JPS6026837B2 - Masking device for masking - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to connectors used in various electronic devices, etc., which have a shape that is partially or intermittently connected, a connecting band shape with unevenness, or a connector that is partially or intermittently connected. thing,
A masking device that is used to continuously plate any desired position of a connected band-shaped material with uneven surfaces at high speed, and in particular, a masking device that allows the plating thickness to be partially changed. Regarding.

Connectors used in electronic devices are generally made of copper or copper alloys, and if they require high reliability, they have excellent electrical conductivity, corrosion resistance, abrasion resistance, and ease of soldering. Plating is required because such performance is required, and the plating is mainly gold plating, but depending on the application, various alloy platings may be used in addition to gold, rhodium, silver plating, and plating. It is something that is administered.

Conventionally, several methods have been used for plating materials with complex shapes such as connectors, but all of them have drawbacks and are not satisfactory.

Therefore, as a result of various studies, the present inventors discovered that while the material to be plated is continuously passed through a guide tunnel for transporting the material to be plated, which has a shape corresponding to the cross-sectional shape of the material to be plated, We discovered that if the plating solution is sprayed from a nozzle that doubles as a closed hair node, it is possible to plate any part of the material at high speed, even if the material has a complex shape. Therefore, he first proposed a ``high-speed continuous plating method'' (Special Seki Sho 50-16108Y).

The present invention further develops and improves this, and aims to provide a masking device in which the masking means having a guide tunnel is devised so that the thickness of plating applied to the surface of the material to be plated can be partially changed. It is something.

That is, the present invention specifically forms a guide tunnel having a shape corresponding to the cross section of the material to be plated, extending through the interior in the longitudinal direction, and inserting a plating liquid spray opening at a desired position on one or both sides of the guide tunnel from the outside. In the masking device for plating at the entrance, the above-mentioned closing liquid injection opening ○ is formed to extend in the longitudinal direction, and the number, position, and width of the lotus passage opening to the guide tunnel was problematic, so the length was changed. It is an object of the present invention to provide a masking device for plating, which is characterized in that the thickness of plating applied to the material to be plated is controlled in accordance with changes in the length of the closed portion. The details of the present invention will be explained below with reference to the drawings. The entire plating apparatus using the masking device 1 according to the present invention is shown in FIG. 3 is a plating box, 4 is a plating solution recovery means, 5 is a material to be plated, and 6 is a cathodized conveyance roller.

The masking device 1 has a guide tunnel 7 having a shape corresponding to the cross section of the material 5 to be plated extending through it in the longitudinal direction, and a plating liquid injection opening 8 at a desired position on one or both sides of the guide tunnel 7. There is a lotus customs entrance from the outside.

As shown in FIG. 2, a plating solution injection nozzle 2 is provided opposite to this plating solution injection port 8, and the plating solution is injected thereto as shown by the arrow. However, the number, position and width of the lotus ports to the guide tunnel 7 can be varied, and this is the feature of the present invention. That is, the plating liquid injection entrance 8 can be formed as shown in FIG. 3, FIG. 7, FIG. 11, or FIG. 12. The plating liquid injection opening 8a is used when the width of the entrance in the vertical direction changes midway (the third
(Fig. 7), when the plating liquid injection opening 8b has a step in the longitudinal direction (Fig. 7), the plating liquid injection opening 8c
, 8d can be employed in the masking device of the present invention if a plurality of them are formed with arbitrary closing widths in the vertical direction (FIGS. 11 and 12).

First, in FIG. 3, the plating liquid injection entrance 8a has a small exit width d and a large exit width, as shown in FIGS. 4 and 5.

In the case of large-sized Sekiguchi widths, the opening widths d of size 4 are stretched in the longitudinal direction in a positional relationship that partially overlaps, and therefore the Sekiguchi length of this overlapping part is longer than the other widths. Become. Next, in the case of Fig. 7, the same closing width d3
A plating liquid injection entrance 8b is used, but a step is provided in the middle in the longitudinal direction, and a common entrance part q is left before and after the step (inlet side and outlet side of the material to be plated). As a result, the closing length of the common part is longer than the others. In addition, in FIG. 11, there are a plurality of plating liquid injection exit ports 8c, each having a small closing width and a large opening wide opening, and the wide opening portion of the large opening is long in the longitudinal direction. On the other hand, the small-sized Sekiguchi-width part is short and runs parallel to the former d6 at a short distance. Furthermore, in the case of FIG. 12, the plurality of plating solution injection openings 8d having a small size entrance width d7 and a large size closing width & are spaced apart from each other by a short distance in the vertical direction, and in the longitudinal direction. The small-sized Sekiguchi width d7 portions are arranged so as not to be parallel to each other, and are short, whereas the large-sized Sekiguchi width portions are elongated in the longitudinal direction. In addition, in the case of FIG. 11 above, the plating solution injection closure 8c has a rectangular shape, but instead of this, the plating solution injection closure 8e having the shape of the closure shown in FIG. 14, that is, a trapezoid, may be used. In this way, the thickness of the plating applied to the material to be plated can gradually increase from the ends as will be described later. Further, a plating liquid injection entrance 8a as described above is provided.
8e, as shown in FIG. 16, the main part of the masking device is configured in advance with a moving part 9 which is divided into multiple stages and each of which is slidable in the longitudinal direction.
slide each in the longitudinal direction, leaving a void 10 in its place,
It is possible to utilize this space 10 as a partitioned plating solution injection entrance.

The plating liquid injection closures described above can be formed at desired positions on one or both sides of the guide tunnel 7, and the illustrated example shows the case where they are formed on each side, and also when the material to be plated is partially irregularly shaped. (Figs. 1 to 10) and flat plate cases (Figs. 11 to 13) are shown.

