JPS60253115A - Method of producing sn or sn alloy plating conductor - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing Sn or Sn alloy plated conductors used for wiring of electrical and electronic equipment, lead wires of the same parts, and the like.

[Conventional technology]

Generally, conductors made of Cu or Cu alloy are used for the wiring and lead wires, and soldering properties during wiring and assembly are improved.
In addition, the surface is plated with sn or Sn alloy for the purpose of improving corrosion resistance and sulfidation resistance. Hot-dip plating and electroplating are known methods for plating 5n or Sn alloys, but hot-dip plating causes less pollution and can be plated with relatively simple equipment.
It is widely used for plating low melting point metals such as alloys.

Conventionally, in order to hot-dip plate Sn or Sn alloy on a conductor, the desired conductor (a) is placed on a supply bobbin (
1) The conductor (a) is fed out and run in the longitudinal direction, and flux is first applied to the surface of the conductor (a) through a flux tank (3) using guide rollers (2a), (2b), . . . (2e).

Subsequently, after being subjected to hot-dip plating through a Sn or 3N alloy hot-dip plating tank (4), it is wound up on a winder (5).

For the flux, a mixed aqueous solution of zinc chloride and hydrochloric acid or an organic water-soluble neutral flux is used, but when a conductor coated with flux is passed through a hot-dip plating tank, the conductor and the molten metal will become wet. During this process, the flux component reacts with the molten metal and oxygen in the air, generating metal oxides. The amount of this oxide generated is approximately the same as the amount of metal plated on the conductor, for example, when the plating thickness is 1 μm or less, and metal loss due to the generation of oxides.
The impact was greater than the strike.

In order to improve this, we covered the molten metal with an inert gas, or reduced the conductor surface to remove the oils and oxides on the surface of the molten metal, and removed the molten metal without using flux.
Sixteen methods have been proposed.

(Problems that the invention seeks to solve) Methods of covering the molten metal with inert gas or reducing the conductor surface not only complicate the equipment, but also cause poor wetting of the conductor surface, resulting in poor quality plating. However, there is a strong desire for a method for manufacturing 3R+ or 3N alloy plated conductors of good quality that can suppress the generation of oxides using a simpler method.

[Means for solving problems]

In view of this, as a result of various studies, the present invention has developed a method for manufacturing 3N or Sn alloy metal 4-conductors, which suppresses the generation of oxides and enables high-quality plating to be performed at low cost. A conductor made of C1l or Cu alloy was run in the longitudinal direction, and the surface was coated with water-soluble Nakatake Norax kept at 70 to 100°C, and then 3n or 3
It is assumed that v1'fi is performed to melt the n-alloy.

That is, in the present invention, as shown in FIG. 1, a desired conductor made of Cu or a Cu base metal is fed out from a nozzle bobbin 1), and is run (rolled) in the longitudinal direction.
(2b)...(2e) first, the flux tank (3
) and held at 70-100℃ on the conductor surface.
fl Water-soluble neutral Norax is applied (.Next, 3N or SO alloy is hot-dip plated on the surface of the conductor (a) through a hot-dip plating tank (4) of Sn or S11 alloy, and this is passed through a hot-dip plating tank (4) of Sn or S11 alloy, and this is passed through a hot-dip plating bath (4) of Sn or S11 alloy. ) to manufacture and cover SO or 3N alloy plated conductors.The flux tank (4) is a closed structure to avoid evaporation of the flux tank content.
The conductor (
a) Apply a flux maintained at 70-100″G to the surface.

For Cfl] Since the flux is maintained at 70-100℃ and applied to the conductor surface, it dries before it enters the hot-dip plating bath, and excess components that generate metal oxides in the flux components are removed. It vaporizes and simultaneously activates the conductor surface. Therefore, hot-dip plating starts as soon as the conductor enters the hot-dip plating tank, suppressing the generation of metal oxides, and obtaining a good-quality SO or 3N gold-containing plated conductor with few defects.

However, the reason why the flux holding temperature was limited to 70 to 100°C is because if it is lower than 10°C, the flux will not dry completely during the time it enters the melting tank after application, and metal oxides in the flux will If the temperature exceeds 100°C, the flux will decompose, making it difficult to obtain good hot-dip plating. 80~,
It is best to keep it at 95°C.

(Example) A Cu wire with a wire diameter of 0.1 #15I was run in the longitudinal/j direction,
A neutral flux whose temperature was controlled at 80°C consisting of 10 wt% of active F1 agent, 1 wt% of surfactant, 5 wt% of organic solvent, and the balance water was passed through a flux tank and then sifted for 2 hours.
A 3n metal with a thickness of 0.05μ is made by passing it through a molten ST + metal bath whose temperature is controlled at 90°C and a drawing die.

For comparison, similar melting S II Metsu-1 was carried out in the case where no flux was used and in the case where flux maintained at 20°C was applied.

Regarding these, the amount of oxide emitted on the molten Metsu-V bath was measured, and the obtained 3n Metsu-V19 body was J
A sodium polysulfide test according to I5-C-3002 was conducted to determine the number of tests for sunspot paralysis. These results are shown in Table 1.

Table 1 Manufacturing method Sodium polysulfide Amount of tin oxide generated Ram test number Invention method 8 times 30 g/hr No flux 1 time 30 g/hr 20°C fluff coating 1 7 times 240 g/hr 1st As is clear from the table, according to the method of the present invention, the amount of oxide generated is as small as that without flux, and the quality of the plated conductor is superior to that of the conventional 7 lux coating at 20°C. It can be seen that

〔Effect of the invention〕

As described above, according to the present invention, it is possible to suppress the generation of metal oxides in hot-dip plating using relatively simple equipment, and to manufacture plated conductors of good quality at low cost.
This has a remarkable industrial effect.

[Brief explanation of drawings]

FIG. 1 is an explanatory diagram showing an example of the manufacturing method of the present invention, and FIG. 2 is an explanatory diagram showing an example of the conventional manufacturing method. a...Conductor 1...Reply bobbin 2a, 2b-2e...Guide roll 3...Flux tank 4...Hot-dip plating tank 5...Winder 6...Heater

Claims (1)

[Claims] Sn is characterized by running a conductor made of CLI or Cu alloy in the longitudinal direction, applying an organic water-soluble neutral flux maintained at 10 to 100°C on the surface, and then hot-dip plating with 3n or 3n alloy. Or a method for manufacturing SO alloy plated conductor.