead wire 22, and the vibration in the Y direction is restrained by the rigid force of the lead wire 22.

Vibration in the vertical direction is dampened by the attractive force and rigidity of the lead wire 22.

On the other hand, regarding insulation, since it is suspended in the air,
As in the conventional case, the heat dissipated by the air layer surrounding the thick film humidity sensor 11 is blocked, and the heat capacity of the terminal of the insulating substrate 16 to which the lead wire 22 is welded is small.
Less heat is conducted through the lead wire 22 and escapes.

Next, multifunctionalization will be explained. When sensors that require a heating mechanism, such as a humidity sensor and a gas sensor, are installed side by side, the size of the opening 12 can be made large enough to accommodate the two sensors, and the sensors can be installed side by side.

Also, due to the arrangement, the opening 12 can be provided at any location on the insulating substrate 16 to accommodate a sensor that requires a heater. Although a multifunctional sensor including a radiation temperature sensor has been described, it is of course possible to include a gas sensor, a wind speed sensor, etc. in addition to this.

〔Effect of the invention〕

As detailed above, according to the multifunctional sensor of the present invention, an opening is provided in the insulating substrate, and a sensor that requires a heater is provided in this opening, which improves earthquake resistance and saves power. In addition, a sensor that does not require a heater and a peripheral circuit are integrally molded on an insulating substrate, an opening is provided in this insulating substrate, and a sensor that requires a heater is placed in this opening. Since I built it in, it is of course possible to use an insulating substrate.
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This made it easier to incorporate the material, improving mass production, resulting in a lower price, and greatly increasing the value of the product.

More importantly, the installation space for sensors that require heaters is reduced, making it possible to mount a large number of sensors, and making it possible to put into practical use multifunctional sensors that support the pursuit of comfortable living. shoulder the effect of

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing a conventional adiabatic mounting of a sensor requiring a heater, and FIG. 2 is a perspective view of a conventional multifunctional sensor. FIG. 6 is a perspective view of a multifunctional sensor according to an embodiment of the present invention, and FIG. 4 is a perspective view showing an adiabatic mounting of the sensor that requires a heater in FIG. 3.
...Sensor 12 that requires a heater...
...Openings 13, 14.14'...Sensor 15...
... Peripheral circuit 16 ... Insulating board 20 ... Heater 22 ... Lead wire No. 4-port 2

Claims (1)

[Claims] An opening is provided in an insulating substrate, a sensor equipped with a heating mechanism is mounted inside the opening, and other sensors are mounted on the insulating substrate other than the opening, and a device for driving the plurality of sensors is provided. A multifunctional sensor characterized in that a power supply circuit, a detection circuit that detects sensor output, and an arithmetic circuit that calculates the output from each sensor are integrated on the same insulating substrate.