JPS6022383Y2 - light emitting diode display - Google Patents
light emitting diode displayInfo
- Publication number
- JPS6022383Y2 JPS6022383Y2 JP2838180U JP2838180U JPS6022383Y2 JP S6022383 Y2 JPS6022383 Y2 JP S6022383Y2 JP 2838180 U JP2838180 U JP 2838180U JP 2838180 U JP2838180 U JP 2838180U JP S6022383 Y2 JPS6022383 Y2 JP S6022383Y2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- flexible substrate
- reflective frame
- diode display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
Description
【考案の詳細な説明】
本案は特に小型表示器に有効な放熱特性のよい発光ダイ
オード表示器に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a light emitting diode display with good heat dissipation characteristics, which is particularly effective for small-sized displays.
従来発光ダイオード表示器は第１図に示すようにプリン
ト基板１１の上に発光ダイオード１２゜１２を載置固着
し、反射枠１３で発光ダイオード１２．１２を囲ったの
ち、光拡散シート１５を貼付固着又は外被ケース１７に
より固定していた。In the conventional light emitting diode display, as shown in FIG. 1, a light emitting diode 12.12 is mounted and fixed on a printed circuit board 11, and after surrounding the light emitting diode 12.12 with a reflective frame 13, a light diffusion sheet 15 is attached. It was fixed by fixation or by the outer case 17.
しかし特に表示器が小さい場合、発光ダイオード１２．
１２が近接してしまうので放熱することができず、小さ
い電流で暗い表示をするか又は発光ダイオードの寿命を
短かくしたり発光色が長波長側にずれたりするのを無視
して大きい電流を流して表示を明るくしていたが、いず
れも不都合であった。However, especially if the display is small, light emitting diodes 12.
12 are too close to each other, heat cannot be dissipated, and a small current will produce a dark display, or a large current will be applied, ignoring the possibility of shortening the life of the light emitting diode or shifting the emitted light color to the longer wavelength side. However, both methods were inconvenient.
本案はこのような欠点をなくし、小型でも充分放熱性の
よい表示器に関するもので、以下本案を詳細に説明する
。The present invention eliminates these drawbacks and relates to a display device that is small but has sufficient heat dissipation.The present invention will be described in detail below.
第２図は本案実施例の発光ダイオード表示器の断面図で
、１はポリイミド樹脂等からなる厚さ１５乃至２００μ
ｍのフレキシブル基板である。FIG. 2 is a cross-sectional view of a light emitting diode display according to an embodiment of the present invention, in which 1 is made of polyimide resin or the like and has a thickness of 15 to 200 μm.
It is a flexible substrate of m.
フレキシブル基板とは樹脂薄板（ベース）上に導電箔を
設けたもの又はさらにその導電箔を樹脂被覆したもので
あるが、ここで利用できるものは、そのいずれかでもよ
い。A flexible substrate is one in which a conductive foil is provided on a thin resin plate (base), or one in which the conductive foil is further coated with a resin, and any of these can be used here.
但し導電箔の樹脂被覆がないものの場合は裏返してベー
スを上にする。However, if the conductive foil does not have a resin coating, turn it over so that the base is facing up.
そしていずれの場合も上面の所望の部分では発光ダイオ
ードの載置配線用に導電箔（図示せず）が露出している
。In either case, a conductive foil (not shown) is exposed at a desired portion of the upper surface for mounting wiring for the light emitting diode.
２，２はＧａＰ等の発光ダイオードで、フレキシブル基
板１の前述した表面に露出している導電箔上に載置固着
されている。Reference numerals 2 and 2 designate light emitting diodes such as GaP, which are mounted and fixed on the conductive foil exposed on the above-mentioned surface of the flexible substrate 1.
３はアルミニウムダイキャスト等からなる反射枠で、発
光ダイオード２，２を囲む透孔４，４を有しており、裏
面には前記フレキシブル基板１を熱圧着等の方法で固着
保持している。Reference numeral 3 denotes a reflective frame made of die-cast aluminum or the like, which has through holes 4, 4 surrounding the light emitting diodes 2, 2, and has the flexible substrate 1 fixedly held on its back surface by a method such as thermocompression bonding.
