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JPS60238134A - Vacuum treatment apparatus - Google Patents

Vacuum treatment apparatus

Info

Publication number
JPS60238134A
JPS60238134A JP59076271A JP7627184A JPS60238134A JP S60238134 A JPS60238134 A JP S60238134A JP 59076271 A JP59076271 A JP 59076271A JP 7627184 A JP7627184 A JP 7627184A JP S60238134 A JPS60238134 A JP S60238134A
Authority
JP
Japan
Prior art keywords
container
vacuum processing
feed
containers
air cylinder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59076271A
Other languages
Japanese (ja)
Other versions
JPS6257378B2 (en
Inventor
Shigeki Taniguchi
硲野 重喜
Makoto Sotozono
外園 誠
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Tokuda Seisakusho Co Ltd
Original Assignee
Toshiba Corp
Tokuda Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokuda Seisakusho Co Ltd filed Critical Toshiba Corp
Priority to JP59076271A priority Critical patent/JPS60238134A/en
Publication of JPS60238134A publication Critical patent/JPS60238134A/en
Publication of JPS6257378B2 publication Critical patent/JPS6257378B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J3/00Processes of utilising sub-atmospheric or super-atmospheric pressure to effect chemical or physical change of matter; Apparatus therefor
    • B01J3/006Processes utilising sub-atmospheric pressure; Apparatus therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

PURPOSE:To shorten an evacuation time while enhancing a cleaning property, by providing a feed container provided with a feed apparatus, which has an opening part having the same shape as an opening part and moves an object to be treated, to at least two side surfaces among for side surfaces of a rectangular parallelepiped. CONSTITUTION:A feed container 5 has the same shape as a treatment container 1 and has a feed apparatus 6 arranged therein. The feed apparatus 6 is formed by providing feed arm 8 made freely extensible by an air cylinder 7 and fixing the air cylinder 7 to the upper end part of a rotary shaft 9 and an object to be treated is fed to all directions by the rotary operation of the rotary shaft 9 and the extending and contracting operation of the arm 8 by the air cylinder 7. The mount flange 3 of the treatment container 1 and that of the feed container 5 are connected by bolts and nuts through a gasket 13 and the opening parts 2, 2 of both containers 1, 5 are communicated to connect both containers 1, 5 so as to form a predetermined vacuum treatment process.

Description

【発明の詳細な説明】 〔発明の技術分野〕 本発明は真空処理装置に係シ、特に被処理物を自動的に
移送して真空処理を行なう真空処理装置に関する。
DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a vacuum processing apparatus, and more particularly to a vacuum processing apparatus that automatically transfers a workpiece to perform vacuum processing.

〔発明の技術的背景とその問題点〕[Technical background of the invention and its problems]

従来の真空処理装置は、真空処理室とこの真空処理室に
被処理物を移動させる搬送装置とを一体に形成しておシ
、処理前の被処理物を収納する入口側カセットおよび処
理後の被処理物を収納する出口側カセットを上記真空処
理装置に装填し、上記入口側カセットの被処理物を上記
搬送装置によシ上記真空処理室へ送シ、工、チング、成
膜あるいは加熱処理等の真空処理が行なわれる。そして
、真空処理が終了したら搬送装置によシ被処理物を出口
側カセットへ送るようになされ、これらの行程はすべて
自動的に行なわれる。このような真空処理装置は通常複
数の真空処理室が設けられておシ、7台の装置で複数の
処理行程を行なうようになされる。
Conventional vacuum processing equipment integrates a vacuum processing chamber and a transfer device that moves the workpieces into the vacuum processing chamber, and includes an inlet cassette that stores the workpieces before processing, and a cassette on the entrance side that stores the workpieces before processing, and a The outlet side cassette that stores the objects to be processed is loaded into the vacuum processing apparatus, and the objects to be processed in the inlet side cassette are transported to the vacuum processing chamber by the transfer device, where they are processed, processed, film-formed, or heated. Vacuum processing such as the following is performed. Then, when the vacuum processing is completed, the object to be processed is sent to the exit side cassette by the transport device, and all of these steps are performed automatically. Such a vacuum processing apparatus is usually provided with a plurality of vacuum processing chambers, and seven apparatuses are used to perform a plurality of processing steps.

