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JPS60232865A - Polishing device - Google Patents

Polishing device

Info

Publication number
JPS60232865A
JPS60232865A JP8726884A JP8726884A JPS60232865A JP S60232865 A JPS60232865 A JP S60232865A JP 8726884 A JP8726884 A JP 8726884A JP 8726884 A JP8726884 A JP 8726884A JP S60232865 A JPS60232865 A JP S60232865A
Authority
JP
Japan
Prior art keywords
frame
spinning
spinning frame
polishing
revolving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8726884A
Other languages
Japanese (ja)
Inventor
Ietatsu Ono
大野 家建
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP8726884A priority Critical patent/JPS60232865A/en
Publication of JPS60232865A publication Critical patent/JPS60232865A/en
Pending legal-status Critical Current

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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

PURPOSE:To polish highly accurately by pivoting a spinning frame having a spinning shaft parallel with the revolving shaft at the outercircumference of revolving frame such that the axis of spinning frame will incline against the spinning shaft then holding many polishing tanks on the spinning frame and rotating the spinning frame and the revolving frame with proper speed. CONSTITUTION:The revolving frame 1 is journaled rotatably through spindle 3 to the base while spinning shafts 5, 5 at the opposite ends of spinning frame 4 for fixing a polishing tank are journaled between the outercircumferences of the opposite sideboards 1a, 1a of the frame 1. Material (a) to be polished is thrown together with abrasive (b) into respective polishing tank 17 and contained in respective partition 4C of spinning frame 4 to drive a motor 7 thus to rotate the spindle 3 and to revolve the spinning frame 4 around the spindle 3. Consequently, centrifugal force will function onto the spinning frame tank 4 to provide acceleration in radial direction of the revolving locus higher than the acceleration of gravity to the spinning frame 4 at anytime. Since the spinning shaft 5 and the inclined spinning frame 4 will perform pestle motion, materials (a), (b) contained in respective partition 4C will perform 8-character motion against acceleration thus to polish the entire circumference of material (a) uniformly.

Description

【発明の詳細な説明】 研磨加工する研磨装置に関するものである。[Detailed description of the invention] The present invention relates to a polishing device for polishing.

従来より、時計の部品や各種縫針、注射針及びその他比
較的小型で、かつ複雑な任意形状の物品を研磨する場合
に筒状密閉容器中に被研磨物品と□共に研磨材を収容し
、該油状密閉容器を自転して内容物を流動或は振動せし
めることに依り、共摺り作用を成して物品を研磨する各
種研磨装置が使用されている。しかしこの種の研磨装置
では研18々1化率を上げる為に筒状容器の自転速度を
増太し、それぞれの容器径について一定値以上の角速度
に達すると内容物が重力加速度を越えて容器の内壁に密
着してしまい、流動が抑制きれて研磨作用が減退するよ
う!Lなり、一定値以上の研磨速度が得られなくなる問
題を有しており、出願人は特許第786191号(実願
昭40−76310号つとして、主回転体の外周部に自
転する節状密閉容器を設けた構造の研磨装置を提供した
。しかしこの研磨装置Vこ依れば強力な押圧力で摺擦何
層′1−るため被研磨物品相互の摺擦によって研磨面に
この摺痕を残す加工品が生ずる問題を有する丈で1i1
.〈複雑な形状の物品の各面を均一に研磨加工すること
ができないものでめった。
Conventionally, when polishing watch parts, various sewing needles, injection needles, and other relatively small and complex articles of arbitrary shapes, an abrasive material is housed together with the article to be polished in a cylindrical sealed container. Various types of polishing devices are used to polish articles by rotating an oily sealed container to cause the contents to flow or vibrate to create a co-sliding effect. However, in this type of polishing device, the rotation speed of the cylindrical container is increased in order to increase the polishing rate, and when the angular velocity for each container diameter reaches a certain value or more, the contents exceed the gravitational acceleration. It sticks closely to the inner wall of the plate, and the flow is suppressed and the polishing action is reduced! L, which has the problem of making it impossible to obtain a polishing rate higher than a certain value, and the applicant has proposed a rotating nodal seal on the outer periphery of the main rotating body as patent No. 786191 (Utility Application No. We have provided a polishing device with a structure provided with a container.However, since this polishing device V uses a strong pressing force to apply abrasive layers, it is difficult to create scratches on the polishing surface due to the mutual rubbing of the objects to be polished. 1i1 with length that has the problem of leaving processed products
.. <I encountered a problem where it was not possible to uniformly polish each side of an article with a complicated shape.

