JPS60261686A - Laser beam processing machine - Google Patents

Abstract

PURPOSE:To process simultaneously plural points with one unit of laser oscillator by controlling synchronously the oscillation of the laser oscillator and the rotation of rotary chopper mirrors. CONSTITUTION:The laser oscillator 9 emits laser light 11 in accordance with a pulse signal for oscillation control. The laser light which is reflected by the mirror part of the rotary chopper mirror 15 out of the laser light 11 is made into the laser light 11-a and is used for processing of a work piece 20. On the other hand, the laser light which is reflected by the mirror part of the rotary chopper mirror 16 out of the laser light which has passed through the window part of the mirror 15 is made into laser light 11-b which is conducted to the work piece 21. The laser light which has passed through the window part of the mirror 16 is deflected by a reflecting mirror 19 and is made to the laser light 11-c which is conducted to the work piece 22. The respective beams of the light are used for processing. The mirrors 15, 16 are controlled by a control device 14 for the number of revolution in accordance with a sychronizing signal.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a laser processing machine that processes materials using laser light.

Conventional configuration and its problems Laser processing machines are comprised of a laser oscillator and an optical system that guides and focuses laser light.

When configuring a production system using a laser processing machine,
At the same time, it is necessary to perform processing at the line location. For this purpose, a conventional method has been used in which a single high-output laser oscillator is provided and a beam splitter is provided in the optical system to split the laser beam, so that laser processing can be performed at several locations.

A method of splitting laser light using this beam splitter will be explained with reference to FIG.

1 is a laser oscillator. 2 is a beam splitter that transmits one portion of the laser beam and reflects the other half. 3 is a mirror that reflects the laser beam. 4 and 5 are workpieces for laser processing, respectively. 6, 7.8 are laser beams. Laser light 6 emitted from laser oscillator 1
is split into laser beams 7 and 8 by a beam splitter 2. Laser light 7 directly goes to workpiece 4, laser light 8
is deflected by the mirror 3 and irradiated onto the workpiece 5. This laser beam splitting method using the beam splitter 2 has the following problems. First, the output of the laser beam after branching is only one part of the output of the oscillator. For example, when a 100 watt laser beam is split into two, the resulting laser beam is only 60 watts.

Second, the laser beams 7°3\-8 split by the beam splitter 2 all have outputs of the same ratio. Therefore, machining with different machining conditions is not possible. Thirdly, a high output laser oscillator 1 is required. Fourthly, there is energy loss of the laser beam due to the beam splitter 2, and the mirror is severely damaged in high-output oscillation.

As shown above, the laser processing machine that uses the beam splitter 2 to split laser light has many problems.

Purpose of the Invention The present invention solves the above-mentioned problems, and in order to use a laser processing machine widely and efficiently as a production system,
It is an object of the present invention to provide a laser processing machine that can arbitrarily perform processing at each branch destination and reduces energy loss.

Composition of the invention Processing material when processing with a laser processing machine.

It is necessary to control the output of the laser oscillator depending on the processing method (cutting, welding, microfabrication, etc.), and the present invention pulses the oscillation of laser light and changes the frequency and pulse duty ratio of the pulse. The above object is achieved by making it possible to control the output of a laser oscillator, and includes a laser oscillator and at least one rotating mirror disposed on the optical axis of the laser oscillator. By synchronizing the oscillation of an oscillator and the rotation of the rotary chopper mirror, a laser processing machine is provided that can simultaneously perform a plurality of processing operations using a single laser oscillator.

Description of examples Embodiments of the present invention will be described below with reference to the drawings.

FIG. 2a shows a general view of a laser processing machine which is an embodiment of the present invention, and FIG. 2b shows an enlarged view of a part of the rotating machine. The figure shows an example of processing three workpieces with one oscillator. In FIG. 2a, a laser oscillator 9 oscillates a laser beam 11 by oscillating pulses by an oscillation control device 1o. 12.13 is rotation speed control device 1
4. '15.16
Go to turn 5. As shown in Figure 2, the aluminum material with four windows in the window part 17 and the mirror part 18 in a ratio of 2:1 is plated with electroless nickel and polished to a mirror finish. Gold was later deposited to increase the reflectance to 98% or more. 19 is a reflecting mirror that polarizes the laser beam. 20, 21, and 22 are workpieces to be processed by laser light.

The operation of this embodiment will be explained with reference to a timing chart of laser oscillation control shown in FIG. FIG. 31 shows synchronization signals for controlling laser oscillation and rotation of the rotating chopper mirror. FIG. 3 shows laser oscillation control pulses when different processes such as thick plate cutting, thin plate cutting, and welding are performed at three processing locations. The oscillation control pulses have respective pulse widths with delay times based on the synchronization signal shown in 1. Therefore, different processing is possible as described above. 3 and 4 show the rotational phases of the rotating chopper mirrors 15 and 16, respectively, where the window portion is Ll and the mirror portion is H. The rotating chopper mirrors 15, 16 are controlled by the rotational speed controller 14 on the basis of synchronization signals. The laser oscillator 9 emits a laser beam 11 based on the oscillation control pulse signal shown in FIG. The portion of the laser beam 11 that is reflected by a portion of the rotary chopper mirror 16 becomes a laser beam 11-a shown in FIG. 3 and is used to process a workpiece 2 degrees. On the other hand, among the laser beams that passed through the window of the rotating chopper mirror 15, the rotating chopper mirror 1
The laser beam reflected by a part of the mirror 6 becomes the laser beam 11-b shown in FIG. Laser light 1 having the pulse waveform shown in Figure 7
1-C and are guided to the workpiece 22 and subjected to processing. In this way, machining can be performed at three locations simultaneously using one oscillator.

In addition, in this example, there were a total of 7 changes in the processing method at three locations.
7. Although this is done by setting the decoupage ratio, in addition to this example, the present invention can also select a processing method by changing the synchronous frequency or increasing or decreasing the current value of laser oscillation.

Further, the processing locations are not limited to three locations, but any location can be processed at the same time.

Effects of the Invention In short, the laser processing machine of the present invention is capable of simultaneously processing multiple locations with a single laser oscillator by controlling the synchronous oscillation and rotation of the laser oscillator and the rotary chopper mirror, and is capable of processing multiple locations at the same time. Different processing methods can be used at the same time at each processing location. Furthermore, since different machining operations can be performed at multiple locations simultaneously using one laser oscillator, it is possible to use the laser oscillator efficiently, and the production system incorporating the laser processing machine of the present invention is highly efficient. ,・) It has the following advantages.

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram of a conventional laser processing machine, FIG. 2a is a schematic diagram of a laser processing machine that is an example of the present invention, and FIG. Third
The figure is a timing chart showing the processing operation of the laser processing machine of the present invention. 9... Laser oscillator, 10... Laser oscillation control device, 11... Laser light, 12.13
... Rotation drive unit, 14 ... Rotation speed control device, 15.16 ... Rotating chopper mirror, 17
...Window part, 18...Mira part, 19...
... Reflection mirror, 20, 21° 22 ... Workpiece. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2 ((1)

Claims (1)

[Claims] Laser processing comprising a laser oscillator and at least one rotating chopper mirror provided on the optical axis of the laser oscillator, and synchronizing the oscillation of the laser oscillator and the rotation of the rotating chopper mirror. Machine.