しかし、上記のような装置においては、真空処理の行程
の一部を変更するような場合、装置全体の設計変更を行
なう必要があシ、経済性や生産効率が低下してしまうと
いう欠点を有している。
However, with the above-mentioned equipment, if a part of the vacuum processing process is changed, it is necessary to change the design of the entire equipment, which has the disadvantage of reducing economic efficiency and production efficiency. are doing.

また、真空処理室や搬送装置を一体に形成しているので
、装置全体が大型化してしまい、真空排気時間が長くな
ったシ清掃性が悪いという欠点を有している。
Furthermore, since the vacuum processing chamber and the transfer device are integrally formed, the entire apparatus becomes large in size, and has disadvantages such as a long evacuation time and poor cleaning performance.

〔発明の目的〕[Purpose of the invention]

本発明は上記欠点に鑑みてなされたもので、真空処理行
程の設計変更に容易に対応することができる真空処理装
置を提供することを目的とするものである。
The present invention has been made in view of the above-mentioned drawbacks, and an object of the present invention is to provide a vacuum processing apparatus that can easily accommodate changes in the design of the vacuum processing process.

〔発明の概要〕[Summary of the invention]

上記目的達成のため本発明の真空処理装置は、直方体の
少なくとも二側面に・々ルゾによシ開放閉塞自在な開口
部をそれぞれ有し内部に被処理物を収容して真空処理を
行なう処理容器を設けるとともに、直方体の西側面のう
ち少なくとも二側面に上記開口部と同一形状の開口部を
有し内部に被処理物を移動させる搬送装置が取付けられ
た搬送容器を設け、上記処理容器と搬送容器とをおのお
の単位として上記各容器の開口部が連通して所定の真空
処理行程を形成するように適宜連結自在として構成され
ておシ、連結順序を変更することによシ、容易に行程を
変更できるようになされている。
In order to achieve the above object, the vacuum processing apparatus of the present invention has a processing container which has openings on at least two sides of a rectangular parallelepiped that can be opened and closed at will, and in which a workpiece is housed and vacuum processing is performed. At the same time, a transport container having openings in the same shape as the above-mentioned openings on at least two of the west sides of the rectangular parallelepiped and a transport device for moving the processed material inside is provided, and the transport container is connected to the processing container and the transport container. The container is constructed so that the openings of the containers communicate with each other to form a predetermined vacuum treatment process, and can be connected as appropriate.The process can be easily performed by changing the connection order. It is possible to change it.

〔発明の実施例〕[Embodiments of the invention]

以下、本発明の実施例を第1図乃至第参図を参照して説
明する。
Embodiments of the present invention will be described below with reference to FIGS.

第1図は本発明の一実施例を示した庵ので、処理容器l
は一辺が約、7(7印平面形状正方形を有する直方体で
アシ、この処理容器lの四側面にはそれぞれ開口部コ、
コ、コ、コが設けられている。これら各開口部コ、コ、
コ9.2の周縁部には外方に延びる取付フランジJ、!
、3.3がそれぞれ設けられ、上記各開ロ部コ、2.コ
、コの内部側にはバルブ機構参、≠、e、IIが取付け
られておシ、この)々ルブ機構lによシ上記開ロ部コを
開放閉塞するようになされている。また、上記処理容器
lの内部にはエツチング等の真空処理を行なうための処
理装置(図示せず)が配設されるとともK、処理容器l
には図示しない真空ポンプや雰囲気ガスを導入する装置
勢が接続されている。
Figure 1 shows one embodiment of the present invention, so the processing container l
is a rectangular parallelepiped with a side of approx.
Ko, Ko, Ko are provided. Each of these openings C, C,
The periphery of 9.2 has an outwardly extending mounting flange J,!
, 3.3 are respectively provided, and each of the above-mentioned opening parts KO, 2. Valve mechanisms ≠, ≠, e, and II are attached to the inside of ① and ①, and the valve mechanisms ①, ≠, ≠, and ① are used to open and close the opening portion ②. Further, a processing device (not shown) for performing vacuum processing such as etching is provided inside the processing container L.
A vacuum pump and devices for introducing atmospheric gas (not shown) are connected to the .

