JPS6024578Y2 - High frequency electrode mold - Google Patents
High frequency electrode moldInfo
- Publication number
- JPS6024578Y2 JPS6024578Y2 JP10492179U JP10492179U JPS6024578Y2 JP S6024578 Y2 JPS6024578 Y2 JP S6024578Y2 JP 10492179 U JP10492179 U JP 10492179U JP 10492179 U JP10492179 U JP 10492179U JP S6024578 Y2 JPS6024578 Y2 JP S6024578Y2
- Authority
- JP
- Japan
- Prior art keywords
- electrode mold
- frequency electrode
- protrusion
- metal
- metal band
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 8
- 230000000694 effects Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000009958 sewing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Lining Or Joining Of Plastics Or The Like (AREA)
Description
【考案の詳細な説明】
本考案はミシン縫目状に高周波接合する電極金型の改良
に関する。[Detailed Description of the Invention] The present invention relates to an improvement of an electrode mold for high frequency welding in the form of a perforated seam.
従来、第１図に示すような、リボン状の金属帯１の一辺
側が波状方形１ａに形成され、平坦な他辺側か接合形状
に沿って金属基板面に固着されて、上記金属帯の平面が
金属基板２の面に直角になるように、金属帯を基板に設
けたミシン縫目状の接合形状を与える高周波電極金型は
知られている。Conventionally, as shown in FIG. 1, one side of a ribbon-shaped metal band 1 is formed into a wavy rectangle 1a, and the other flat side is fixed to a metal substrate surface along the bonding shape, so that the flat surface of the metal band is A high-frequency electrode mold is known in which a metal band is provided on a substrate so that the metal band is perpendicular to the surface of the metal substrate 2, giving a perforated joint shape.
このような電極金型を用いて該電体シートの周縁部を接
合すると、第２図に断面で示すように、ミシン縫目状接
合部３の外側に当る誘電体シート４の縁４ａが反り上る
傾向を示す。When the periphery of the electric sheet is joined using such an electrode mold, the edge 4a of the dielectric sheet 4 on the outside of the perforated joint 3 is warped, as shown in cross section in FIG. Shows an upward trend.
そのため見はえが悪くなるばかりでなく、外側縁４ａが
引掛り易くなって、ミシン縫目状の接合部３に剥離の力
が作用し易くなると云う問題がある。Therefore, there is a problem in that not only the appearance is poor, but also the outer edge 4a tends to get caught, and peeling force tends to act on the perforated joint 3.
図の５も誘電体シートである。5 in the figure is also a dielectric sheet.
本考案は上述の問題を生せしめない高周波電極金型を提
供するものであり、本考案は、波状に形成された薄肉帯
状の突出部と、該突出部の片側若しくは両側に突出部よ
りも低くて被接合物を接合させるに十分な高さの面押圧
部とを形成する金属帯状突起が、金属基板面上に接合形
状に沿って設けられた構成よりなる高周波電極金型にあ
る。The present invention provides a high-frequency electrode mold that does not cause the above-mentioned problems. A high-frequency electrode mold has a metal band-like protrusion that forms a surface pressing portion having a height sufficient to bond the objects to be bonded.
即ち、本考案の電極金型は従来のミシン縫目状の接合形
状を与える電極金型の波状方形を有する金属帯の片側若
しくは両側に沿って波状方形の先端よりも低い押圧面を
形成する金属帯が設けられた如き構成よりなに、第３図
にその１例を示す。That is, the electrode mold of the present invention is made of metal that forms a pressing surface that is lower than the tip of the wavy rectangle along one or both sides of the metal band having a wavy rectangle of the electrode mold that gives a conventional perforated seam-like joining shape. FIG. 3 shows an example of a configuration in which a band is provided.
第３図は、波状方形をなす薄肉帯状の突出部６ａと、突
出部６ａの片側に突出部よりも低い面押圧部６ｂとを有
する金属帯状突起６が、金属基板２の面上に例えば第１
図に示したような接合形状に沿って設けられた高周波電
極金型の一部を示している。FIG. 3 shows a metal band-shaped protrusion 6 having a thin band-shaped protrusion 6a in the form of a wavy rectangle and a surface pressing part 6b lower than the protrusion on one side of the protrusion 6a. 1
A part of the high-frequency electrode mold provided along the bonding shape shown in the figure is shown.
