JPS6021051A - Lens projection and exposure method and its device - Google Patents

Abstract

PURPOSE:To enable an original pattern on an original pattern base projected on the material to be exposed to coincide with said material in the whole exposure region by detecting the relative position and the inclination angles of the original pattern base, the material to be exposed, and a lens for projecting a pattern unmagnified or contracted in a state attached to the device, and controlling them. CONSTITUTION:An original pattern base 28 is placed on its stage 29 controllable in the coordinate positions in the three rectangularly intersecting axes, and the rotation angles alpha, beta, theta around each axis. An original pattern 31 is focused on the material 33 to be exposed through an unmagnifying or contracting lens 32. The relative positions of the pattern 31 on the base 28 and a pattern 36 always formed on the material 33 can be detected with relative position detectors 34, 35.

Description

[Detailed Description of the Invention] [Technical Field of the Invention] Does the present invention relate to integrated circuits? The present invention relates to a lens projection exposure method and apparatus used for tan formation. There are a same-magnification projection exposure apparatus and a reduction projection exposure apparatus, and it is applicable to both, but it is particularly effective when applied to a reduction projection exposure apparatus.

[Technical background of the invention and its problems]

Among conventional methods and apparatuses, first, FIG. 1 shows the principle concept of a method and apparatus for moving an original substrate and exposing a same-sized or reduced projection image of the original onto a desired position on an object to be exposed. In Fig. 1, 1 is the original substrate, 2 is the exposed object coated with a photosensitive agent, 3 is the exposed object moving table, 4 is the exhibition object moving table positioning device, 5 is the positioning command circuit, and 6 is the position 1d detection. vessel,
7 is an arithmetic unit, 8 is an equal-magnification or reduction projection lens, 9 is an original substrate moving table, 10 is an original substrate moving table positioning device, 11
1 is an exposure command circuit, and 12 is an exposure light source.

In the conventional device, the arrangement is as described in Japanese Patent Publication No. 18043/1983.
JP-A-54-96374%, JP-A-55-1622
As shown in Publication No. 27, US Patent No. 4.057.347, etc., the exposure apparatus for projecting the original substrate 1 onto the exposed object 2 coated with the photosensitive agent at the same magnification or reduction is controlled as follows.

The object moving stage 3 on which the object 2 to be exposed is attached is positioned by giving a command from the positioning command circuit 5 to the object moving stage positioning device 4.

The position detector 6 detects the actual position of the exposed object moving table 3, and the calculator 7 calculates the difference ΔX between the actual position 14 and the command target value from the positioning command circuit 5. , the difference ΔX is divided by the magnification of the equal-magnification or reduction projection lens 8, and the calculation result is transmitted to the positioning device 10 of the original substrate moving table 9 on which the original substrate 1 is mounted. The original substrate moving table positioning device 1o positions the original substrate moving table 9 according to the calculation result. The original substrate moving table 9 is moved by ΔX, ie -1, to compensate for the positional error of the exposed object 2.

In the above explanation, the positioning error ΔX is treated as one-dimensional for the purpose of explaining the principle, but in reality, the positioning error ΔX is treated as one-dimensional.
No. 74, Japanese Unexamined Patent Publication No. 55-162227, US Pat.
y, and in some cases, positioning error Δθ due to relative rotation between the original substrate 1 and the object 2 to be exposed, to compensate for the positional error of the object 2 to be exposed.

When the original substrate moving table 9 is positioned at the desired position, the original substrate moving table positioning device (<1o is the exposure command circuit 11
The fM signal indicating the end of positioning is sent, and the shutter of the exposure light source 12 is opened and closed to expose a small or equal size projection image of the turn original onto the desired position on the overlapping object 2.