また、搬送容器jは本実施例においては、処理容器lと
同一の形状を有しておシ、内部には搬送装置6が配設さ
れている。この搬送装置6は、第2図(a)に示すよう
にエアシリンダ7によシ伸縮自在な搬送アームざを有し
、上記エアシリン/7を回転軸りの上端部に固着して形
成されておシ、回転軸2による回転動作とエアシリンダ
7による伸縮動作とによシすぺでの方向に被処理物を搬
送することができる。このよう表搬送装置6は例えば第
2図(1))に示すように、回転軸りに2本のアーム1
0 、10を回動自在に接続してなるアーム機構l/を
取付け、このアーム機構//の先端に被処理物を把持す
る把持爪12を取付けるように構成しても、上記搬送装
置6と同様に作動することが可能である。
Further, in this embodiment, the transport container j has the same shape as the processing container l, and a transport device 6 is disposed inside thereof. As shown in FIG. 2(a), this conveying device 6 has a conveying arm that is extendable and retractable by an air cylinder 7, and is formed by fixing the air cylinder 7 to the upper end of a rotating shaft. The object to be processed can be transported in all directions by the rotational movement of the rotary shaft 2 and the expansion and contraction movement of the air cylinder 7. For example, as shown in FIG. 2 (1), the table conveying device 6 has two arms 1 around the rotation axis.
0 and 10 are rotatably connected to each other, and a gripping claw 12 for gripping the object to be processed is attached to the tip of this arm mechanism //, the transfer device 6 and It is possible to operate similarly.

本実施例においては、処理容器/の取付フランジ3と搬
送容器jの取付フランジ3とをガスケット13を介して
ボルト、ナツト(図示せず)等によ多連結して、各容器
i、sの開口部3.3を連通させるようになされ、複数
の容器/、jを所定の真空処理行程を形成するように連
結する。そして、他の容器/、!が連結されていない開
口部コは図示しない蓋部材等によ)密封閉塞される。
In this embodiment, the mounting flange 3 of the processing container / and the mounting flange 3 of the transport container j are connected by bolts, nuts (not shown), etc. via the gasket 13, and each container i, s is The openings 3.3 are made to communicate and connect the plurality of containers/,j to form a predetermined vacuum treatment process. And other containers/,! The openings to which these are not connected are hermetically closed (by a cover member (not shown), etc.).

例えば第3図に)に示すように各容器i、sを連結する
と入口側カセット/41に収容された被処理物がA−+
B−+C−+D−+E−+F→Gの順に移動して出口側
カセットlSに収容される。ここに、0印は処理容器、
十印は搬送装置を示している。また、第3図(1))に
おいてはム→BあるいはO−+ D −+ 1[f −
+ Fの順に被処理物が移動するものであシ、第3図(
C)においてはA −+ Bあるいは0−) D−+I
!!−+F−+G→Hの順に移動するものである。すな
わち、各容器/、!の連結順序を適宜選択することによ
シ、種々の真空処理行程を行なうことができ、真空処理
行程を変更する場合であっても、各容器l、!の連結順
序を変更するだけで容易に行程変更を行なうことができ
る。
For example, when the containers i and s are connected as shown in FIG.
It moves in the order of B-+C-+D-+E-+F→G and is accommodated in the exit side cassette IS. Here, the 0 mark is the processing container,
The 10-mark indicates a conveyance device. In addition, in Fig. 3 (1)), M→B or O−+ D −+ 1[f −
The workpiece moves in the order of +F, as shown in Figure 3 (
In C), A −+ B or 0−) D−+I
! ! It moves in the order of -+F-+G→H. That is, each container/,! By appropriately selecting the connection order of the containers, various vacuum processing steps can be performed, and even when changing the vacuum processing step, each container l, ! The process can be easily changed by simply changing the connection order.