Further, depending on the shape of the material to be plated, the entire masking device may be formed as one device, but as shown in the example shown, it is formed separately into left and right pieces la and lb to facilitate conveyance and closing of the plating liquid spray opening. It's okay to do that. In this way, it is easy to process and the compatibility when using the left and right pieces la and lb is enhanced. and Figures 3 to 5, Figures 7 to 9, Figure 11, and Figure 1.
In FIG. 2, only one side is shown for convenience of explanation. Next, to explain the operation, first, when using a masking device as shown in FIG. Since the liquid is injected from the plating liquid injection nozzle 2, which also serves as an anode, toward the plating liquid injection opening 8a, the plating thickness of the plated part of the material to be plated is controlled as shown in Fig. 6, and the plating is applied. Ru.

In other words, the size of the plating thickness roughly corresponds to the ratio of the length of the closed part depending on the number, position, and width of the plating liquid injection exit, so the material to be plated varies from small size to large size and then again to the small size exit entrance width d. , Q, d, and the surface area of the material to be plated corresponding to Sekiguchi part 4 (long Sekiguchi part), which polymerizes as it passes through each part (for example, 2r plating is applied to the other Sekiguchi parts). A thin (for example, 1 mm) plating is applied to each surface portion (Fig. 6).Furthermore, in the case of a masking device as shown in Fig. 7, a common Sekiguchi part q [long opening □ part] In the same manner, thick plating is applied to the surface portion of the material to be plated corresponding to the plating material, and thin plating is applied to the surface portion corresponding to the other Sekiguchi portions. In the case of a large-sized Sekiguchi with a wide opening, the part of the surface of the material to be plated corresponding to the longitudinally long injection closing part has a large plating thickness, and the surface part corresponding to the other part of the Sekiguchi has a small plating thickness. Moreover, the large and small portions of the plating thickness are separated as shown in Fig. 13.Furthermore, if the plating liquid injection outlet 8e having a trapezoidal Sekiguchi shape as shown in Fig. 14 is used, the length within the trapezoidal Sekiguchi part can be reduced. ,, Since the ends 2 are longer and shorter, the parts of the ends 2 are plated thicker than the parts 2.As explained above, according to the masking device for plating of the present invention, the guide tunnel By simply passing the material to be plated through the guide tunnel, the surface can be plated with a plating thickness that varies depending on the number, position, and width of the plating solution injection ports that are transported and opened. The plating thickness can be controlled mechanically, so to speak, by changing the way the plating liquid injection entrance is formed, and the effects obtained are significant.

[Brief explanation of the drawing]

Figure 1 is an overall schematic perspective view of the high-speed continuous plating equipment, Figure 2
The figure is a sectional view taken along the 0-Ro line in Fig. 1, Fig. 3 is a partial perspective view showing a specific example of the masking device, and Figs. 4 and 5 are taken along the lines W-W and V-V in Fig. 3. 6 is a partial enlarged view of the material to be plated showing the state of control of plating thickness when using the masking podium shown in FIG. 3, and FIG. 7 is a portion of the masking device showing another modification. Perspective view, Figures 8 and 9 are 7th
Figure 10 is a partially enlarged view of the material to be plated, similar to Figure 6, Figure 11 and Figure 1.
Figure 2 is a partial perspective view of a masking device showing another modification;
Fig. 13 is a partially enlarged view of the material to be plated similar to Figs. 6 and 10, Fig. 14 is a partial perspective view of a masking device having a trapezoidal plating solution injection port, and Fig. 15 is the masking shown in Fig. 14. An explanatory diagram of the thickness of plating applied to the material to be plated when the device is used, and FIG. 16 shows a masking device having a moving part as a means of partitioning and forming various plating solution injection entrances. FIG. In the figure, 1... masking device, 2...
Plating solution spray nozzle that also serves as an anode, 3...Plating box, 4...Plating solution recovery means, 5...
...Material to be plated, 6...Transportation low-fu, 7...
Guide tunnel, 8, 8a to 8e... plating liquid injection opening, 9... moving part. Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6 Figure 7 Figure 8 Figure 9 Figure 10 Figure 11 Figure 2 Figure 13 Figure 14 Figure 15 Figure 16

Claims (1)

[Claims] 1. A guide tunnel having a shape corresponding to the cross section of the material to be plated is formed to penetrate in the longitudinal direction, and a plating liquid injection opening is opened at a desired position on one or both sides of the guide tunnel to communicate with the outside. In the masking device for masking,
The plating liquid injection opening is formed to extend in the longitudinal direction, and the number, position, and width of the openings communicating with the guide tunnel are varied, and the thickness of the plating to be applied to the material to be plated is determined by the opening. A masking device for plating, characterized in that it is controlled according to changes in the length of a portion. 2. The plating masking device according to claim 1, wherein the plating liquid injection opening of the masking device has an opening width in the vertical direction that changes midway. 3. The masking device for plating according to claim 1 or 2, wherein the plating liquid injection opening of the masking device has a step in the longitudinal direction. 4. The masking device for plating according to any one of claims 1 to 3, wherein the masking device has a plurality of plating liquid injection openings having arbitrary opening widths in the vertical direction. 5. The above-mentioned masking device is divided in advance into multiple stages in the longitudinal direction, and is composed of movable parts that are slidable in the longitudinal direction, and can be formed into arbitrary shapes and lengths by partially sliding the movable parts in the longitudinal direction. Claims 1 to 4, wherein the plating liquid injection opening can be divided into sections.
The masking device for plating according to any of the items.