As described above, in the method and apparatus for controlling the exposure position of a reduced-scale projected image onto the object 2 by moving the original substrate 1 within its plane, the positioning error can be reduced by adjusting the positioning error of the reduced-scale projection lens 8. You only need to control the amount divided by the magnification, so
If you ask me, the control fi7 is 10 times that of positioning. ') can be done. That is, if you line up the original board 1 1. I
If it can be moved with an accuracy of 1 m, a positioning error of 0.1 μm of the object 2 to be exposed can be compensated for.

On the other hand, methods and devices for controlling the same-size or reduced projection exposure position by moving the exposed object without moving the original substrate are also widely used as conventional techniques (Japanese Patent Laid-Open No. 57-15343
No. 2, JP-A-55-134934). The principle of this type of prior art is shown in FIG. Although only the Xl axis is shown, the same applies to cases where Y and θ are aligned.

13 is an original board, 14 is a position detector, 15 is a positioning command circuit, 16 is a positioning device, 17 is an object to be illuminated, 1
8 is a moving table, 19 is an exposure command circuit, 20 is an exposure light source, 2
1 is an equal-magnification or reduction projection lens. In FIG. 2, the original substrate 13 is fixed in a predetermined position. Next, based on the position information from the position detector 14, a command is issued from the positioning command circuit 15, and the positioning device 16 moves the exposed object 1.
To accurately position a moving table 18 on which No. 7 is attached. After this, a command is issued from the exposure command circuit 19, and the exposure light source 20
The shutter is opened and closed to expose a projected image of the original substrate 13 to a desired position on the object 17 through the projection lens 21 .

As described above, the method and apparatus for determining the exposure position by moving the object 171IIll to be exposed has the advantage of being simple because no fine movement mechanism is left on the original substrate 13 side.

However, in any case, in the various conventional techniques shown above, it is assumed that the dimensions of the original substrate 1 or 13 and the exposed object 2 or 170 are ideal values, and the Mark Yoshi, original drawing board 1
Alternatively, it is assumed that the relative positioning error between 13 and the exposed object 2 or 17 is uniquely determined, and if this is corrected, the entire object will overlap. That is, for example, as shown in FIG. 3, mark the two places A and H on the original substrate 1 or 13 with N marks, and then mark the corresponding positions A/, B/ on the exposed object 2 or 17. When marking a mark with a ten mark,
÷ mark spacing L1 and A/, B at A and B
The distance L/ between the + marks at l ideally satisfies the relationship kL=L', and both A and A' and B and B' are visible on the valve through the equal magnification or reduction projection lens 8 or 2. We are assuming a case where they are stacked so that the number 10 is in the center.

However, in reality, ■ Original image An original image formed on the original substrate 1 or 13.

Dimensional error in the distance between marks; ■ Error in magnification based on the error in the distance between the focal length of the equal magnification or reduction projection lens 8 or 21 and the original substrate 1 or 13; ■ Distortion of the same magnification or reduced projection image due to lens distortion, ■ Expansion or contraction of the original image substrate 1 or 13° and the exposed object 2 or 12 due to temperature changes; ■ Distortion of the original image with the original image magnified or reduced projection lens 8 or 21 due to temperature changes; Changes in magnification based on changes in distance from the substrate 1 or 13; ■ Deformation of the exposed object 2 or 17 based on various processes such as heat treatment, machining, and chiming other than exposure that the temporary beam object 2 or 17 undergoes; Strictly speaking, it is normal that kL=L' does not hold. Therefore, for example, if A and A' are positioned, B and B'
can be positioned in the X direction, but cannot be matched in the X direction. Naturally, the arm tongue locations other than A-A' and B-B', such as c-c', are shifted in both the X direction and the X direction.

The dimensional error between the original substrate 1 or 13 and the exposed object 2 or 17 due to the causes of (1) to (3) above is (kL-L'), that is, the surface dimension of the exposed object, and is usually on the order of 0.5 μm or less, but If the line width is around 1 μm and high precision positioning is required, the positioning error at the positioning mark point will be much larger.
Alternatively, even if the substrate 13 or the exposed object 2 or 17 is precisely controlled, as long as the dimensions of the original substrate 1 or 13 are different from the dimensions of the pre-formed pattern of the exposed object 2 or 11. , it is impossible to superimpose the two in the desired relationship. Figure 4 shows this situation.