また、処理容器lおよび搬送容器jの内容積が小さいた
め排気時間が短縮され、しかも、第3図(b) 、 (
c)に示すBと0の処理容器/、/で同一の処理を行な
うようにすれば同一行程を平行して行なうことができる
ため、生産効率が著しく向上する。
In addition, since the internal volumes of the processing container l and the transport container j are small, the evacuation time is shortened, and moreover, as shown in FIG.
If the same process is carried out in the process vessels B and 0 / and / shown in c), the same process can be carried out in parallel, resulting in a marked improvement in production efficiency.

さらに、処理容器lには被処理物が1枚ごとに収容、処
理され、内容積が小さい仁とから清掃性が高まる。
Furthermore, the processing container 1 accommodates and processes the objects one by one, and since the internal volume is small, cleaning efficiency is improved.

なお、上記実施例においては搬送容器jは西側面に開口
部2を有しているが、対向するλ側面のみに開口部を設
けるとともにこの開口部を有する面と隣接する面の幅寸
法を短かく形成した搬送容器を用いると、第≠図に示す
ように各容器l、jを連結するようになされ、A −)
 B−+O−) D −+ I!i→F −+ G−+
H→工の順に被処理物が移動するようにすることもでき
る。
In the above embodiment, the transport container j has the opening 2 on the west side, but the opening is provided only on the opposing λ side, and the width of the side adjacent to the side with this opening is shortened. When the transport container thus formed is used, the containers l and j are connected as shown in Fig. A-).
B-+O-) D-+ I! i→F −+ G−+
It is also possible to move the workpiece in the order of H→machining.

〔発明の効果〕〔Effect of the invention〕

以上述べたように本発明に係る真空処理装置は、内部に
被処理物を収容して真空処理を行なう処理容器と、内部
に被処理物を移動させる搬送装置が取付けられた搬送容
器とを、おのおの単位として上記各容器の側面に設けら
れた開口部が連通して所定の真空処理行程を形成するよ
うに適宜連結自在に構成したので、真空処理行程を変更
する場合でちっても、上記各容器を連結しなおすだけで
容易に行程を変更することができる。また、各容器が小
さく形成されるので、真空排気時間の短縮および清掃性
の向上を図ることができ、さらに、各容器のユニット化
により種々の部品を共通して使用できるため、保守等が
非常に容易になる等の効果を奏する。
As described above, the vacuum processing apparatus according to the present invention includes a processing container that accommodates a workpiece therein and performs vacuum processing, and a transport container to which a transport device for moving the workpiece is attached. Since the openings provided on the sides of each of the above containers are connected as a unit to form a predetermined vacuum processing process, the containers can be connected as appropriate, so even if the vacuum processing process is changed, each of the above containers can be connected as needed. The process can be easily changed by simply reconnecting the containers. In addition, since each container is formed small, it is possible to shorten the evacuation time and improve cleaning efficiency.Furthermore, since each container is made into a unit, various parts can be used in common, making maintenance etc. extremely easy. This has the effect of making it easier to

【図面の簡単な説明】[Brief explanation of drawings]