５はポリエステル等からなる光拡散シートで、前記透孔
４，４の上を覆うようにして反射枠３の表面に貼着しで
ある。Reference numeral 5 denotes a light diffusion sheet made of polyester or the like, which is attached to the surface of the reflective frame 3 so as to cover the through holes 4, 4.
フレキシブル基板１は一辺を延在させて駆動用回路基板
（図示せず）に接続したり、あるいは直接フレキシブル
基板１の上に集積回路６を取りつけたりしてもよい。The flexible substrate 1 may be connected to a driving circuit board (not shown) by extending one side thereof, or the integrated circuit 6 may be directly mounted on the flexible substrate 1.
文字高６ＴＩｒ！！ｔの口字状をなす数字表示器の場合
を例にとって上述の反射枠の大きさを具体的に示すと、
反射枠の厚みは１．５乃至２．５層で、透孔４，４の底
面開口縁は１辺０．９７７１１Ｆ＋の四辺形であり、又
表面開口縁は巾０．９ｒｒｒｒｎ長さ２．８ｒＩｒＩＩ
ｔの略短冊状である。Character height 6TIr! ! Taking as an example the size of the above-mentioned reflective frame in the case of a numeral display in the shape of a letter T, we have the following:
The thickness of the reflective frame is 1.5 to 2.5 layers, the bottom opening edge of the through holes 4, 4 is a quadrilateral with one side of 0.97711F+, and the surface opening edge is 0.9rrrrn in width and 2.8rIrII in length.
It has a substantially rectangular shape of t.
さらにこの透孔４，４は反射窓としての役目を果すため
に壁面が適度になめらかに仕上げられている。Furthermore, the wall surfaces of the through holes 4, 4 are finished to be suitably smooth in order to serve as reflective windows.
またフレキシブル基板１の反射枠３に対する固着保持は
前記熱圧着等によるわけであるが、脱気した接着剤を用
いたり、あるいはフレキシブル基板表面をプレヒートな
どで少し溶かして溶着ぎみにする等して、極力完全密着
する事が望ましい。In addition, the flexible substrate 1 is fixedly held to the reflective frame 3 by thermocompression bonding, etc., but it is also possible to use a degassed adhesive, or to slightly melt the surface of the flexible substrate by preheating to make it almost welded. It is desirable to have complete contact as much as possible.
これは本考案は、発光ダイオード２，２で生じた熱がフ
レキシブル基板１ （実際にはフレキシブル基板に設け
である導電箔）を伝ってすぐ近くにある反射枠３に移り
、反射枠３で拡散・放熱させる事を目的としているので
、フレキシブル基板１と反射枠３との熱伝達がスムーズ
に行なわれるためには気泡等がない方がよいからである
。This is because the heat generated by the light emitting diodes 2, 2 is transmitted through the flexible substrate 1 (actually a conductive foil provided on the flexible substrate), transferred to the nearby reflective frame 3, and is diffused by the reflective frame 3. - Since the purpose is to dissipate heat, it is better to have no air bubbles or the like in order to ensure smooth heat transfer between the flexible substrate 1 and the reflective frame 3.
又、ガラスエポキシ等従来用いてきた樹脂基板では、ス
ルーホール技術を用いたとしても金属反射枠を用いれば
、表面には導電箔が残るし、それを樹脂で被覆しても硬
質基板と金属反射枠のこすりあわせによって短絡事故等
生じるし、基板と反射枠とを密着させるというのは極め
て困難である。In addition, with conventional resin substrates such as glass epoxy, even if through-hole technology is used, if a metal reflective frame is used, a conductive foil will remain on the surface, and even if it is covered with resin, the hard substrate and metal reflective frame will remain. Rubbing the frames together can cause short circuit accidents, and it is extremely difficult to bring the substrate and reflective frame into close contact.