[Purpose of the invention]

In order to eliminate the above-mentioned disadvantages, the present invention detects and controls the relative position and inclination angle between the original substrate and the object to be exposed and the same-magnification or reduced-magnification projection lens while it is attached to the apparatus. One dimension of the shape of the magnified or reduced projection image is changed according to the already formed/4' tongue of the exposed object so that both can match over the entire area within the exposure area with overlay accuracy at the alignment mark point. A method and apparatus.

[Embodiments of the invention]

The drawings will be described in detail below.

The fifth drawing is a diagram for explaining the principle of the present invention, 22 is the original substrate, 23 is the original button, 24 is the same magnification or reduced projection lens, 25 is the object to be exposed, 26 is the same magnified or reduced projection image, 27 is a pre-formed baton.

An original image 23 of size L on the original image substrate 22 is projected onto the exposed object 25 through the same magnification or reduction projection lens 24.
Suppose that the image is formed at ′. This same size or reduced projection image 26 becomes the exposure image. If the front and rear focal points of the equal-magnification or reduction projection lens 24 are respectively F++F2, the distance from the principal point 0 of the lens 24 to the original pattern 23 is 31, the distance to the equal-magnification or reduction projection image 26 is b1, and the focal length is f. A relationship is established. k is a magnification.

When comparing the already formed pattern 27 of the object 25 to be exposed by superimposing the same size or reduced projection image 26, the already formed pattern 2
The dimension L// of 7 should originally be L // -L/, but due to the above reasons, it is generally L// == Lt
It is not. The present invention provides a projection image 26 of equal size or reduced size by controlling the distances Ma and b to appropriate values.
Dimensions 1. / is changed to match the dimension L" of the pre-formed tongue. In other words, the condition that L"=L', which should originally be a groove, is satisfied.

In equations (1) and (2), the only value specific to the reduction projection lens 24 is the focal length f, and the distance ti7
As long as I m and b satisfy the equation (1), there will be no problem in forming an image.

Therefore, in order to set L'=L", (2) should be changed and (1
).

If L'=L"+ΔL,ΔL)0, this is the position where the equal-magnification or reduction projection lens 24 should be placed when forming the reduced projection image 26 with the dimension L'.

Therefore, the dimension L' of the same size or reduced projection image 26 is
If the dimension L of the pre-formed button 27 on the object 25 to be exposed is larger than that, move the original substrate 22 a little further away from the same magnification or reduction projection lens 24 by a corresponding predetermined distance. , the object 25 to be exposed should be moved closer to the same magnification or reduction projection lens 24. If L<L", the opposite movement may be performed.

Therefore, for example, due to the reasons mentioned above, as shown in FIG. If the dimensions are different, the above principle can be applied as is to change the original board 22.
, the distance between the equal-magnification or reduced projection lens 24 and the exposed object 25 may be changed so that the equal-magnified or reduced projection image 26 and the preformed pattern 27 match.

However, if the shape of the pre-formed pattern 27 is distorted with respect to the same size or reduced projection image 26 as shown in FIG. The distance of the equal-magnification or reduction projection lens 24 may be changed depending on the location, and the projection lens 24 may be tilted relatively, and the exhibition light object 25 may be tilted accordingly. In the case of FIG. 7, move the side corresponding to the side PQ of the same-size or reduced-scale projection image 26 of the original pattern 23 away from the same-sized or reduced-scale projection lens 24, and move the side 1) of the exposed object 25 by a corresponding distance. It is only necessary to bring it closer to the reduction lens 24.

The same is true when the distortion occurs not only in one direction as shown in FIG. 7, but also in two directions as shown in FIG. What is necessary is to control the relative inclination angle of the direction.