この様な電極金型を誘電体シート４の周縁部が面押圧部
６ｂにより押圧される如く用いて高周波接合すると、第
４図に示すようにミシン縫目状の接合部３の外側も押さ
えられて接合し、縁４ａの反り上りが生じない。When high-frequency bonding is performed using such an electrode mold so that the peripheral edge of the dielectric sheet 4 is pressed by the surface pressing part 6b, the outside of the perforated joint part 3 is also pressed as shown in FIG. This prevents the edge 4a from warping.
従って、接合の強力、耐久性が著しく増大し、しかもミ
シンで縫合した如き外観は損なわれないと云う優れた効
果が得られる。Therefore, the strength and durability of the joint are significantly increased, and the appearance as if sewn with a sewing machine is not impaired, which is an excellent effect.
本考案の高周波電極金型は図示の例に限らず、細幅テー
プ状の誘電体シートの幅の中央部を接合するようなもの
として、既に述べた如く突出部６ａの両側に面押圧部６
ｂを有するようなものが用いられ、また、突出部６ａを
形成する金属帯と面押圧部６ｂを形成する金属帯とが別
体よりなり、それらが金属基板２に組合せて取付けられ
たようなものであっても、更には突出部６ａと面押圧部
６ｂとの間に多少の隙間を有するようなものであっても
よく、また、上述の如き金属帯状突起６が削出された金
属基板２と全く一体をなすもであってもよいことは勿論
である。The high-frequency electrode mold of the present invention is not limited to the illustrated example, but can be used to join the center part of the width of a narrow tape-like dielectric sheet.
In addition, the metal band forming the protruding portion 6a and the metal band forming the surface pressing portion 6b are made of separate bodies, and the metal band forming the surface pressing portion 6b is attached to the metal substrate 2 in combination. It may also be a metal substrate with a slight gap between the protruding portion 6a and the surface pressing portion 6b, or a metal substrate with the metal band-shaped protrusion 6 as described above cut out. Of course, it may also be completely integrated with 2.
第１図はミシン縫目状の接合形状を与える従来の高周波
電極金型の１例を示す斜視図、第２図は第１図の電極金
型を用いて接合した状態を示す断面図、第３図は本考案
の電極金型の１例を示す斜視図、第４図は第３図の電極
金型を用いて接合した状態を示す断面図である。
２・・・・・・金属基板、３・・・・・・ミシン縫目状
接合部、４．５・・・・・・誘電体シート、４ａ・・・
・・・縁、６・・・・・・金属帯状突起、６ａ・・・・
・・突出部、６ｂ・・・・・・面押圧部。Fig. 1 is a perspective view showing an example of a conventional high-frequency electrode mold that provides a perforated joint shape, Fig. 2 is a cross-sectional view showing a state of joining using the electrode mold of Fig. 1, FIG. 3 is a perspective view showing an example of the electrode mold of the present invention, and FIG. 4 is a cross-sectional view showing a state in which the electrode mold of FIG. 3 is used for joining. 2... Metal substrate, 3... Perforated joint, 4.5... Dielectric sheet, 4a...
...Edge, 6...Metal band-shaped projection, 6a...
...Protruding part, 6b... Surface pressing part.
Claims (1)
若しくは両側に突出部よりも低くて被接合物を接合させ
るに十分な高さの面押圧部とを形成する金属帯状突起が
、金属基板面上に接合形状に沿って設けられた構成より
なる高周波電極金型。A metal band-shaped protrusion that forms a thin band-shaped protrusion having a wavy rectangular shape and a surface pressing part on one or both sides of the protrusion that is lower than the protrusion and has a height sufficient to weld objects to be welded is made of metal. A high-frequency electrode mold that is formed along the bonding shape on the substrate surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10492179U JPS6024578Y2 (en) | 1979-07-31 | 1979-07-31 | High frequency electrode mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10492179U JPS6024578Y2 (en) | 1979-07-31 | 1979-07-31 | High frequency electrode mold |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5624218U JPS5624218U (en) | 1981-03-05 |
| JPS6024578Y2 true JPS6024578Y2 (en) | 1985-07-23 |
Family
ID=29337596
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10492179U Expired JPS6024578Y2 (en) | 1979-07-31 | 1979-07-31 | High frequency electrode mold |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6024578Y2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6166161U (en) * | 1984-10-05 | 1986-05-07 | ||
| JPS61103380U (en) * | 1984-12-10 | 1986-07-01 | ||
| JPS61200364U (en) * | 1985-06-06 | 1986-12-15 | ||
| JP2642811B2 (en) * | 1991-09-09 | 1997-08-20 | 中津川包装工業株式会社 | Packaging equipment |
-
1979
- 1979-07-31 JP JP10492179U patent/JPS6024578Y2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5624218U (en) | 1981-03-05 |
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