しかし本考案のようにフレキシブル基板であれば、基板
それ自体がもつ可撓性により、金属反射枠が触れても被
覆やベースが剥離損傷することがなく、従って、短絡事
故なくして密着させることが易であり、さらに固着後は
反射枠３がフレキシブル基板１の補強支持台ともなるの
で極めて好ましい。However, with a flexible substrate like the one proposed in this invention, the flexibility of the substrate itself prevents the coating and base from peeling off and being damaged even if the metal reflective frame touches it, and therefore it is possible to make a close contact without causing short circuits. This is extremely preferable because it is easy to use, and furthermore, the reflective frame 3 also serves as a reinforcing support for the flexible substrate 1 after it is fixed.
以上の如く本案は透孔を成す反射窓を有した金属製の反
射枠と、反射枠の底面に貼付固着されたフレキシブル基
板と、反射窓内に位置するようにフレキシブル基板上に
固着された発光ダイオードとを具備しているので、放熱
特性がよく、又金属反射枠を用いても短絡事故の如きは
生じない。As described above, the present invention consists of a metal reflective frame with a reflective window forming a transparent hole, a flexible substrate attached and fixed to the bottom of the reflective frame, and a light emitting device fixed to the flexible substrate so as to be located inside the reflective window. Since it is equipped with a diode, it has good heat dissipation characteristics, and even if a metal reflective frame is used, short-circuit accidents will not occur.
第１図は従来の表示器の断面図、第２図は本案実施例の
発光ダイオード表示器の断面図である。
１・・・・・・フレキシブル基板、２，２・・・・・・
発光ダイオード、３・・・・・・反射枠、４，４・・・
・・・透孔。FIG. 1 is a sectional view of a conventional display, and FIG. 2 is a sectional view of a light emitting diode display according to an embodiment of the present invention. 1...Flexible board, 2,2...
Light emitting diode, 3... Reflective frame, 4, 4...
...Through hole.
Claims (1)
底面に貼付固着されたフレキシブル基板と、反射窓内に
位置するようにフレキシブル基板上に固着された発光ダ
イオードとを具備した事を特徴とする発光ダイオード表
示器。It is equipped with a metal reflective frame having a reflective window with a transparent hole, a flexible substrate attached and fixed to the bottom of the reflective frame, and a light emitting diode fixed on the flexible substrate so as to be located inside the reflective window. A light emitting diode display device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2838180U JPS6022383Y2 (en) | 1980-03-04 | 1980-03-04 | light emitting diode display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2838180U JPS6022383Y2 (en) | 1980-03-04 | 1980-03-04 | light emitting diode display |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56130982U JPS56130982U (en) | 1981-10-05 |
| JPS6022383Y2 true JPS6022383Y2 (en) | 1985-07-03 |
Family
ID=29624303
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2838180U Expired JPS6022383Y2 (en) | 1980-03-04 | 1980-03-04 | light emitting diode display |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6022383Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000055926A1 (en) * | 1999-03-18 | 2000-09-21 | Rohm Co., Ltd. | Light-emitting semiconductor chip |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6045079A (en) * | 1983-08-23 | 1985-03-11 | Honda Motor Co Ltd | Flexible lamp using light emitting diode |
| JP4124129B2 (en) * | 2004-01-23 | 2008-07-23 | セイコーエプソン株式会社 | Light source device and projector |
| JP2006128562A (en) * | 2004-11-01 | 2006-05-18 | Nikon Corp | Light emitting device |
| US20090032829A1 (en) * | 2007-07-30 | 2009-02-05 | Tong Fatt Chew | LED Light Source with Increased Thermal Conductivity |
| WO2023195188A1 (en) * | 2022-04-09 | 2023-10-12 | エレファンテック株式会社 | Display device and method for manufacturing same |
-
1980
- 1980-03-04 JP JP2838180U patent/JPS6022383Y2/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000055926A1 (en) * | 1999-03-18 | 2000-09-21 | Rohm Co., Ltd. | Light-emitting semiconductor chip |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56130982U (en) | 1981-10-05 |
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