In order to change the relative positions and inclination angles of the original image substrate 22, the same-magnification or reduction projection lens 24, and the exhibition object 25, the positions and inclination angles of any two or more of these may be changed.

In addition, as originally shown in the causes ① to ① above, the distance and inclination angle should be very small, and if the depth of focus of the equal-magnification or reduction projection lens 24 is within the range of the focal depth of the exposed object 25.
There is no need to change the position and inclination angle of. Original board 2
When the position and stiffness angle of one of the two equal-magnification or reduction projection lenses 24 are variable and the other is fixed, the object 25 to be exposed must always be placed at a constant position with respect to the equal-magnification or reduction projection lens 24 for the above-mentioned reasons. The present invention is effective even if the model is maintained;

FIG. 9 shows an embodiment of the present invention, 28 is an original board, 29
30 is an original substrate stage, 30 is a chief ray bundle, 31 is an original pattern, 32 is an equal-magnification or reduction projection lens, 33 is an object to be exposed, 34, 35 is a relative position detection device, 36 is a pre-formed lens, 37 to 44 are reflecting mirrors, 49 is an exposed object stage,
50 is a moving stage, 5 is a computing unit, 52 is an original substrate stage drive circuit, 53 is an exposed object stage drive circuit, 5
4 is an exposure command circuit, and 55 is an exposure light source.

The original substrate 28 is mounted on an original substrate stage 29 that can adjust the position coordinates in the x, y, and z directions of three orthogonal axes and the rotation angles α, β, and θ of each axis. X.

Regarding how to take Y, z, α, β, and θ, there are cases where the principal ray bundle 30 is vertical as shown in the figure, horizontal cases, and cases where a reflecting mirror is installed in the middle and the direction of the optical path changes. , the direction in which the principal ray bundle 30 is incident is assumed to be 2.

Four and three original images on the original image substrate 28 are imaged onto an object to be exposed 33 by a same-magnification or reduction projection lens 32 .

Due to the relative position detection devices 34 and 35, the original board 28
The relative positional relationship between the upper original pattern 4 tongue 31 and the already formed pattern 36 on the object 33 to be exposed is detected. In order to detect the relative positional relationship, detection marks may be provided at corresponding positions on the original substrate 28 and the exposed object 33 that should overlap. By detecting the position of each mark using a photoelectric or laser interferometer, the relative positional relationship is established. Alternatively, the marks to be overlapped and the /4' tongues 3 and 36 themselves may be observed or their deviations may be measured using a combination of an image pickup tube and a television receiver, a microscope, or the like.

Incidentally, the reflecting mirrors 37 to 44 shown in FIG. 9 are inserted to clearly draw the optical path and have no particular meaning. On the other hand, original drawing A? Regarding the method of detecting the relative positional relationship between the methane 1 and the pre-formed button 36, as shown in Fig. 9, they are not detected separately, but are detected simultaneously through the same-magnification or reduction projection lens 32 as shown in Fig. 1O. You may.

In the case of FIG. 10, the reflection m4s*4e is also shown for convenience, and as shown by the broken line, an optical path using a 47.48 reflector may be used, and the so-called so-called TTL method (Through T
This shows that the method can be applied to detection using the he Lenss method).

Original drawing/? In order to know the difference in the corresponding dimensions between the methane 1 and the pre-formed button 36, it is necessary to detect the relative positional relationship at at least two places. For example, as shown in FIG. Compare the two corresponding positions shown.

On the other hand, X.

In order to detect the dimensional difference in the Y direction and the distortion of the pattern shape, it is necessary to detect one relative position at three or more points, depending on the degree, for example, as shown in Figures 12 to 14. It is. In both cases, the 10 marks are detection points with a relative position of 1.delta., and the number of relative position detection devices is increased according to the number of detection points.