本発明は上記問題に鑑み、複雑な形状の物品を、均一ニ
且つ高精度に研磨力ロエすることができると共に一何層
能率の優れた研磨装置を提供することを目的とするもの
である。
SUMMARY OF THE INVENTION In view of the above problems, it is an object of the present invention to provide a polishing apparatus that can uniformly and highly accurately polish articles with complex shapes, and is even more efficient.

即ち本発明の研磨装置は回転駆動する公転枠の外周部に
、該公転枠の公転軸と平行な自転軸を有する自転枠を、
該自転枠の軸が自転軸と傾斜するように枢設すると共に
、該自転枠に被研磨物品と研磨材を収容した1個又は多
数の研磨槽を収納保持するように構成し、自転枠と公転
枠をそれぞれ適宜回転速度及び回転方向に回転駆動して
被研磨物品を摺擦研磨するものである。
That is, the polishing device of the present invention includes a rotating frame having an axis of rotation parallel to the axis of revolution of the rotating frame on the outer periphery of the rotating frame that is driven to rotate.
The rotating frame is pivoted so that its axis is inclined to the rotating axis, and the rotating frame is configured to house and hold one or a plurality of polishing tanks containing an article to be polished and an abrasive. The rotating frame is rotated at appropriate rotational speeds and rotational directions to rub and polish the object to be polished.

以下、本発明研磨装置の一実施例を図面に従って説明す
るに、第1図は装置全体の略正面図、第2図に第1図に
於けるA7A線断面図である。(1)は基台(2)に対
し、主軸(3)を介して回動自在に軸設しft公転枠で
あり、該公転枠(1)の両側板(1a)(1a)の外周
部間には軸受部材を介して研磨槽取付用自転軸(5)と
有角度に傾斜する如く取り伺けられると共に、隣接する
自転枠(4)が交錯しない位fl I/こ複数個配設せ
しめられる。
An embodiment of the polishing apparatus of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic front view of the entire apparatus, and FIG. 2 is a sectional view taken along line A7A in FIG. 1. (1) is a ft revolution frame which is rotatably mounted on a base (2) via a main shaft (3), and the outer periphery of both side plates (1a) (1a) of the revolution frame (1). A plurality of frames are arranged in between so as to be inclined at an angle with the rotating shaft (5) for attaching the polishing tank via a bearing member, and so that adjacent rotating frames (4) do not intersect with each other. It will be done.

(6)は前記主軸(3)に対して軸着したチェノホイー
ルであり主動モータ(7)の駆動軸に軸着したチェノホ
イール(8)と無端チェノベルト(9)を介して駆動連
結されると共に、該主動モータ(7)は駆動モータ(+
01及びブレーキ装置(10a)と駆動連結せしめられ
る。
(6) is a cheno wheel that is pivotally attached to the main shaft (3), and is driven and connected via an endless cheno belt (9) to a cheno wheel (8) that is pivoted on the drive shaft of the main drive motor (7). At the same time, the main motor (7) is a drive motor (+
01 and a brake device (10a).