第1図乃至第3図は本発明の一実施例を示したもので、
第を図は横断面図、第2図(a) 、 (b)はそれぞ
れ搬送装置の斜視図、第3図(a)、 (b) 、 (
C)はそれぞれ連結状態を示す模式図、第グ図は本発明
の他の実施例を示す模式図である。 l・・・処理容器、コ・・・開口部、3・・・取付フラ
ンジ、μ・・・バルブ、!・・・搬送容器、6・・・搬
送装置、7・・・エアシリンダ、l・・・搬送アーム、
?・・・回転軸、IO・・・アーム、//・・・アーム
機構、/2・・・把持爪、/J・・・ガスヶ、) 、t
a・・・入口側カセ、)、/&・・・出口側カセ、ト。 出願人代理人 猪 股 情 熱1図 熱2目 躬3目 (a) 名4図
1 to 3 show an embodiment of the present invention,
Figure 3 is a cross-sectional view, Figures 2 (a) and (b) are perspective views of the conveyance device, and Figures 3 (a), (b), (
C) is a schematic diagram showing a connected state, and Figure G is a schematic diagram showing another embodiment of the present invention. l...Processing container, K...Opening, 3...Mounting flange, μ...Valve,! ...transport container, 6...transport device, 7...air cylinder, l...transport arm,
? ...Rotating axis, IO...Arm, //...Arm mechanism, /2...Gripping claw, /J...Gas cap,), t
a...Inlet side skein, ), /&...Exit side skein, G. Applicant's representative Ino Mata Passion 1 Figure 2 Heat 3 (a) Name 4 Figure

Claims (1)

【特許請求の範囲】[Claims] 直方体の少なくとも二側面にバルブによシ開放閉塞自在
な開口部をそれぞれ有し内部に被処理物を収容して真空
処理を行なう処理容器を設けるとともに、直方体の四側
面のうち少なくとも二側面に上記開口部と同一形状の開
口部を有し内部に被処理物を移動させる搬送装置が取付
けられた搬送容器を設け、上記処理容器と搬送容器とを
おのおの単位として上記各容器の開口部が連通して所定
の真空処理行程を形成するように適宜連結自在としたこ
とを特徴とする真空処理装置。
A processing container is provided on at least two sides of the rectangular parallelepiped, each having an opening that can be opened and closed by a valve, and in which the object to be processed is housed for vacuum processing. A transport container having an opening having the same shape as the opening and into which a transport device for moving the object to be processed is attached is provided, and the processing container and the transport container are each connected as a unit, and the openings of the containers communicate with each other. A vacuum processing apparatus characterized in that the vacuum processing apparatus is capable of being freely connected to form a predetermined vacuum processing process.
JP59076271A 1984-04-16 1984-04-16 Vacuum treatment apparatus Granted JPS60238134A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59076271A JPS60238134A (en) 1984-04-16 1984-04-16 Vacuum treatment apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59076271A JPS60238134A (en) 1984-04-16 1984-04-16 Vacuum treatment apparatus

Publications (2)

Publication Number Publication Date
JPS60238134A true JPS60238134A (en) 1985-11-27
JPS6257378B2 JPS6257378B2 (en) 1987-12-01

Family

ID=13600572

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59076271A Granted JPS60238134A (en) 1984-04-16 1984-04-16 Vacuum treatment apparatus

Country Status (1)

Country Link
JP (1) JPS60238134A (en)