The exposure object 33 is mounted on an exposure object stage 49 so that the rotations α and β around two axes X and Y perpendicular to the directions 2 and 2 of the principal ray bundle can be adjusted.

The depth of focus of the same magnification or reduction projection lens 32 is approximately determined by the reduction magnification and the numerical aperture, but in the case of the reduction magnification - and the numerical aperture 0.35 in the equipment under the most severe conditions currently used, it is approximately ±1 μm to ±2 μm0. Well, everything else is bigger than this.

On the other hand, in this case, if the distance between the original drawing board 28 and the lens 32 is, for example, 500 mm, the fine movement stitch of the original drawing board 28 that needs to be moved in order to increase or decrease the size of the reduced projection image of 10 mm size by o, 1 μm is as follows. As can be easily seen from Figure 5, it is approximately.

According to calculations, the amount of movement in two directions of the beam position and the imaging position is as follows.
Approximately 5μmX (reduction magnification)2=5μmX(-!-)2=o,
osμm0.

Therefore, if the size adjustment is within ±2 to 3 μJ degrees, the amount of change in the imaging position will fall within the depth of focus.

In such a case, the adjustment mechanism of the exposed object stage 49 is such that the surface of the exposed object 33 is
It only needs to have a function to maintain the position at a constant position with respect to the 2, α, and β adjustment mechanisms.

In addition, when projection exposure is required at a plurality of locations on the exposed object 33, the exposed object stage 49 is mounted on the exposed object moving stage 50 in order to step and repeat. The moving stage 5o is provided with a minimum X and Y positioning function of 16.

After the unveiling object 33 is moved to approximately a predetermined exposure position 1d by the moving stage 50, the relative positional relationship between the original pattern button 3 and the preformed pattern 36 is checked. The arithmetic unit 51 calculates the positional misalignment and dimensional difference between the two, and sends adjustment commands for x, y, and θ to the original substrate stage drive circuit 52 to compensate for the misalignment, and 2° for the dimension and distortion compensation. Adjustment commands regarding α and β are issued, and drive commands regarding Z, α, and β are issued to the exposed object stage drive circuit 53 for adjusting the imaging position in accordance with dimension and distortion compensation.

The original board stage drive circuit 52 and the exposed object stage drive circuit 53 are connected to the original board stage 29 and the board stage 3'', respectively.
The A optical object stage 49 is driven to align the pre-formed button 36 and the original button 31, including dimension and distortion compensation.

After alignment, use the relative position detection device ffl: 3 r again
e and 35, the relative position 11- of both can be detected, and the above positioning operation can be repeated until the positional deviation at each position detection point is below the allowable value. The pre-formed tongue 36 and the original tongue 31 can be matched with high accuracy.

[After completing the matching, arithmetic unit 51J, ! A signal is sent to the light command circuit 54, and the shutter of the exposure light source 55 is opened and closed for exposure.

In the above description, in order to perform calculations for separating misalignment and size and shape errors using the calculator 51 based on the information from the relative position detecting devices 34 and 35, the relative calculation is performed as follows. FIG. 15 is an explanatory diagram of one dimension of positional deviation, shape error, and calculation when marks are provided at two locations as shown in FIG. 11.

The original pattern 31 is attached to the already formed button 36 on the exposed object 33.
Assuming a case where the reduced projection images of are superimposed, 56 and 57 are already formed button marks, and 58 and 59 are original image i9 button marks. Pre-formed 4 tongue marks 56 at 2 locations A and B
．． Original drawing for 57/Yatan mark 5FJ, X of 59,
Let the threads in the Y direction be ΔXA, ΔYA, ΔXB, and ΔYB, respectively. If the interval between marks is t, the difference in dimension Δ1X in the X direction is ΔtX - ΔXA - ΔXB The positional deviation in the X direction is ΔX = 7 (ΔXA + ΔXB) ΔY in the Y direction
=-(lYA+ΔYB)θ direction is Δθ=zu(ΔYA-
ΔYB).