また(1υは上記主軸(3)に対して回動自在に軸設し
たドライブホイールでアク、ギャードモータ(12)の
駆動軸に軸着したチェノホイール(13)トチエンベル
ト(14)を介して回動連結すると共に、該ドライブホ
イール(11)と各自転枠(4)の自転軸(5) K軸
着したチェノホイール(内聞をチェノベル) u6)を
介して回動連鯖該自転枠(4) 7は仕切板(4b) 
[依って軸方向に複数個の区画(4りに仕切られ、該各
区画にはそれぞれ、1個又は複数個の研磨槽σ力を収容
し、ガタつくことなく保持することができる。当該研磨
槽α力は円筒状、或は多角形筒状の中空容器がら成ジ、
開閉自在に成る蓋部材u7a)に依って密閉可能に構成
されるものである。
In addition, (1υ is a drive wheel that is rotatably mounted on the main shaft (3), and the chain wheel (13) is pivoted on the drive shaft of the geared motor (12), which rotates via the chain belt (14). At the same time, the drive wheel (11) and the rotation axis (5) of each rotation frame (4) are connected to each rotation frame (4) via a Cheno wheel (inside is a Cheno wheel u6) attached to the K axis. ) 7 is the partition plate (4b)
[Therefore, it is divided into a plurality of sections (four sections) in the axial direction, and each section can accommodate one or more polishing tank σ forces and hold them without wobbling. The tank α force consists of a cylindrical or polygonal cylindrical hollow container,
It is constructed so that it can be sealed by a lid member u7a) which can be opened and closed freely.

上記構成に成る研磨装置は一時計の部品や各種縫針及び
注射針等の被研磨物品(a)を研磨材(b)と共に各研
M槽07)に投入し、これを自転枠(4)の各区画(4
C)に収容した状態で主動モータ(力とギャードモ−タ
圓を回転駆動して上記被研磨物品(a)を研磨しめる。
In the polishing device having the above configuration, objects to be polished (a) such as watch parts and various sewing needles and injection needles are put into each polishing tank 07) along with an abrasive material (b), and these are placed in the rotating frame (4). Each section (4
C), the main drive motor (force and geared motor circle) is rotated to polish the article to be polished (a).

即ち第4図に示すように主動モータ(7)を駆動すると
、チェノホイール(6) (8)間に掛は渡したチェノ
ベルト(9)を介して主軸(3)が回動し、該主軸(3
)と一体になった公転枠(])[自転軸(5)を介して
軸設ぜれ力が作用し、公転枠(1)を一定の角速度を越
えて回動せしめることにより、該自転枠(4) VC対
して常時重力加速度より大きい公転軌道の半径外向方向
の認位の加速度を付与することができる。このため自転
枠(4)の各区画C4C) [収容された研磨槽(17
)内に収容した被研磨物品fa)と研PM拐(1))に
は公転枠(1)が1回転する毎に軸周を1回転する向き
の加速度が加わるようになる。この状態でギャードモー
タ(121を回転駆動するとチェノベル)QJを介して
ドライブホイール01)が回動し、該ドライブホイール
(11)とチェノベルト(1,6)を介して各自転軸(
5)のチェノホイール(へ)が回動連結されているため
、該自転軸(5)と傾斜軸着した自転枠(4)は軸芯を
4tll粉本運動しながら自転軸(5)を中心に回動す
る。従って自転枠(4)の各区画(4C)に収容した研
磨槽(I7)も自転枠(4)と−緒に捕り粉本運動し槽
内の被研磨物品(a)と研磨材(b)は前記公転枠(1
)の回転運動に伴なう加速度と、該自転枠(4)の回転
運動と軸の傾斜に依り、イυ1磨槽a力の内壁に沿って
8字形流動を呈する。
That is, as shown in Fig. 4, when the main drive motor (7) is driven, the main shaft (3) rotates via the Cheno belt (9) that is passed between the Cheno wheels (6) and (8). (3
) is integrated with the revolving frame (]) [A shaft installation force acts through the rotating shaft (5), causing the revolving frame (1) to rotate beyond a certain angular velocity, thereby rotating the revolving frame (1) (4) It is possible to give the VC a recognition acceleration in the radial outward direction of the orbit that is always larger than the gravitational acceleration. Therefore, each section C4C of the rotating frame (4) [accommodated polishing tank (17
) The article to be polished (fa) and the polishing PM (1)) housed in the grinding wheel (fa) are subjected to acceleration in the direction of one revolution around the shaft circumference for every revolution of the revolving frame (1). In this state, when the geared motor (121) is rotated, the drive wheel 01) rotates via the chain belt (QJ), and each rotating shaft (
Since the Cheno wheel (5) is rotationally connected, the rotating frame (4) attached to the rotating shaft (5) with an inclined shaft rotates the rotating shaft (5) while moving the shaft center by 4tll. Rotate around the center. Therefore, the polishing tank (I7) accommodated in each compartment (4C) of the rotating frame (4) also moves to collect powder together with the rotating frame (4), and the polished article (a) and the abrasive material (b) in the tank move. is the revolution frame (1
Due to the acceleration accompanying the rotational movement of ), the rotational movement of the rotating frame (4), and the inclination of the axis, a figure-eight flow occurs along the inner wall of the polishing tank (a).

