JPS60242647A - Mounting method of hybrid integrated circuit - Google Patents

Abstract

PURPOSE:To prevent leakage or short-circuit on a substrate, by injecting gel insulating synthetic resin so as to cover a hybrid integrated circuit substrate housed in a hollow package and connecting the upper portions of lead lines raised from said substrate with connecting pieces by means of welding. CONSTITUTION:A substrate 1, on which electronic parts such as a semiconductor chip 3 and a chip capacitor 4 are mounted and from which a plurality of lead lines 5 are raised, is bonded to a heat sink 2. Gel insulating synthetic resin is injected from a lead hole 6a to cover the substrate 1 and is cured to form a synthetic resin layer 11. Then, each lead line is connected by welding with each connecting piece 8. Electricaly conductive metallic powder 9 is produced by this welding, and the powder 9 falling within the frame 6 is adhered onto the synthetic resin layer 11. Accordingly, the electronic parts on the substrate 1 can be effectively prevented from accidents such as short circuit or the like.

Description

[Detailed Description of the Invention] [Technical Field of the Invention] This invention accommodates a hybrid integrated circuit board in a hollow package, and connects a connecting piece of an outer terminal by welding to a lead wire drawn upward from the board. , relates to a method for implementing hybrid integrated circuits.

[Prior art]

Conventional implementations of this type of hybrid integrated circuit are shown in Figures 1 and 2.
The figure shows a plan view and a sectional view of a hybrid integrated circuit device. (1) is a hybrid integrated circuit board (hereinafter referred to as "substrate") consisting of a thick film substrate or the like.

(2) is a heat sink made of a metal material with high mechanical strength and good thermal conductivity, such as aluminum, which adhesively supports the substrate (1). Electronic components such as a semiconductor chip (3) and a chip capacitor (4) are mounted on the board (1), and lead wires (
5) is pulled upward. (6) is a frame made of a synthetic resin molded product such as epoxy resin, and is bonded around the heat sink (2) with adhesive. (6a
) is a hole for spraying, and (6b) is a hole for lead.

(6c) is a protrusion, inside of which a capacitor or the like is mounted. (7) is an external terminal fixed to the frame (3) and pulled out; (8) is a connection piece with one end connected to the external terminal (7), and the rising side is welded to the lead wire (5). There is. Each of the protruding lead wires (5), each connection piece (8), and the lead hole are covered with a rubber cap αO and sealed.

The lead wire (5) and the connecting piece (8) can be joined by soldering, wrapping, etc., but if high reliability is required in terms of environmental resistance, soldering or welding is often used. When vehicles are used in environments with high ambient temperatures and vibrations, reliable welded connections are used.

Unlike soldering, this welded connection does not require cleaning of the flux used, and is easy to work with.
It has the advantage of being easily automated.

However, in the case of a hollow package like Koshirae 2 diagram.

When welding the lead wire (5) and the connection piece (8), conductive metal powder (9) will be generated, and some of this may fall and adhere to the board (1), resulting in electrical leakage or short circuit. , reliability was not good.

[Summary of the invention]

This invention was made to eliminate the drawbacks of the conventional mounting method described above. Electronic components are mounted, lead wires are raised, and a gel-like material is mounted on a hybrid integrated circuit board housed in a hollow package. The lead wire and the connecting piece are welded together after covering with insulating synthetic resin and curing the synthetic resin, so that even if metal powder from welding falls, it will not adhere to the synthetic resin layer.

Eliminates electrical leakage and short circuits, improving reliability. The purpose is to provide a method for implementing hybrid integrated circuits.

[Embodiments of the invention]

Hereinafter, a method for mounting a hybrid integrated circuit according to an embodiment of the present invention will be explained with reference to a plan view and a sectional view of a hybrid integrated circuit device shown in FIGS. 3 and 4. Make a fuss about the figure, [1]
~QO, (6a) ~(ac) are the same as the above conventional ones. Semiconductor chip (3) on the top surface.

A board (1) on which electronic components such as a chip capacitor (4) are attached and a plurality of lead wires (5) are mounted is fixed on a heat sink (2), and a frame ( 6). These heat sinks/) (')) J-frames (6) 2 form a hollow package in which a hybrid integrated circuit is housed. Next, a gel-like insulating synthetic resin is injected through the lead holes (6a) to cover the substrate (1) and harden to form a synthetic resin layer αD. After this, each lead wire (5) and each connection piece (8) are connected by welding, respectively. Conductive metal powder (9) is produced by this welding, and the metal powder (9) that has fallen into the frame (6) adheres to the synthetic resin layer α. This prevents accidents such as short-circuiting of electronic components on the board (1) as in the conventional case.

Note that the shape of the hollow package is not limited to that of the above-mentioned example, but may be any other shape as long as it accommodates the hybrid integrated circuit and is mounted by welding the rising lead wires and connection pieces outside the frame. It can be applied to any shape, and the same effects as in the above embodiment can be achieved.

〔Effect of the invention〕

As described above, according to the method of the present invention, a hybrid integrated circuit board housed in a hollow package is covered by injecting a gel-like insulating synthetic resin, and is cured to form a synthetic resin layer. Since the upper end of the rising lead wire and the connection piece are connected by welding, metal powder produced by welding will adhere to the synthetic resin layer, preventing electrical leakage and short circuits with the board, and improving the quality of the product. It will also improve yield and reliability. The installed electronic components are protected from the environment.

[Brief explanation of the drawing]

FIG. 1 is a plan view of a hybrid integrated circuit device showing a conventional mounting method, FIG. 2 is a sectional view taken along line nn of FIG. A plan view of the integrated circuit device, FIG. 4 is a sectional view taken along the line IV--IV in FIG. 3. 1... Hybrid integrated circuit board, 2... Heat sink, 3
...Semiconductor chip, 4...Chip capacitor, 5.
...Lead wire, 6...Frame, 7...External terminal,
8...Connection piece, 9...Metal powder, 11...Synthetic resin layer Note that the same reference numerals in the drawings indicate the same or equivalent parts. Agent Masuo Oiwa Figure 1 Figure 2 Figure 3 Figure 4

Claims (2)

[Claims] (1) A hybrid integrated circuit board with electronic components mounted on the top surface and lead wires raised is housed in a hollow package.2 The upper ends of the lead wires drawn out onto the hollow package are connected to connection pieces to external terminals. In the mounting method, a gel-like insulating synthetic resin is injected onto the composite circuit board and integrated circuit board in the package, covered and cured, and then the lead wires and the connection pieces are welded together. A hybrid integrated circuit mounting method characterized by welding. (2) The hybrid integrated circuit according to claim #J1, wherein the hollow package is composed of a heat sink having a hybrid integrated circuit board fixed to its upper surface, and a frame made of synthetic resin and fixed around the heat sink. How to implement the circuit.