If the dimensional error is the same in the x and x directions and is uniform within the exposure area, dimensional compensation may be performed based on the value of Δtx.

In addition, if the dimensional error changes in the x, It is obvious that the dimensions and distortions may be compensated so that the alignment error is minimized.

Furthermore, in FIG. 9, as mentioned above, the original substrate stage 29
51 motion system was allocated to the exposed object stage 49, but the fifth
As already mentioned in the explanation of the figures, it is clear that the drive system can be allocated to these three so that the distance relationship between the original substrate 282, the same-magnification or reduction projection lens 32, and the object 33 to be exposed can be adjusted.

In addition, the relative position detection device 34.35 is provided,
An original pattern 31 and a pre-formed pattern 3 are formed on the photosensitive agent by trially exposing a sander having the same properties as the object 33 to be exposed.
The present invention is also applicable even if a difference in size is detected by observing 6 with a microscope or the like.

〔Effect of the invention〕

As explained above, according to the present invention, in lens projection exposure, it is possible to align the already formed button on the object to be exposed and the original pattern to be exposed, and at the same time compensate for the difference in size and shape distortion between the two. Therefore, it is possible to improve the overlay accuracy of the already formed button and the exposure original pattern when viewing the entire exposure area.

Therefore, ■ it is possible to compensate for the dimensional errors of the original board of each layer during integrated circuit creation and the dimensional variations between many working original boards in the same layer, and ■ it is possible to improve compatibility when using multiple exposure devices together in nib-reading, etc. can be significantly improved.

(2) It can be applied to a so-called hybrid exposure process, which is a process for producing an integrated circuit using a different type of exposure device, such as an electron beam exposure device, an X-ray exposure device, a reflection projection light exposure device, a contact type light exposure device, etc.

■ Can respond to changes in dimensions of the original substrate and exposed object due to temperature changes.

■ The projection magnification can be adjusted to a predetermined value at any time without strict temperature control of the device.

■ Can be used even if the exposed object is deformed and its dimensions change due to heat treatment, etching, etc.

There are many advantages such as.

Therefore, even if a projection lens or exposure optical system with the same resolution of exposure and armpits as the conventional one is used, the overlay margin of the Kashin Uum design can be reduced, which reduces the degree of integration and product yield. It is possible to increase it significantly.

[Brief explanation of drawings]

Fig. 1 is a conceptual diagram of a conventional lens projection exposure method, Fig. 2 is a conceptual diagram of another conventional lens projection exposure method, Fig. 3 is an explanatory diagram of overlapping the original substrate and the exposed object, and Fig. 4 5 is a diagram explaining the principle of the present invention, and FIGS. 6 to 8 are diagrams showing the dimensional difference between the original substrate, the projected image, and the already formed button, respectively. An explanatory diagram showing shape distortion, Fig. 9 is a conceptual diagram of an embodiment of the present invention, Fig. 10 is a conceptual diagram of another embodiment of the method of detecting the relative position between the original slam and the already formed button, and Fig. 11 ~Figure 14 shows the difference in flat tongue dimensions. Figure 15 is a diagram showing the detection position mark 11 for detecting shape distortion, and Fig. 15 is an explanation of one dimension of positional deviation and shape error calculation. DESCRIPTION OF SYMBOLS 1... Original board, 2... Object to be exposed, 3... Object moving table, 4... Optical object moving table positioning device, 5.
...Positioning command circuit, 6...Position detector, 7...
Arithmetic unit, 8... Equal magnification or reduction projection lens, 9...
Original substrate moving table, 10... Original substrate moving table positioning device, 11... Exposure command circuit, 12... Exposure light source, 1
3... Original board, 14... Position detector, 15...
Positioning command circuit, 16... Positioning device, 17...
・Object to be exposed, 18... Moving table, 19... Exposure command circuit, 20... K6 light source, 21... Equal magnification or reduction projection lens, 22... Original image board, 23... Original drawing no. 9
Tan, 24... Equal magnification or reduction projection lens, 25...
・Exposed object, 26... Same size or reduced projection image, 27.
...Pre-formed mother tongue, 28...Original drawing board, 29...
Original drawing substrate stage, 30... Chief ray bundle, 31... Original drawing button, 32... Equal magnification or reduction projection lens, 33
...Exposed object, 34.35...Relative position detection device,
36°...pre-formed tongue and tongue, 32-48...reflector,
49...Exposed object stage, 50...Movement stage, 5...Arithmetic unit, 52...Original substrate stage drive circuit, 53...Exposed object stage drive circuit, 54...
・Exposure command circuit, 55...Exposure light source, 56.57...
・Pre-formed tanning mark, 58.59...Original drawing/yatan mark. Applicant's agent Patent attorney Takeshi Suzue Figure 1 Figure 2 Figure 3 t, 'rjA Figure 5 Figure 9 55 Figure 10 Figure 11 Den 12 IF 51.17: lgo 36 Figure 13 Figure 14