上述した研磨槽(4)内での8字形流動に依り、研磨材
(blは被研磨物品(a)の周表面丈でなく端面方向(
研磨槽軸の方向に対向する表面)にも圧接流動し、被研
磨物品(a)の全周が均一に研磨されるようVCなる。
Due to the figure-eight flow in the polishing tank (4) described above, the abrasive material (bl) is not the circumferential surface length of the article to be polished (a) but the end surface direction (
The VC also flows in pressure contact with the surface (the surface facing the polishing tank axis) so that the entire circumference of the article to be polished (a) is uniformly polished.

また自転枠(4)の回転速度を増大しても公転枠(1+
の回転速度を増大し−C半径方向の加速度を太きぐする
ことにより研磨槽07)内の被研磨物品(a)と何層材
(b)が内壁に圧接し非流動状態を生ずるようなことが
ない為、研磨速度を増大して短時間で研磨処理を行なう
ことができる特徴を発揮する。
Furthermore, even if the rotation speed of the rotating frame (4) is increased, the revolving frame (1+
By increasing the rotational speed of -C and increasing the acceleration in the radial direction, the article to be polished (a) and the multi-layer material (b) in the polishing tank 07) come into pressure contact with the inner wall, resulting in a non-flowing state. Since there are no scratches, the polishing speed can be increased and the polishing process can be completed in a short time.

さらに、上記構成のように主軸(3)を回転駆動する主
動モータ(7)と自転軸(5)を回転駆動するギャード
モ−タ(12)を別の駆動装置に依って構成した為、主
’l’lll f3)と自転軸(5)の回転比及び回転
方向を電気的な制御機構(図示せず)によって簡単に変
えることができるように成り、研磨加工の仕上状態を記
念に調整することが可能である。また特に被研醋物品(
a)相互の摺擦傷を除去する場合は研磨槽(lηに被研
磨物品(alを分散収容するもので、各研M槽(17)
K対して1個乃至数個を収容することができるため摺擦
傷の焦い高精度の表面加工仕上を行なうことができる。
Furthermore, as in the above configuration, the main drive motor (7) that rotationally drives the main shaft (3) and the geared motor (12) that rotationally drives the rotational shaft (5) are configured using separate drive devices. It is now possible to easily change the rotation ratio and rotation direction of the rotation axis (5) and the rotation axis (5) using an electrical control mechanism (not shown), and the finished state of the polishing process can be adjusted in commemoration. is possible. In addition, especially the article to be polished (
a) When removing mutual scratches, the polishing tank (17) stores the objects to be polished (Al) in a distributed manner.
Since one to several pieces can be accommodated per K, highly accurate surface finishing can be achieved with no scratches.