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01209737A (en) * 1988-02-17 1989-08-23 Teru Kyushu Kk Semiconductor manufacturing apparatus
JPH022605A (en) * 1987-12-23 1990-01-08 Texas Instr Inc <Ti> Automated photolithographic work cell
JPH0297035A (en) * 1988-05-24 1990-04-09 Balzers Ag Vacuum apparatus
US4917556A (en) * 1986-04-28 1990-04-17 Varian Associates, Inc. Modular wafer transport and processing system
JPH0338051A (en) * 1989-06-29 1991-02-19 Applied Materials Inc Handling method and device for semiconductor wafer
US5013385A (en) * 1986-04-18 1991-05-07 General Signal Corporation Quad processor
JPH03184331A (en) * 1989-12-13 1991-08-12 Hitachi Ltd Multiple vacuum processing equipment
US5076205A (en) * 1989-01-06 1991-12-31 General Signal Corporation Modular vapor processor system
US5102495A (en) * 1986-04-18 1992-04-07 General Signal Corporation Method providing multiple-processing of substrates
US5248371A (en) * 1992-08-13 1993-09-28 General Signal Corporation Hollow-anode glow discharge apparatus
US5308431A (en) * 1986-04-18 1994-05-03 General Signal Corporation System providing multiple processing of substrates
US5344542A (en) * 1986-04-18 1994-09-06 General Signal Corporation Multiple-processing and contamination-free plasma etching system
JPH07142355A (en) * 1993-11-19 1995-06-02 Sony Corp Method and apparatus for resist treatment
US6103055A (en) * 1986-04-18 2000-08-15 Applied Materials, Inc. System for processing substrates
EP1146548A1 (en) * 1998-11-17 2001-10-17 Tokyo Electron Limited Vacuum processing system
JP2007520820A (en) * 2004-02-03 2007-07-26 エクセラーエックス, エルエルシー System and method for manufacturing
JP2008028036A (en) * 2006-07-19 2008-02-07 Phyzchemix Corp Apparatus for manufacturing semiconductor
JP2011023743A (en) * 2010-10-01 2011-02-03 Hitachi High-Technologies Corp Vacuum processing apparatus
WO2023054044A1 (en) * 2021-09-28 2023-04-06 芝浦機械株式会社 Surface treatment device

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5308431A (en) * 1986-04-18 1994-05-03 General Signal Corporation System providing multiple processing of substrates
US5102495A (en) * 1986-04-18 1992-04-07 General Signal Corporation Method providing multiple-processing of substrates
US5013385A (en) * 1986-04-18 1991-05-07 General Signal Corporation Quad processor
US6103055A (en) * 1986-04-18 2000-08-15 Applied Materials, Inc. System for processing substrates
US5344542A (en) * 1986-04-18 1994-09-06 General Signal Corporation Multiple-processing and contamination-free plasma etching system
US4917556A (en) * 1986-04-28 1990-04-17 Varian Associates, Inc. Modular wafer transport and processing system
JPH022605A (en) * 1987-12-23 1990-01-08 Texas Instr Inc <Ti> Automated photolithographic work cell
JPH01209737A (en) * 1988-02-17 1989-08-23 Teru Kyushu Kk Semiconductor manufacturing apparatus
JPH0297035A (en) * 1988-05-24 1990-04-09 Balzers Ag Vacuum apparatus
US5076205A (en) * 1989-01-06 1991-12-31 General Signal Corporation Modular vapor processor system
JPH0338051A (en) * 1989-06-29 1991-02-19 Applied Materials Inc Handling method and device for semiconductor wafer
JPH03184331A (en) * 1989-12-13 1991-08-12 Hitachi Ltd Multiple vacuum processing equipment
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JPH07142355A (en) * 1993-11-19 1995-06-02 Sony Corp Method and apparatus for resist treatment
EP1146548A1 (en) * 1998-11-17 2001-10-17 Tokyo Electron Limited Vacuum processing system
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JP2007520820A (en) * 2004-02-03 2007-07-26 エクセラーエックス, エルエルシー System and method for manufacturing
US8298054B2 (en) 2004-02-03 2012-10-30 Xcellerex, Inc. System and method for manufacturing
US9671798B2 (en) 2004-02-03 2017-06-06 Ge Healthcare Bio-Sciences Corp. System and method for manufacturing
JP2008028036A (en) * 2006-07-19 2008-02-07 Phyzchemix Corp Apparatus for manufacturing semiconductor
JP2011023743A (en) * 2010-10-01 2011-02-03 Hitachi High-Technologies Corp Vacuum processing apparatus
WO2023054044A1 (en) * 2021-09-28 2023-04-06 芝浦機械株式会社 Surface treatment device
TWI831391B (en) * 2021-09-28 2024-02-01 日商芝浦機械股份有限公司 Surface treatment device

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