Claims (6)

[Claims] (1) In a method in which the pattern on the original substrate is exposed and transferred through a projection lens onto an exposed object coated with a photosensitive agent, the original pattern on the original substrate and the already formed pattern on the exposed object are transferred.
Difference in corresponding dimensions from tongue. The relative shape distortion of the pattern is detected, and based on the detection result, the mutual spacing and relative inclination angle between the original substrate, the projection lens, and the exposed object are adjusted to correspond to the projection exposure image of the arm tongue of the original pattern. The dimensions and shape are corrected so that they overlap with the pre-formed holes on the object to be exposed in the desired relationship, and then the original substrate and the object to be exposed are aligned within the hole. , The original pattern button and the pre-formed/4' tongue on the object to be illuminated are superimposed via a projection lens, and the original pattern pattern is exposed. A lens projection exposure method characterized by transferring. (2) In a device that exposes and transfers the No9tan on the original substrate through a projection lens onto an exposed object coated with a photosensitive agent, the original I4tan on the original substrate and the already formed button on the exposed object are used. In addition to the alignment mechanism for relative overlay with the original substrate, the projection lens, and the mutual spacing between the exposed object. The apparatus is characterized by being provided with a mechanism that adjusts the relative inclination angle to correct the projected exposure image of the original pattern to a size and shape that allows it to overlap the already formed pattern on the corresponding exposure object in a desired relationship. Lens projection exposure equipment. (3) Relative position detection device for detecting the difference in corresponding dimensions and relative shape distortion between the original pattern board and the pre-formed pattern on the exposed object with the original pattern board and the exposed object mounted on the device. A lens projection exposure apparatus according to claim 2, further comprising: a lens projection exposure apparatus according to claim 2; (4) Mutual spacing between the original substrate, the projection lens, and the exposed object;
To adjust the relative tilt angle, fix the projection lens and adjust the position of the original substrate and the exposed object. 3. A lens projection exposure apparatus according to claim 2, wherein the inclination angle can be adjusted and controlled. (5) A relative position detection device that detects the difference in corresponding dimensions and relative shape distortion between the original pattern/button and the pre-formed button on the exposed object when the original pattern substrate and the exposed object are attached to the device, and the original substrate. , a lens according to claim 2, characterized in that each of the exposure objects is provided with a device for adjusting the distance from the projection lens, and the original substrate is provided with a device for adjusting the inclination angle with respect to the projection lens. Projection exposure equipment. (6) A relative position detection device that detects the difference in corresponding dimensions and relative shape distortion between the original pattern/9 tongue and the pre-formed button on the exposed object with the original pattern board and the exposed object mounted on the device, and the original pattern substrate. 3. The lens projection exposure apparatus according to claim 2, wherein each of the objects to be exposed is provided with a device for adjusting the distance from the projection lens and the angle of inclination with respect to the projection lens.