以」二述べたように本発明の研磨装置は、被研磨物品を
研M僧に分散収容している為、被研磨物品相互の摺擦痕
が無く、捷た槽内の8字形流動に依り全表面を均一に研
磨する特徴を有するものであり、加えて仕上精度及び加
工速度を自由に調整することができるもので、本発明実
施後の実用的効果は極めて太きい。
As mentioned above, in the polishing apparatus of the present invention, the articles to be polished are housed in a dispersed manner in the grinder, so there are no rubbing marks between the articles to be polished, and the polishing apparatus relies on the figure-eight flow in the shattered tank. It has the characteristics of uniformly polishing the entire surface, and in addition, the finishing accuracy and processing speed can be freely adjusted, and the practical effects after implementing the present invention are extremely large.

【図面の簡単な説明】[Brief explanation of the drawing]

おけるA、 −A線断面図、第3図は自転枠部のIEぼ
ノ1面図、第4図は第3図におけるB −13線拡大断
面図である。 (,1)公転枠 (3)主軸 i4)自転枠、粁 (4b)仕切板 (4り区画 (5)自転軸 (7)主動モータ (9) (+41 (161チエン
ベルト00)駆動モータ (11)ドライブホイールa
2ギャードモータ (1η研暦槽 (a)被研磨物品 (1))何層桐 特許出願人 大 野 家 建
3 is a sectional view taken along the line A and -A in FIG. 3, FIG. 4 is an enlarged sectional view taken along the line B-13 in FIG. (, 1) Revolution frame (3) Main shaft i4) Rotation frame, porcelain (4b) Partition plate (4 sections (5) Rotation shaft (7) Main drive motor (9) (+41 (161 chain belt 00) Drive motor (11 ) Drive wheel a
2 geared motor (1η research tank (a) Article to be polished (1)) How many layers of paulownia patent applicant Ken Ohno

Claims (2)

【特許請求の範囲】[Claims] (1)第1の駆動#に依り所望速度で回転する如く軸設
した公転枠に対して、該公転枠の回動軸の周1り被研磨
物品と研磨材を収容する蓋付何層槽を1個又は複数個収
納保持する構成に成ることを特徴とする研磨装置。
(1) A multi-layer tank with a lid that houses an article to be polished and an abrasive material around the circumference of the rotation axis of the revolution frame, which is arranged so as to rotate at a desired speed depending on the first drive #. A polishing device characterized by being configured to store and hold one or more.
(2) A′1丁記公転枠に軸設した自転軸が、第2の
1駆動源と連結され、所望速度及び方向に回転駆動する
ように成ることを特徴とする特許請求の範囲第1項記載
の研磨装置。
(2) Claim 1, characterized in that the rotation axis provided on the revolution frame A'1 is connected to a second drive source, and is driven to rotate at a desired speed and direction. The polishing device described in Section 1.
JP8726884A 1984-04-30 1984-04-30 Polishing device Pending JPS60232865A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8726884A JPS60232865A (en) 1984-04-30 1984-04-30 Polishing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8726884A JPS60232865A (en) 1984-04-30 1984-04-30 Polishing device

Publications (1)

Publication Number Publication Date
JPS60232865A true JPS60232865A (en) 1985-11-19

Family

ID=13910015

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8726884A Pending JPS60232865A (en) 1984-04-30 1984-04-30 Polishing device

Country Status (1)

Country Link
JP (1) JPS60232865A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0457667A (en) * 1990-06-26 1992-02-25 Ietatsu Ono Method and device for barrel polishing
CN103111936A (en) * 2013-01-28 2013-05-22 唐山晶玉科技有限公司 Highly efficient crystal edge chamfering machine and edge chamfering method of highly efficient crystal edge chamfering machine

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5840261A (en) * 1981-08-30 1983-03-09 Ietatsu Ono Bevelling method, and polishing and bevelling device for hard board member

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5840261A (en) * 1981-08-30 1983-03-09 Ietatsu Ono Bevelling method, and polishing and bevelling device for hard board member

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0457667A (en) * 1990-06-26 1992-02-25 Ietatsu Ono Method and device for barrel polishing
CN103111936A (en) * 2013-01-28 2013-05-22 唐山晶玉科技有限公司 Highly efficient crystal edge chamfering machine and edge chamfering method of highly efficient crystal edge chamfering machine

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